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1. 发明申请

US20140067324A1 QUALITATIVE FAULT DETECTION AND CLASSIFICATION SYSTEM FOR TOOL CONDITION MONITORING AND ASSOCIATED METHODS 有权
标题翻译：用于工具条件监测和相关方法的定性故障检测和分类系统
公开(公告)号：US20140067324A1
公开(公告)日：2014-03-06
申请号：US13603079
申请日：2012-09-04
申请人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F15/00
CPC分类号： G05B19/4065 , G05B2219/37252 , G05B2219/45031
摘要： The present disclosure provides various methods for tool condition monitoring, including systems for implementing such monitoring. An exemplary method includes receiving data associated with a process performed on wafers by an integrated circuit manufacturing process tool; and monitoring a condition of the integrated circuit manufacturing process tool using the data. The monitoring includes evaluating the data based on an abnormality identification criterion, an abnormality filtering criterion, and an abnormality threshold to determine whether the data meets an alarm threshold. The method may further include issuing an alarm when the data meets the alarm threshold.
摘要翻译：本公开提供了用于工具状态监测的各种方法，包括用于实现这种监视的系统。一种示例性方法包括：通过集成电路制造工艺工具接收与在晶片上执行的处理相关联的数据; 以及使用该数据来监视集成电路制造工艺工具的状态。监视包括基于异常识别标准，异常过滤标准和异常阈值来评估数据，以确定数据是否满足报警阈值。该方法还可以包括当数据满足报警阈值时发出报警。

2. 发明申请

US20130150997A1 METHOD AND SYSTEM FOR TOOL CONDITION MONITORING 审中-公开
标题翻译：工具条件监测方法与系统
公开(公告)号：US20130150997A1
公开(公告)日：2013-06-13
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00
CPC分类号： C23C16/52 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
摘要翻译：公开了一种用于从刀具状态监测的在线测量数据中去除控制动作效果的方法和系统。一种示例性方法包括确定有助于在线测量的控制动作效果，其中在线测量指示由处理工具处理的晶片的晶片特性; 并且在没有控制动作效应贡献的情况下评估在线测量来确定过程工具的状况。

3. 发明申请

US20130051023A1 Light Bar and Manufacturing Method Thereof 审中-公开
标题翻译：灯条及其制造方法
公开(公告)号：US20130051023A1
公开(公告)日：2013-02-28
申请号：US13553929
申请日：2012-07-20
申请人： Tzu-Chien Huang , Yu-Lun Tseng , Ting-Wei Fang , Jen-Yan Huang , Po-Feng Tsai
发明人： Tzu-Chien Huang , Yu-Lun Tseng , Ting-Wei Fang , Jen-Yan Huang , Po-Feng Tsai
IPC分类号： F21S4/00 , F21V17/06
CPC分类号： F21V17/06 , F21S4/28 , Y10T29/49117
摘要： A light bar includes a metal substrate, an electronic component, and a plurality of light source. The metal substrate has a folding line and an opening portion, wherein the folding line extends along a longer side of the metal substrate, and the opening portion connects an end of the folding line from a gap of a first edge of the metal substrate. The metal substrate is bent along the folding line, and a fastening portion and a bearing portion are formed on two sides of the folding line, wherein a circuit is formed on the bearing portion, the electronic component is disposed on the bearing portion and connects the circuit, and a gap is formed between the fastening portion and the electronic component. The light sources are disposed on the metal substrate, and the electronic component and the light sources are electrically coupled with the circuit.
摘要翻译：灯条包括金属基板，电子部件和多个光源。金属基板具有折叠线和开口部，折叠线沿着金属基板的长边延伸，开口部从金属基板的第一边缘的间隙连接折叠线的端部。金属基板沿折叠线弯曲，并且紧固部分和轴承部分形成在折叠线的两侧，其中电路形成在轴承部分上，电子部件设置在轴承部分上并连接并且在紧固部分和电子部件之间形成间隙。光源设置在金属基板上，电子部件和光源与电路电耦合。

4. 发明申请

US20110320026A1 SYSTEM AND METHOD FOR DATA MINING AND FEATURE TRACKING FOR FAB-WIDE PREDICTION AND CONTROL 有权
标题翻译：用于数据挖掘和特征跟踪的系统和方法，用于FAB-WIDE预测和控制
公开(公告)号：US20110320026A1
公开(公告)日：2011-12-29
申请号：US12823351
申请日：2010-06-25
申请人： Jui-Long Chen , Chia-Tong Ho , Po-Feng Tsai , Hui-Yun Chao , Jong-I Mou
发明人： Jui-Long Chen , Chia-Tong Ho , Po-Feng Tsai , Hui-Yun Chao , Jong-I Mou
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32191 , G05B2219/35082 , Y02P90/22 , Y02P90/265
摘要： System and method for data mining and feature tracking for fab-wide prediction and control are described. One embodiment is a system comprising a database for storing raw wafer manufacturing data; a data mining module for processing the raw wafer manufacturing data to select the best data therefrom in accordance with at least one of a plurality of knowledge-, statistic-, and effect-based processes; and a feature tracking module associated with the data mining module and comprising a self-learning model wherein a sensitivity of the self-learning model is dynamically tuned to meet real-time production circumstances, the feature tracking module receiving the selected data from the data mining module and generating prediction and control data therefrom; wherein the prediction and control data are used to control future processes in the wafer fabrication facility.
摘要翻译：描述了用于晶圆厂预测和控制的数据挖掘和特征跟踪的系统和方法。一个实施例是包括用于存储原始晶片制造数据的数据库的系统; 数据挖掘模块，用于根据多个基于知识，统计和效果的过程中的至少一个来处理原始晶片制造数据以从其中选择最佳数据; 以及与数据挖掘模块相关联并包括自学习模型的特征跟踪模块，其中自学习模型的灵敏度被动态调整以满足实时生产环境，特征跟踪模块从数据挖掘接收所选数据模块并从其生成预测和控制数据; 其中预测和控制数据用于控制晶片制造设备中的未来工艺。

