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    • 2. 发明授权
    • Mechanically stacked photovoltaic cells, package assembly, and modules
    • 机械堆叠的光伏电池,封装组件和模块
    • US4746371A
    • 1988-05-24
    • US944402
    • 1986-12-18
    • Paul S. McLeodJohn A. CapeLewis M. FraasLarry D. Partain
    • Paul S. McLeodJohn A. CapeLewis M. FraasLarry D. Partain
    • H01L25/04H01L31/02H01L31/0203H01L31/052H01L31/06H01L25/08
    • H01L31/0203H01L31/02005H01L31/043H01L31/052H01L2924/0002Y02E10/50
    • The present invention is an apparatus of mechanically stacked photovoltaic cells having a bottom heat spreader and a top heat spreader, a bottom photovoltaic cell and a top photovoltaic cell, and means for forming the necessary electrical contacts. The heat spreaders are electrically insulated from each other but are thermally connected to each other. The bottom photovoltaic cell has an anode and a cathode and is thermally bonded to the bottom heat spreader and is thermally connected to the top heat spreader. The top photovoltaic cell has an anode and a cathode, is electrically insulated from the bottom photovoltaic cell, and is thermally bonded to the top heat spreader and is thermally connected to the bottom heat spreader. The means for forming the necessary electrical contacts includes a means for electrically contacting the anode of the bottom photovoltaic cell, a means for electrically contacting the cathode of the bottom photovoltaic cell, a means for electrically contacting the anode of the top photovoltaic cell, and a means for electrically contacting the cathode of the top photovoltaic cell.
    • 本发明是具有底部散热器和顶部散热器,底部光伏电池和顶部光伏电池的机械堆叠的光伏电池的装置,以及用于形成所需电接触的装置。 散热器彼此电绝缘,但彼此热连接。 底部光伏电池具有阳极和阴极,并且热粘合到底部散热器并与顶部散热器热连接。 顶部光伏电池具有阳极和阴极,与底部光伏电池电绝缘,并且热粘合到顶部散热器并热连接到底部散热器。 用于形成必要的电触点的装置包括用于电接触底部光伏电池的阳极的装置,用于电接触底部光伏电池的阴极的装置,用于电接触顶部光伏电池的阳极的装置和 用于电接触顶部光伏电池的阴极的装置。
    • 4. 发明授权
    • Apparatus and process for vacuum chemical epitaxy
    • 真空化学外延的设备和工艺
    • US4838201A
    • 1989-06-13
    • US941005
    • 1986-12-12
    • Lewis M. FraasPaul S. McLeodJohn A. Cape
    • Lewis M. FraasPaul S. McLeodJohn A. Cape
    • C30B25/02C30B25/14H01L21/205H01L21/338
    • C30B25/02C30B25/14C30B29/40H01L29/66848
    • A vacuum chemical epitaxy apparatus comprising a first mixing chamber having an inlet for introducing a metal-organic gaseous materials and n-type and p-type dopants, and a plurality of outlets for directing the flow of said metal-organic gases and n-type and p-type dopants toward a substrate; a second mixing chamber disposed below said first chamber having an inlet for introducing a metal-organic gaseous material and n-type and p-type dopants, and a plurality of passages through said first chamber and an outlet for each passage, wherein the passage outlets are in substantially the same plane with the outlets of the first chamber; and means for exhausting the metal-organic gaseous materials and n-type and p-type dopants from the second chamber.
    • 一种真空化学外延装置,包括具有用于引入金属 - 有机气体材料和n型和p型掺杂剂的入口的第一混合室,以及用于引导所述金属 - 有机气体流动的多个出口和n型 和p型掺杂剂朝向衬底; 设置在所述第一室下方的第二混合室具有用于引入金属有机气体材料和n型和p型掺杂剂的入口,以及通过所述第一室的多个通道和用于每个通道的出口,其中所述通道出口 与第一室的出口处于大致相同的平面; 以及用于从第二室排出金属有机气体材料和n型和p型掺杂剂的装置。
    • 5. 发明授权
    • Process for vacuum chemical epitaxy
    • 真空化学外延工艺
    • US4829021A
    • 1989-05-09
    • US130582
    • 1987-12-09
    • Lewis M. FraasPaul S. McLeodJohn A. Cape
    • Lewis M. FraasPaul S. McLeodJohn A. Cape
    • C30B25/02C30B25/14H01L21/205
    • C30B25/02C30B25/14C30B29/40H01L21/02395H01L21/02463H01L21/02546H01L21/02576H01L21/0262Y10S148/057Y10S148/065Y10S148/11Y10S148/169
    • An injection block having a plurality of geometrically arranged injection sources for gaseous Group III metal organic compounds is oriented substantially perpendicular to the placement of at least one semiconductor wafer substrate within a vacuum reaction chamber. The injector sources are sized to provide disbursing flow of the compounds capable of depositing a layer of about 5% uniform thickness or less over substantially the entire semiconductor wafer. An injection source of Group V compounds is located centrally within the geometrically arranged injection sources for the Group III compounds. The Group V injection source is sized to supply an excess of the Group V compounds required to react with the Group III compounds in order to form Group III-V semiconductor layers on the substrate and partition the Group III sources into groups having substantially equal numbers of injection sources. An excess of Group V comounds is injected. The vacuum within the reaction chamber is adjusted at predetermined flow rates of the Group III compounds such that a mean-free path of the Group III compounds is greater than the distance from the injection source of the Group III compounds to the substrate. The substrate is heated to a temperature to which a reaction proceeds. The unreacted Group III compounds are exhausted from the vacuum chamber adjacent the edges of a substrate holder facing the top of the chamber opposite to the injection sources. In this manner, the disbursing flow of Group III compounds from the geometric arrangement of sources uniformly overlaps substantially the entire substrate and the algebraic sum of the fluxes from the Group III compound sources remains constant across the area of the substrate upon which the layer is to be deposited.
