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1. 发明授权

US08760582B2 Method for selecting an input media source 有权
标题翻译：选择输入媒体源的方法
公开(公告)号：US08760582B2
公开(公告)日：2014-06-24
申请号：US11703304
申请日：2007-02-06
申请人： Peter Shintani , Eiji Kono
发明人： Peter Shintani , Eiji Kono
IPC分类号： H04N5/268
CPC分类号： H04N5/44 , H03K17/002 , H04N5/44513 , H04N7/163 , H04N21/436 , H04N21/43615 , H04N21/44231 , H04N21/4622 , H04N2005/44517
摘要： System and method for changing a current input terminal of a user device. In one embodiment of the invention, a method includes receiving an input terminal change request, requesting that a current input terminal be changed from a first input terminal to a second input terminal. The method may further include determining if an external device is connected to the second input terminal. In one embodiment of the invention, the second input terminal includes a connection detection switch. The method may also include switching to the second input terminal when the connection detection switch indicates an external device connection and skipping the second input terminal when the connection detection switch indicates no external device connected according to one embodiment of the invention.
摘要翻译：用于改变用户设备的当前输入终端的系统和方法。在本发明的一个实施例中，一种方法包括接收输入终端改变请求，请求将当前输入端从第一输入端改变为第二输入端。该方法还可以包括确定外部设备是否连接到第二输入终端。在本发明的一个实施例中，第二输入端包括连接检测开关。当连接检测开关指示外部设备连接并且当根据本发明的一个实施例连接检测开关不指示外部设备连接时，跳过第二输入端子时，该方法还可以包括切换到第二输入端子。

2. 发明申请

US20080186078A1 Method for selecting an input media source 有权
标题翻译：选择输入媒体源的方法
公开(公告)号：US20080186078A1
公开(公告)日：2008-08-07
申请号：US11703304
申请日：2007-02-06
申请人： Peter Shintani , Eiji Kono
发明人： Peter Shintani , Eiji Kono
IPC分类号： H03K17/00
CPC分类号： H04N5/44 , H03K17/002 , H04N5/44513 , H04N7/163 , H04N21/436 , H04N21/43615 , H04N21/44231 , H04N21/4622 , H04N2005/44517
摘要： System and method for changing a current input terminal of a user device. In one embodiment of the invention, a method includes receiving an input terminal change request, requesting that a current input terminal be changed from a first input terminal to a second input terminal. The method may further include determining if an external device is connected to the second input terminal. In one embodiment of the invention, the second input terminal includes a connection detection switch. The method may also include switching to the second input terminal when the connection detection switch indicates an external device connection and skipping the second input terminal when the connection detection switch indicates no external device connected according to one embodiment of the invention.
摘要翻译：用于改变用户设备的当前输入终端的系统和方法。在本发明的一个实施例中，一种方法包括接收输入终端改变请求，请求将当前输入端从第一输入端改变为第二输入端。该方法还可以包括确定外部设备是否连接到第二输入终端。在本发明的一个实施例中，第二输入端包括连接检测开关。当连接检测开关指示外部设备连接并且当根据本发明的一个实施例连接检测开关不指示外部设备连接时，跳过第二输入端子时，该方法还可以包括切换到第二输入端子。

3. 发明申请

US20050007040A1 Active landing control system for raster based devices 失效
公开(公告)号：US20050007040A1
公开(公告)日：2005-01-13
申请号：US10616669
申请日：2003-07-10
申请人： Peter Shintani , Ban Kawamura , Eiji Kono
发明人： Peter Shintani , Ban Kawamura , Eiji Kono
IPC分类号： H01J29/38 , H01J29/70 , H01J29/76 , H04N3/233
CPC分类号： H01J29/705 , H01J2229/5688 , H04N3/2335
摘要： Correction of electron beam landing misalignment in a raster-type display is undertaken without using the usual set of coils, but rather by superimposing a landing misalignment correction signal on the already-existing velocity modulation (VM) coil or on another coil located at the junction of the electron beams in the neck of the display. The correction signal may be varied based on pressure, temperature, and ambient magnetic field as indicated by respective sensors to appropriately correct electron beam landing on phosphors the positions of which may be affected by variations in magnetic fields, temperature, and pressure.

