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    • 1. 发明申请
    • UNCOOLED INFRARED IMAGING DEVICE
    • 未经处理的红外成像装置
    • US20130248714A1
    • 2013-09-26
    • US13728009
    • 2012-12-27
    • Hiroto HondaKazuhiro SuzukiHideyuki FunakiMasaki AtsutaKeita SasakiKoichi IshiiHonam Kwon
    • Hiroto HondaKazuhiro SuzukiHideyuki FunakiMasaki AtsutaKeita SasakiKoichi IshiiHonam Kwon
    • H01L27/146G01J5/20
    • G01J5/12G01J5/023G01J5/20G01J5/22G01J2005/0077H01L27/14649H04N5/33
    • An uncooled infrared imaging device according to an embodiment includes: reference pixels formed on a semiconductor substrate and arranged in at least one row; and infrared detection pixels arranged in the remaining rows and detecting incident infrared rays. Each of the reference pixels includes a first cell located above a first concave portion. The first cell includes a first thermoelectric conversion unit having a first infrared absorption film; and a first thermoelectric conversion element. Each of the infrared detection pixels includes a second cell located above a second concave portion, and having a larger area than the first cell. The second cell includes: a second thermoelectric converting unit located above the second concave portion; and first and second supporting structure units supporting the second thermoelectric converting unit above the second concave portion. The second thermoelectric converting unit includes: a second infrared absorption film; and a second thermoelectric conversion element.
    • 根据实施例的非冷却红外成像装置包括:形成在半导体衬底上并布置在至少一行中的参考像素; 以及布置在其余行中的红外检测像素,并检测入射的红外线。 每个参考像素包括位于第一凹部上方的第一单元。 第一电池包括具有第一红外线吸收膜的第一热电转换单元; 和第一热电转换元件。 每个红外检测像素包括位于第二凹部上方的第二单元,并且具有比第一单元更大的面积。 第二单元包括:位于第二凹部上方的第二热电转换单元; 以及第一和第二支撑结构单元,其在第二凹部上方支撑第二热电转换单元。 第二热电转换单元包括:第二红外线吸收膜; 和第二热电转换元件。
    • 2. 发明授权
    • Infrared detection device
    • 红外线检测装置
    • US08541861B2
    • 2013-09-24
    • US13069610
    • 2011-03-23
    • Masaki AtsutaHideyuki FunakiKeita Sasaki
    • Masaki AtsutaHideyuki FunakiKeita Sasaki
    • H01L31/058
    • G01J5/10G01J5/02G01J5/0225G01J5/023G01J5/024G01J5/08G01J5/0853G01J5/20
    • According to one embodiment, an infrared detection device includes a detection element. The detection element includes a semiconductor substrate, a signal interconnect section, a detection cell and a support section. The semiconductor substrate is provided with a cavity on a surface of the semiconductor substrate. The signal interconnect section is provided in a region surrounding the cavity of the semiconductor substrate. The detection cell spaced from the semiconductor substrate above the cavity includes a thermoelectric conversion layer, and an absorption layer. The absorption layer is laminated with the thermoelectric conversion layer, and provided with a plurality of holes each having a shape whose upper portion is widened. The support section holds the detection cell above the cavity and connects the signal interconnect section and the detection cell.
    • 根据一个实施例,红外检测装置包括检测元件。 检测元件包括半导体衬底,信号互连部分,检测单元和支撑部分。 半导体衬底在半导体衬底的表面上设置有空腔。 信号互连部分设置在围绕半导体衬底的空腔的区域中。 与空腔上方的半导体衬底间隔开的检测单元包括热电转换层和吸收层。 吸收层与热电转换层层叠,并且设置有多个孔,每个孔具有上部加宽的形状。 支撑部分将检测单元保持在空腔上方并连接信号互连部分和检测单元。
    • 5. 发明申请
    • INFRARED DETECTION DEVICE
    • 红外检测装置
    • US20120061791A1
    • 2012-03-15
    • US13069610
    • 2011-03-23
    • Masaki AtsutaHideyuki FunakiKeita Sasaki
    • Masaki AtsutaHideyuki FunakiKeita Sasaki
    • H01L29/66
    • G01J5/10G01J5/02G01J5/0225G01J5/023G01J5/024G01J5/08G01J5/0853G01J5/20
    • According to one embodiment, an infrared detection device includes a detection element. The detection element includes a semiconductor substrate, a signal interconnect section, a detection cell and a support section. The semiconductor substrate is provided with a cavity on a surface of the semiconductor substrate. The signal interconnect section is provided in a region surrounding the cavity of the semiconductor substrate. The detection cell spaced from the semiconductor substrate above the cavity includes a thermoelectric conversion layer, and an absorption layer. The absorption layer is laminated with the thermoelectric conversion layer, and provided with a plurality of holes each having a shape whose upper portion is widened. The support section holds the detection cell above the cavity and connects the signal interconnect section and the detection cell.