    • 具有用于气态III族金属有机化合物的多个几何排列的注入源的注入块基本上垂直于至少一个半导体晶片衬底在真空反应室内的放置。 喷射器源的尺寸设置成提供能够在基本上整个半导体晶片上沉积约5%均匀厚度或更小厚度的层的化合物的散发流。 第V族化合物的注入源位于第III族化合物的几何排列的注入源的中心。 V族注入源的大小适于提供与III族化合物反应所需的过量的V族化合物,以便在基材上形成III-V族半导体层,并将III族源分成具有基本相同数目的 注射源。 注入超过V组。 在III族化合物的预定流速下调节反应室内的真空度,使得III族化合物的平均自由程大于从III族化合物的注入源到底物的距离。 将基底加热到反应进行的温度。 未反应的III族化合物从邻近位于与注入源相对的腔室顶部的衬底保持器的边缘的真空室中排出。 以这种方式,来自源的几何排列的III族化合物的释放流动基本上与整个基底重叠,并且来自III族化合物源的通量的代数和在层之间的基底区域保持恒定 存放
    • 6. 发明授权
    • Multiple electron-beam vapor source assembly
    • 多电子束蒸汽源组件
    • US4131753A
    • 1978-12-26
    • US797965
    • 1977-05-18
    • Kazumi N. TsujimotoPaul S. McLeod
    • Kazumi N. TsujimotoPaul S. McLeod
    • C23C14/30H01J37/305
    • H01J37/3053
    • Disclosed is a vapor source assembly comprising a means for supporting at least one material to be vaporized, a plurality of electron-beam guns for producing electron beams, and a deflecting means for producing a magnetic field to deflect each electron beam through an arcuate path from its electron-beam gun to the material to be vaporized. The deflecting means includes a plurality of pairs of pole pieces positioned such that a north pole piece and a south pole piece, are on opposite sides of each electron-beam gun, and a plurality of magnetic means including magnets for interconnecting the south pole piece of each successive electron-beam gun with the north pole piece of the next successive electron-beam gun so as to form a single magnetic circuit. In preferred embodiments, the electron-beam guns are positioned below the maximum level of material in a cluster of crucibles, and two long pole pieces extend on opposite sides of the crucibles, but no pole piece extends between adjacent crucibles. A magnetic means for sweeping the electron beams may also be included.
    • 公开了一种蒸汽源组件,其包括用于支撑至少一种待蒸发的材料的装置,用于产生电子束的多个电子束枪,以及用于产生磁场以使每个电子束通过弧形路径偏转的偏转装置 其电子束枪将被蒸发的材料。 偏转装置包括多个极片对,定位成使得北极片和南极片位于每个电子束枪的相对侧上,以及多个磁性装置,包括磁体,用于将南极片 每个连续的电子束枪与下一个连续的电子束枪的北极片形成单个磁路。 在优选实施例中,电子束枪被定位在坩埚簇中的最大材料水平之下,并且两个长极片在坩埚的相对侧上延伸,但是在相邻的坩埚之间没有极片延伸。 也可以包括用于扫描电子束的磁性装置。
    • 8. 发明申请
    • Magnetron sputtering utilizing halbach magnet arrays
    • 使用Halbach磁体阵列的磁控管溅射
    • US20080121515A1
    • 2008-05-29
    • US11604326
    • 2006-11-27
    • Paul S. McLeod
    • Paul S. McLeod
    • C23C14/35
    • C23C14/35H01J37/3405H01J37/3452
    • A magnetron sputtering target assembly, comprises a target adapted to comprise of at least one material to be sputtered, the target including a pair of oppositely facing surfaces; and a magnet assembly comprising a plurality of Halbach magnet arrays adjacent one of the surfaces for providing magnetic field lines which emerge from and re-enter the other of the surfaces to form an arched, closed-loop magnetic field path over the other surface. The enhanced magnetic flux intensity provided by the Halbach magnet assemblies, relative to conventional magnetron magnet assemblies, facilitates sputtering of thick targets comprised of magnetic materials in the manufacture of recording media, as well as low pressure sputtering of high quality carbon-containing protective overcoat materials for such media.
    • 磁控溅射靶组件包括适于包括至少一种待溅射材料的靶,所述靶包括一对相对面的表面; 以及磁体组件,其包括邻近所述表面中的一个的多个Halbach磁体阵列,用于提供从另一个表面出来并重新进入另一个表面的磁场线,以在另一个表面上形成拱形的闭环磁场路径。 相对于传统的磁控管磁体组件,由Halbach磁体组件提供的增强的磁通强度有助于在制造记录介质时溅射由磁性材料构成的厚靶,以及高质量含碳保护外套材料的低压溅射 为这样的媒体。