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    • 2. 发明申请
    • METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTABLES USING AN OPTIMIZED SAMPLING SCHEME WITH SMART INTERPOLATION
    • 使用优化采样方案与智能插值提供过程工具可修正性的方法和系统
    • US20110202298A1
    • 2011-08-18
    • US13018729
    • 2011-02-01
    • Pavel IziksonJohn RobinsonDaniel Kandel
    • Pavel IziksonJohn RobinsonDaniel Kandel
    • G06F19/00
    • H01L22/20H01L2924/0002H01L2924/00
    • The present invention may include performing a first measurement on a wafer of a first lot of wafers via an omniscient sampling process, calculating a first set of process tool correctables utilizing one or more results of the measurement performed via an omniscient sampling process, randomly selecting a set of field sampling locations of the wafer of a first lot of wafers, calculating a second set of process tool correctables by applying an interpolation process to the randomly selected set of field sampling locations, wherein the interpolation process utilizes values from the first set of process tool correctables for the randomly selected set of field sampling locations in order to calculate correctables for fields of the wafer of the first lot not included in the set of randomly selected fields, and determining a sub-sampling scheme by comparing the first set of process tool correctables to the second set of correctables.
    • 本发明可以包括通过无所不在的采样过程对第一批晶片的晶片进行第一次测量,利用通过无所不在的采样过程执行的一个或多个测量结果来计算第一组处理工具校正值,随机选择 第一批晶片的晶片的一组场采样位置,通过对随机选择的一组场采样位置应用内插处理来计算第二组处理工具可校正值,其中所述内插处理利用来自第一组处理的值 用于随机选择的一组场采样位置的工具可校正,以便计算不包括在随机选择的场的集合中的第一批的晶片的场的可校正性,以及通过比较第一组处理工具来确定子采样方案 可纠正到第二组可纠正的。