    • 根据一个实施例,红外检测装置包括检测元件。 检测元件包括半导体衬底,信号互连部分,检测单元和支撑部分。 半导体衬底在半导体衬底的表面上设置有空腔。 信号互连部分设置在围绕半导体衬底的空腔的区域中。 与空腔上方的半导体衬底间隔开的检测单元包括热电转换层和吸收层。 吸收层与热电转换层层叠,并且设置有多个孔,每个孔具有上部加宽的形状。 支撑部分将检测单元保持在空腔上方并连接信号互连部分和检测单元。
    • 6. 发明申请
    • INFRARED SOLID STATE IMAGING DEVICE
    • 红外固态成像装置
    • US20130093902A1
    • 2013-04-18
    • US13648376
    • 2012-10-10
    • Hiroto HONDAHideyuki FunakiKeita SasakiKazuhiro SuzukiMasaki AtsutaKoichi IshiiIkuo Fujiwara
    • Hiroto HONDAHideyuki FunakiKeita SasakiKazuhiro SuzukiMasaki AtsutaKoichi IshiiIkuo Fujiwara
    • H04N5/33
    • H04N5/33H04N5/3597
    • An infrared solid state imaging device includes an infrared detection element unit having heat sensitive pixels, an AD conversion unit which conducts analog-to-digital conversion on an infrared image signal obtained by the infrared detection element unit, and a digital signal processing unit which converts the image signal converted to a digital signal. The digital signal processing unit stores an image value produced from the digital signal, and acquired in a frame immediately preceding a current frame, subtracts an image value obtained by multiplying the image value acquired in the frame immediately preceding the current frame by a predetermined constant α in a range of 0 to 1, from an image value acquired in the current frame, and conducts processing of multiplying a resultant image value obtained by the subtraction by 1/(1−α) so that an infrared image with less afterimage is provided.
    • 一种红外固体摄像装置,具备:具有热敏像素的红外线检测元件单元,对由红外线检测元件单元得到的红外图像信号进行模数变换的AD转换单元;以及数字信号处理单元, 图像信号转换成数字信号。 数字信号处理单元存储从数字信号产生并且在紧邻当前帧之前的帧中获取的图像值,减去通过将在当前帧之前的帧中获取的图像值乘以预定常数α而获得的图像值 在从当前帧中获取的图像值的0到1的范围内,并且进行将通过减法获得的合成图像值乘以1 /(1-α)的处理,使得提供具有较少余像的红外图像。
    • 7. 发明授权
    • Uncooled infrared image sensor
    • 未冷却的红外图像传感器
    • US08338902B2
    • 2012-12-25
    • US13050512
    • 2011-03-17
    • Honam KwonHideyuki FunakiHiroto HondaHitoshi YagiIkuo FujiwaraMasaki AtsutaKazuhiro SuzukiKeita SasakiKoichi Ishii
    • Honam KwonHideyuki FunakiHiroto HondaHitoshi YagiIkuo FujiwaraMasaki AtsutaKazuhiro SuzukiKeita SasakiKoichi Ishii
    • H01L31/024
    • H01L27/14649G01J5/007G01J5/20G01J2005/068
    • An uncooled infrared image sensor according to an embodiments includes: a plurality of pixel cells formed in a first region on a semiconductor substrate; a reference pixel cell formed in a second region on the semiconductor substrate and corresponding to each row or each column of the pixel cells; a supporting unit formed for each of the pixel cell and supporting a corresponding pixel cell; and an interconnect unit formed for each reference pixel cell. Each of the pixel cells includes: a first infrared absorption film and a first heat sensitive element. The reference pixel cell includes: a second infrared absorption film and a second heat sensitive element, the second heat sensitive element having the same characteristics as characteristics of the first heat sensitive element. The third and fourth interconnects of the interconnect unit have the same electrical resistance as electrical resistance of the first and second interconnects of the supporting unit.
    • 根据实施例的非制冷红外图像传感器包括:形成在半导体衬底上的第一区域中的多个像素单元; 形成在所述半导体衬底上的与所述像素单元的每列或每列相对应的所述半导体衬底上的第二区域中的参考像素单元; 为每个像素单元形成的支撑单元,并支撑相应的像素单元; 以及为每个参考像素单元形成的互连单元。 每个像素单元包括:第一红外线吸收膜和第一热敏元件。 参考像素单元包括:第二红外线吸收膜和第二热敏元件,第二热敏元件具有与第一热敏元件的特性相同的特性。 互连单元的第三和第四互连具有与支撑单元的第一和第二互连的电阻相同的电阻。