4. 发明授权

US07323255B2 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate 失效
标题翻译：基板电路板的制造方法，电路基板，基板的电路基板的制造方法
公开(公告)号：US07323255B2
公开(公告)日：2008-01-29
申请号：US11185633
申请日：2005-07-19
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
IPC分类号： B32B15/00 , H01L23/06 , H05K1/00 , H05K7/20
CPC分类号： H05K1/05 , H01L21/4871 , H01L23/3735 , H01L2224/32225 , H05K2201/0209 , H05K2201/0355 , H05K2203/128 , Y10T428/12493 , Y10T428/12576 , Y10T428/24917 , Y10T428/31678
摘要： First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.
摘要翻译：首先，将含有Si的Al合金的熔体或含有Si的Al合金的熔体注入填充有SiC粉末的模具中并铸造以形成由Al / SiC复合材料制成的板构件。接着，将由Al-Mg系合金构成的铝箔构件通过热压与板构件的表面接合。结果，Al箔构件的一部分在板构件的表面上进入浇注气孔以填充铸造气孔。此外，在板构件的表面上形成Al-Mg基合金层。因此，制造具有接近平坦表面的基板。

5. 发明申请

US20060214295A1 Circuit board and manufacturing method thereof 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20060214295A1
公开(公告)日：2006-09-28
申请号：US11387228
申请日：2006-03-22
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Eiji Kono
IPC分类号： H01L23/48
CPC分类号： H05K1/056 , H01L2924/0002 , H05K1/053 , H05K2201/0175 , H05K2201/0179 , H05K2201/0209 , H05K2201/068 , H01L2924/00
摘要： A circuit board has a base plate, an insulating layer and a conductive circuit portion. The insulating layer is fixed to the base plate. The insulating layer includes a resin layer. The conductive circuit portion is fixed to the insulating layer on a side opposite to the base plate. The base plate and the conductive circuit portion have substantially the same coefficient of linear expansion and thickness.
摘要翻译：电路板具有基板，绝缘层和导电电路部分。绝缘层固定在基板上。绝缘层包括树脂层。导电电路部分在与基板相对的一侧固定在绝缘层上。基板和导电电路部分具有基本相同的线膨胀系数和厚度。

6. 发明申请

US20050250176A1 Microorganisms detecting device and method 审中-公开
标题翻译：微生物检测装置及方法
公开(公告)号：US20050250176A1
公开(公告)日：2005-11-10
申请号：US11115294
申请日：2005-04-27
申请人： Eiji Kono , Hironobu Sekine , Yasuhiko Yokoi , Akifumi Iwama
发明人： Eiji Kono , Hironobu Sekine , Yasuhiko Yokoi , Akifumi Iwama
IPC分类号： C12M1/34 , C12Q1/04 , C12Q1/68
CPC分类号： C12Q1/04
摘要： The present invention has an object to provide a simple detecting device and a simple detecting method, to shorten the time for detection, and to improve sensitivity of detection, particularly for gram negative bacteria. The microorganisms detecting device includes a sampling section for taking a sample from a detection target, a sample concentrating section for concentrating microorganisms in the sample, a reagent adding section for adding a reagent which changes the reagent color tone by existence of the microorganisms to the sample, and a microorganisms detecting section for detecting the change of the color tone of the regent by means of an optical system, thereby shortening the time for detection and improving the sensitivity of detection by concentrating the microorganisms in the sample.
摘要翻译：本发明的目的是提供简单的检测装置和简单的检测方法，缩短检测时间，提高检测灵敏度，特别是革兰氏阴性细菌。微生物检测装置包括：用于从检测对象取样的取样部，将样品中的微生物浓缩的样品浓缩部，向样品添加使微生物存在而使试剂色调变化的试剂的试剂添加部以及微生物检测部，用于通过光学系统检测摄氏度的色调变化，从而缩短检测时间，并通过将微生物浓缩在样品中来提高检测灵敏度。

