专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10047439B2 Method and system for tool condition monitoring based on a simulated inline measurement 有权
公开(公告)号：US10047439B2
公开(公告)日：2018-08-14
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , C23C16/52 , H01L21/66
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.

2. 发明授权

US09349660B2 Integrated circuit manufacturing tool condition monitoring system and method 有权
标题翻译：集成电路制造工具状态监测系统及方法
公开(公告)号：US09349660B2
公开(公告)日：2016-05-24
申请号：US13308644
申请日：2011-12-01
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , H01L21/66
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters.
摘要翻译：公开了一种用于监控集成电路制造系统的处理工具的系统和方法。示例性方法包括限定集成电路制造工艺工具的区域; 基于定义的区域对集成电路制造工艺工具进行分组参数; 并基于分组的参数来评估集成电路制造处理工具的状况。

3. 发明申请

US20130144419A1 INTEGRATED CIRCUIT MANUFACTURING TOOL CONDITION MONITORING SYSTEM AND METHOD 有权
标题翻译：集成电路制造工具条件监控系统及方法
公开(公告)号：US20130144419A1
公开(公告)日：2013-06-06
申请号：US13308644
申请日：2011-12-01
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters.
摘要翻译：公开了一种用于监控集成电路制造系统的处理工具的系统和方法。示例性方法包括限定集成电路制造工艺工具的区域; 基于定义的区域对集成电路制造工艺工具进行分组参数; 并基于分组的参数来评估集成电路制造处理工具的状况。

4. 发明申请

US20130150997A1 METHOD AND SYSTEM FOR TOOL CONDITION MONITORING 审中-公开
标题翻译：工具条件监测方法与系统
公开(公告)号：US20130150997A1
公开(公告)日：2013-06-13
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00
CPC分类号： C23C16/52 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
摘要翻译：公开了一种用于从刀具状态监测的在线测量数据中去除控制动作效果的方法和系统。一种示例性方法包括确定有助于在线测量的控制动作效果，其中在线测量指示由处理工具处理的晶片的晶片特性; 并且在没有控制动作效应贡献的情况下评估在线测量来确定过程工具的状况。

5. 发明授权

US08606387B2 Adaptive and automatic determination of system parameters 有权
标题翻译：自适应和自动确定系统参数
公开(公告)号：US08606387B2
公开(公告)日：2013-12-10
申请号：US13006571
申请日：2011-01-14
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou
IPC分类号： G06F19/00
CPC分类号： G05B13/0265 , G05B19/41875 , G05B2219/32188 , G05B2219/32189 , G05B2219/45031 , Y02P90/22 , Y02P90/86
摘要： A MIMO optimizer is used to identify tunable process parameters for processing equipment.
摘要翻译： MIMO优化器用于识别处理设备的可调工艺参数。

6. 发明授权

US08108060B2 System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture 有权
标题翻译：采用新颖的采样策略和架构实现晶片验收测试（“WAT”）高级过程控制（“APC”）的系统和方法
公开(公告)号：US08108060B2
公开(公告)日：2012-01-31
申请号：US12465064
申请日：2009-05-13
申请人： Andy Tsen , Jo Fei Wang , Po-Feng Tsai , Ming-Yu Fan , Jill Wang , Jong-I Mou , Sunny Wu
发明人： Andy Tsen , Jo Fei Wang , Po-Feng Tsai , Ming-Yu Fan , Jill Wang , Jong-I Mou , Sunny Wu
IPC分类号： G06F19/00 , G06F17/18 , G06F11/30 , G01N37/00
CPC分类号： G05B13/048 , G05B19/41875 , Y02P90/22 , Y02P90/86
摘要： System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.
摘要翻译：描述了实现晶片验收测试（“WAT”）高级过程控制（“APC”）的系统和方法。在一个实施例中，该方法包括对大量晶片的晶片的样本数进行密钥处理; 执行关键过程的关键在线测量以产生晶片的测量数据; 使用直线到WAT模型预测来自计量数据的WAT数据; 并且使用预测的WAT数据来调整用于控制调谐过程或过程APC过程的WAT APC过程。

7. 发明申请

US20100292824A1 SYSTEM AND METHOD FOR IMPLEMENTING A WAFER ACCEPTANCE TEST ("WAT") ADVANCED PROCESS CONTROL ("APC") WITH NOVEL SAMPLING POLICY AND ARCHITECTURE 有权
标题翻译：用新的采样政策和架构实施水轮接收测试（“WAT”）高级过程控制（“APC”）的系统和方法
公开(公告)号：US20100292824A1
公开(公告)日：2010-11-18
申请号：US12465064
申请日：2009-05-13
申请人： Andy Tsen , Jo Fei Wang , Po-Feng Tsai , Ming-Yu Fan , Jill Wang , Jong-I Mou , Sunny Wu
发明人： Andy Tsen , Jo Fei Wang , Po-Feng Tsai , Ming-Yu Fan , Jill Wang , Jong-I Mou , Sunny Wu
IPC分类号： G05B13/04
CPC分类号： G05B13/048 , G05B19/41875 , Y02P90/22 , Y02P90/86
摘要： System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.
摘要翻译：描述了实现晶片验收测试（“WAT”）高级过程控制（“APC”）的系统和方法。在一个实施例中，该方法包括对大量晶片的晶片的样本数进行密钥处理; 执行关键过程的关键在线测量以产生晶片的测量数据; 使用直线到WAT模型预测来自计量数据的WAT数据; 并且使用预测的WAT数据来调整用于控制调谐过程或过程APC过程的WAT APC过程。

