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    • 9. 发明申请
    • Method of fabricating flexible micro-capacitive ultrasonic transducer by the use of imprinting and transfer printing techniques
    • 通过使用压印和转印技术制造柔性微电容超声换能器的方法
    • US20070092982A1
    • 2007-04-26
    • US11269719
    • 2005-11-09
    • Chin-Chung Nien
    • Chin-Chung Nien
    • H01L21/00
    • B06B1/0292
    • A method of fabricating flexible micro-capacitive ultrasonic transducer by the use of imprinting and transfer printing techniques is disclosed, which mainly comprises the steps of: forming oscillation cavities by imprinting; forming fixed electrodes by transfer printing; forming oscillation films by transfer printing; forming driving electrodes by transfer printing; and so on. In detail, the method of the invention first forming arrays of oscillation cavities and fixed electrodes on a polymer-based substrate simultaneously by the use of a patterned imprint mold having fixed electrodes of transfer printing attached thereon, and then, using the imprint mold coated with a specific material of oscillation film to form the same on the imprinted substrate corresponding to the array of oscillation cavities by transfer printing, and thereafter, using the imprint mold having patterned array of driving electrodes attached thereon to form a layer of driving electrodes on the oscillation film corresponding to the array of fixed electrodes by transfer printing; wherein each driving electrode is connected to interconnects before being patterned and attached on the imprint mold so that the driving electrodes and the interconnects corresponding thereto can be formed on the oscillation film by transfer printing simultaneously. In a preferred embodiment, via holes are formed on the polymer-based substrate at positions corresponding to that of the fixed electrodes in advance so that, at a later step, interconnects for fixed electrodes can be formed by performing a metal depositing method upon the back of the substrate masked by a mask with interconnect patterns.
    • 公开了一种通过使用压印技术制造柔性微电容式超声换能器的方法,其主要包括以下步骤:通过压印形成振荡腔; 通过转印形成固定电极; 通过转印形成振荡膜; 通过转印形成驱动电极; 等等。 详细地说,本发明的方法首先在聚合物基底上同时形成振荡腔阵列和固定电极,同时通过使用附着有固定电极的图案印记模具,然后使用涂覆有 通过转印印刷在振动腔阵列上对应于压印基板上形成振动膜的特定材料,然后使用附着有驱动电极图案阵列的压印模具,形成振荡层上的驱动电极 通过转印印刷对应于固定电极阵列的胶片; 其中每个驱动电极在图案化之前连接到互连件并附着在压印模具上,使得驱动电极及其对应的互连可以通过转印同时形成在振动膜上。 在优选实施例中,预先在聚合物基底上形成与固定电极对应的位置处的通孔,以便在稍后的步骤中,可以通过在后面执行金属沉积方法来形成用于固定电极的互连 由具有互连图案的掩模掩蔽的基板。