7. 发明申请

US20050031889A1 Low-expansion unit, method of manufacturing the same and semiconductor provided with the same 失效
标题翻译：低膨胀单元，其制造方法和具有该膨胀单元的半导体装置
公开(公告)号：US20050031889A1
公开(公告)日：2005-02-10
申请号：US10655278
申请日：2003-09-03
申请人： Takashi Yoshida , Kyoichi Kinoshita , Katsufumi Tanaka , Tomohei Sugiyama , Hidehiro Kudo , Eiji Kono
发明人： Takashi Yoshida , Kyoichi Kinoshita , Katsufumi Tanaka , Tomohei Sugiyama , Hidehiro Kudo , Eiji Kono
IPC分类号： H01L23/373 , B32B15/18
CPC分类号： H01L23/3735 , H01L2924/0002 , Y10T428/12458 , Y10T428/12528 , Y10T428/12937 , Y10T428/12951 , Y10T428/12958 , H01L2924/00
摘要： A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.
摘要翻译：低膨胀单元包括板构件和铁镍层。板构件的上表面和下表面各自在其上和/或其中具有铁 - 镍层。虽然板构件具有相对较大的热膨胀系数，但是形成在板构件的上表面层和/或下表面层中的铁镍层具有相对较小的热膨胀系数。因此，低膨胀单元的热膨胀系数整体被抑制到相对较小的值。此外，板构件包括热导率相对较高的纯铁。同时，形成在板构件上的铁镍层相对较薄。因此，低膨胀单元在其厚度方向上具有相对较大的热导率。

8. 发明申请

US20050029658A1 Circuit board and semiconductor device using the same 审中-公开
标题翻译：电路板和半导体器件使用相同
公开(公告)号：US20050029658A1
公开(公告)日：2005-02-10
申请号：US10897688
申请日：2004-07-23
申请人： Tomohei Sugiyama , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Tomohei Sugiyama , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： H01L23/14 , H01L23/36 , H01L23/373 , H01L23/498 , H05K1/02 , H05K1/05 , H01L23/48
CPC分类号： H01L23/142 , H01L23/49894 , H01L2224/291 , H01L2224/32225 , H05K1/056 , H05K2201/068 , H01L2924/014
摘要： A base plate is made of a material that is lower in thermal expansion coefficient than a wiring layer, to thereby set the thermal expansion coefficient of a surface of the wiring layer lower than the thermal expansion coefficient of the material of the wiring layer. The thermal expansion coefficient of the surface of the wiring layer can be set to be suitable for a semiconductor element and other electronic parts mounted on the surface of the wiring layer, that is, set closer to the thermal expansion coefficient of the electronic parts by choosing a glass transition temperature Tg of an insulating resin layer appropriately.
摘要翻译：基板由布线层的热膨胀系数低的材料制成，从而将布线层的表面的热膨胀系数设定得比布线层的材料的热膨胀系数低。布线层的表面的热膨胀系数可以设定为适合于安装在布线层的表面上的半导体元件和其他电子部件，即通过选择更接近于电子部件的热膨胀系数绝缘树脂层的玻璃化转变温度Tg适当。

9. 发明授权

US08387685B2 Heat sink for power module 失效
标题翻译：电源模块散热片
公开(公告)号：US08387685B2
公开(公告)日：2013-03-05
申请号：US11919368
申请日：2006-04-19
申请人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人： Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号： F28F7/00 , F28F3/12
CPC分类号： H01L23/473 , F28F3/086 , F28F3/12 , H01L23/3731 , H01L23/3736 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.
摘要翻译：提供了能够实现进一步提高散热性能的功率模块的散热器，并且进一步提高了安装特性。用于功率模块的散热器1具有层叠体20，第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21，多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分面22对层叠方向的各平行流路50形成传热路径70a。在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a，26b接合主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂流路由流入路径30a，每个平行流路50和流出路径40a构成。

10. 发明授权

US08198539B2 Heat radiator and power module 失效
标题翻译：散热器和电源模块
公开(公告)号：US08198539B2
公开(公告)日：2012-06-12
申请号：US11994896
申请日：2006-07-05
申请人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
发明人： Kota Otoshi , Eiji Kono , Keiji Toh , Katsufumi Tanaka , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
IPC分类号： H05K1/00
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
摘要翻译：散热器1包括第一侧用作发热元件安装侧的绝缘基板3和固定到绝缘基板3的第二侧的散热片5.金属层7形成在第二侧绝缘基板3与发热元件安装侧相反。由高导热材料形成的应力松弛部件4介于绝缘基板3的金属层7和散热片5之间，并且包括板状体10和在一侧形成为间隔的多个突起11 板状体10的突起11的端面钎焊到金属层7，而没有形成突起11的板状体10的侧面钎焊到该散热器1的材料成本低，散热性能优异。

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