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1. 发明申请

US20050099758A1 METHOD OF MAKING A MEMS ELECTROSTATIC CHUCK 失效
标题翻译：制造MEMS静电卡盘的方法
公开(公告)号：US20050099758A1
公开(公告)日：2005-05-12
申请号：US10695153
申请日：2003-10-28
申请人： Peter Kellerman , Shu Qin , Ernie Allen , Douglas Brown
发明人： Peter Kellerman , Shu Qin , Ernie Allen , Douglas Brown
IPC分类号： H01L21/683 , H02B1/00
CPC分类号： H01L21/6833
摘要： The present invention is directed to a method of forming a clamping plate for a multi-polar electrostatic chuck. The method comprises forming a first electrically conductive layer over a semiconductor platform and defining a plurality of portions of the first electrically conductive layer which are electrically isolated from one another. A first electrically insulative layer is formed over the first electrically conductive layer, the first electrically insulative layer comprising a top surface having a plurality of MEMS protrusions extending a first distance therefrom. A plurality of poles are furthermore electrically connected to the respective plurality of portions of the first electrically conductive layer, wherein a voltage applied between the plurality of poles is operable to induce an electrostatic force in the clamping plate.
摘要翻译：本发明涉及一种形成多极静电卡盘夹紧板的方法。该方法包括在半导体平台上形成第一导电层，并且限定彼此电隔离的第一导电层的多个部分。第一电绝缘层形成在第一导电层之上，第一电绝缘层包括具有从其延伸第一距离的多个MEMS突起的顶表面。多个极还电连接到第一导电层的相应多个部分，其中施加在多个极之间的电压可操作以在夹持板中引起静电力。

2. 发明申请

US20050079737A1 MEMS BASED CONTACT CONDUCTIVITY ELECTROSTATIC CHUCK 失效
标题翻译：基于MEMS的接触电导率静电卡盘
公开(公告)号：US20050079737A1
公开(公告)日：2005-04-14
申请号：US10683679
申请日：2003-10-10
申请人： Peter Kellerman , Shu Qin , Ernie Allen , Douglas Brown
发明人： Peter Kellerman , Shu Qin , Ernie Allen , Douglas Brown
IPC分类号： H01L21/683 , H01L21/66
CPC分类号： H01L21/6831 , Y10S438/964
摘要： The present invention is directed to a method for clamping and processing a semiconductor substrate using a semiconductor processing apparatus. According to one aspect of the present invention, a multi-polar electrostatic chuck and associated method is disclosed which provides heating or cooling of a substrate by thermal contact conduction between the electrostatic chuck and the substrate. The multi-polar electrostatic chuck includes a semiconductor platform having a plurality of protrusions that define gaps therebetween, wherein a surface roughness of the plurality of protrusions is less than 100 Angstroms. The electrostatic chuck further includes a voltage control system operable to control a voltage applied to the electrostatic chuck to thus control a contact heat transfer coefficient of the electrostatic chuck, wherein the heat transfer coefficient of the electrostatic chuck is primarily a function of a contact pressure between the substrate and the plurality of protrusions.
摘要翻译：本发明涉及使用半导体处理装置夹持和处理半导体衬底的方法。根据本发明的一个方面，公开了一种多极静电卡盘和相关方法，其通过静电卡盘和基板之间的热接触传导来提供加热或冷却基板。多极静电卡盘包括具有多个突起的半导体平台，所述突起在其间形成间隙，其中多个突起的表面粗糙度小于100埃。静电卡盘还包括电压控制系统，其可操作以控制施加到静电卡盘的电压，从而控制静电卡盘的接触传热系数，其中静电卡盘的传热系数主要是介于静电卡盘之间的接触压力的函数基板和多个突起。

3. 发明授权

US06946403B2 Method of making a MEMS electrostatic chuck 失效
标题翻译：制造MEMS静电卡盘的方法
公开(公告)号：US06946403B2
公开(公告)日：2005-09-20
申请号：US10695153
申请日：2003-10-28
申请人： Peter L. Kellerman , Shu Qin , Ernie Allen , Douglas A. Brown
发明人： Peter L. Kellerman , Shu Qin , Ernie Allen , Douglas A. Brown
IPC分类号： H01L21/683 , H01L21/469
CPC分类号： H01L21/6833
摘要： The present invention is directed to a method of forming a clamping plate for a multi-polar electrostatic chuck. The method comprises forming a first electrically conductive layer over a semiconductor platform and defining a plurality of portions of the first electrically conductive layer which are electrically isolated from one another. A first electrically insulative layer is formed over the first electrically conductive layer, the first electrically insulative layer comprising a top surface having a plurality of MEMS protrusions extending a first distance therefrom. A plurality of poles are furthermore electrically connected to the respective plurality of portions of the first electrically conductive layer, wherein a voltage applied between the plurality of poles is operable to induce an electrostatic force in the clamping plate.
摘要翻译：本发明涉及一种形成多极静电卡盘夹紧板的方法。该方法包括在半导体平台上形成第一导电层，并且限定彼此电隔离的第一导电层的多个部分。第一电绝缘层形成在第一导电层之上，第一电绝缘层包括具有从其延伸第一距离的多个MEMS突起的顶表面。多个极还电连接到第一导电层的相应多个部分，其中施加在多个极之间的电压可操作以在夹持板中引起静电力。

4. 发明授权

US06905984B2 MEMS based contact conductivity electrostatic chuck 失效
标题翻译：基于MEMS的接触导电静电卡盘
公开(公告)号：US06905984B2
公开(公告)日：2005-06-14
申请号：US10683679
申请日：2003-10-10
申请人： Peter L. Kellerman , Shu Qin , Ernie Allen , Douglas A. Brown
发明人： Peter L. Kellerman , Shu Qin , Ernie Allen , Douglas A. Brown
IPC分类号： H01L21/683 , H01L21/00
CPC分类号： H01L21/6831 , Y10S438/964
摘要： The present invention is directed to a method for clamping and processing a semiconductor substrate using a semiconductor processing apparatus. According to one aspect of the present invention, a multi-polar electrostatic chuck and associated method is disclosed which provides heating or cooling of a substrate by thermal contact conduction between the electrostatic chuck and the substrate. The multi-polar electrostatic chuck includes a semiconductor platform having a plurality of protrusions that define gaps therebetween, wherein a surface roughness of the plurality of protrusions is less than 100 Angstroms. The electrostatic chuck further includes a voltage control system operable to control a voltage applied to the electrostatic chuck to thus control a contact heat transfer coefficient of the electrostatic chuck, wherein the heat transfer coefficient of the electrostatic chuck is primarily a function of a contact pressure between the substrate and the plurality of protrusions.
摘要翻译：本发明涉及使用半导体处理装置夹持和处理半导体衬底的方法。根据本发明的一个方面，公开了一种多极静电卡盘和相关方法，其通过静电卡盘和基板之间的热接触传导来提供加热或冷却基板。多极静电卡盘包括具有多个突起的半导体平台，所述突起在其间形成间隙，其中多个突起的表面粗糙度小于100埃。静电卡盘还包括电压控制系统，其可操作以控制施加到静电卡盘的电压，从而控制静电卡盘的接触传热系数，其中静电卡盘的传热系数主要是介于静电卡盘之间的接触压力的函数基板和多个突起。

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