8. 发明申请

US20130306621A1 REAL-TIME CALIBRATION FOR WAFER PROCESSING CHAMBER LAMP MODULES 有权
标题翻译：用于加工室内灯模块的实时校准
公开(公告)号：US20130306621A1
公开(公告)日：2013-11-21
申请号：US13471583
申请日：2012-05-15
申请人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： H05B1/02
CPC分类号： H01L22/26 , H01L21/324 , H01L21/67115 , H01L21/67248 , H05B1/0233
摘要： An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.
摘要翻译：公开了一种装置，系统和方法。示例性装置包括晶片处理室。该设备还包括设置在不同区域中的辐射加热元件，其可操作以加热位于晶片处理室内的晶片的不同部分。该装置还包括设置在晶片处理室外部的传感器，其可操作以监测来自设置在不同区域中的辐射加热元件的能量。该装置还包括计算机，其被配置为利用传感器来表征设置在不同区域中的辐射加热元件，并且为放置在不同区域中的辐射加热元件提供校准，使得基本上均匀的温度分布保持在晶圆。

9. 发明授权

US09159597B2 Real-time calibration for wafer processing chamber lamp modules 有权
标题翻译：晶圆处理室灯模块的实时校准
公开(公告)号：US09159597B2
公开(公告)日：2015-10-13
申请号：US13471583
申请日：2012-05-15
申请人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： F26B3/30 , F27B5/14 , C23C14/00 , C23C16/00 , H01L21/67 , H05B1/02
CPC分类号： H01L22/26 , H01L21/324 , H01L21/67115 , H01L21/67248 , H05B1/0233
摘要： An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.
摘要翻译：公开了一种装置，系统和方法。示例性装置包括晶片处理室。该设备还包括设置在不同区域中的辐射加热元件，其可操作以加热位于晶片处理室内的晶片的不同部分。该装置还包括设置在晶片处理室外部的传感器，其可操作以监测来自设置在不同区域中的辐射加热元件的能量。该装置还包括计算机，其被配置为利用传感器来表征设置在不同区域中的辐射加热元件，并且为放置在不同区域中的辐射加热元件提供校准，使得基本上均匀的温度分布保持在晶圆。

10. 发明申请

US20110042006A1 E-CHUCK WITH AUTOMATED CLAMPED FORCE ADJUSTMENT AND CALIBRATION 有权
标题翻译：具有自动钳位力调整和校准的电动自行车
公开(公告)号：US20110042006A1
公开(公告)日：2011-02-24
申请号：US12938610
申请日：2010-11-03
申请人： Jo Fei Wang , Sunny Wu , Jong-I Mou
发明人： Jo Fei Wang , Sunny Wu , Jong-I Mou
IPC分类号： H01L21/46 , G06F19/00 , H01L21/465
CPC分类号： H01L21/6831 , H01L22/20 , H01L2924/0002 , Y10S438/909 , H01L2924/00
摘要： The present disclosure describes a semiconductor manufacturing apparatus. The apparatus includes a processing chamber designed to perform a process to a wafer; an electrostatic chuck (E-chuck) configured in the processing chamber and designed to secure the wafer, wherein the E-chuck includes an electrode and a dielectric feature formed on the electrode; a tuning structure designed to hold the E-chuck to the processing chamber by clamping forces, wherein the tuning structure is operable to dynamically adjust the clamping forces; a sensor integrated with the E-chuck and sensitive to the clamping forces; and a process control module for controlling the tuning structure to adjust the clamping forces based on pre-measurement data from the wafer and sensor data from the sensor.
摘要翻译：本公开描述了一种半导体制造装置。该设备包括设计成对晶片执行处理的处理室; 配置在所述处理室中并设计成固定所述晶片的静电卡盘（E卡盘），其中所述E卡盘包括形成在所述电极上的电极和电介质特征; 调谐结构，其被设计成通过夹紧力将所述E卡盘保持在所述处理室中，其中所述调谐结构可操作以动态地调节所述夹紧力; 与E型卡盘集成并对夹紧力敏感的传感器; 以及过程控制模块，用于基于来自晶片的预测量数据和来自传感器的传感器数据来控制调谐结构以调整夹紧力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式