5. 发明申请

US20110282885A1 Processing Exception Handling 有权
标题翻译：处理异常处理
公开(公告)号：US20110282885A1
公开(公告)日：2011-11-17
申请号：US12778855
申请日：2010-05-12
申请人： Po-Feng Tsai , Jin-Ning Sung , Yen-Di Tsen , Jo Fei Wang , Jong-I Mou
发明人： Po-Feng Tsai , Jin-Ning Sung , Yen-Di Tsen , Jo Fei Wang , Jong-I Mou
IPC分类号： G06F17/30
CPC分类号： G06F7/00 , G05B19/41865 , G05B2219/31352 , G05B2219/33303 , G06F17/30
摘要： In accordance with an embodiment, a method for exception handling comprises accessing an exception type for an exception, filtering historical data based on at least one defined criterion to provide a data train comprising data sets, assigning a weight to each data set, and providing a current control parameter. The data sets each comprise a historical condition and a historical control parameter, and the weight assigned to each data set is based on each historical condition. The current control parameter is provided using the weight and the historical control parameter for each data set.
摘要翻译：根据实施例，用于异常处理的方法包括访问异常的异常类型，基于至少一个定义的标准过滤历史数据，以提供包括数据集的数据队列，为每个数据集分配权重，以及提供电流控制参数。数据集各自包含历史条件和历史控制参数，并且分配给每个数据集的权重基于每个历史条件。使用每个数据集的权重和历史控制参数提供当前的控制参数。

6. 发明申请

US20110213478A1 SYSTEM AND METHOD FOR IMPLEMENTING MULTI-RESOLUTION ADVANCED PROCESS CONTROL 有权
标题翻译：用于实施多分辨率高级过程控制的系统和方法
公开(公告)号：US20110213478A1
公开(公告)日：2011-09-01
申请号：US13106711
申请日：2011-05-12
申请人： Andy Tsen , Jin-Ning Sung , Po-Feng Tsai , Jong-l Mou , Yen-Wei Cheng
发明人： Andy Tsen , Jin-Ning Sung , Po-Feng Tsai , Jong-l Mou , Yen-Wei Cheng
IPC分类号： G06F17/00
CPC分类号： H01L22/20 , G05B19/41875 , H01L22/12 , Y02P90/22 , Y02P90/26
摘要： System and method for implementing multi-resolution advanced process control (“APC”) are described. One embodiment is a method comprising obtaining low resolution metrology data and high resolution metrology data related to a process module for performing a process on the wafer; modeling a process variable of the process as a function of the low resolution metrology data to generate a low-resolution process model; and modeling the process variable as a function of the high resolution metrology data to generate a high-resolution process model. The method further includes calibrating the low resolution process model; combining the calibrated low resolution process model with the high resolution process model to generate a multi-resolution process model that models the process variable as a function of both the low resolution metrology data and the high resolution metrology data; and analyzing a response of the multi-resolution process model and the low and high resolution metrology data to control performance of a process module.
摘要翻译：描述了用于实现多分辨率高级过程控制（“APC”）的系统和方法。一个实施例是一种方法，包括获得与用于在晶片上执行处理的处理模块相关的低分辨率度量数据和高分辨率度量数据; 将过程的过程变量建模为低分辨率度量数据的函数，以生成低分辨率过程模型; 并将过程变量建模为高分辨率度量数据的函数，以生成高分辨率过程模型。该方法还包括校准低分辨率过程模型; 将校准的低分辨率过程模型与高分辨率过程模型相结合，以生成多分辨率过程模型，其将过程变量建模为低分辨率度量数据和高分辨率度量数据的函数; 并分析多分辨率过程模型和低分辨率和高分辨率度量数据的响应，以控制过程模块的性能。

7. 发明申请

US20100312374A1 SYSTEM AND METHOD FOR IMPLEMENTING A VIRTUAL METROLOGY ADVANCED PROCESS CONTROL PLATFORM 有权
标题翻译：虚拟计量流程控制平台的系统和方法
公开(公告)号：US20100312374A1
公开(公告)日：2010-12-09
申请号：US12478956
申请日：2009-06-05
申请人： Po-Feng Tsai , Andy Tsen , Jin-Ning Sung
发明人： Po-Feng Tsai , Andy Tsen , Jin-Ning Sung
IPC分类号： G06F17/50
CPC分类号： G01R31/2894 , H01L22/12 , H01L22/20
摘要： System and method for implementing a VM APC platform are described. In one embodiment, the VM APC system comprises a process tool for processing a plurality of wafers, a metrology tool for measuring a sample wafer of the plurality of wafers and generating actual metrology data therefor, and a VM model for predicting metrology data for each of the plurality of wafers. The actual metrology data is received from the metrology tool and used to update the VM model. Key variables of the virtual metrology model are updated only in response to a determination that the VM model is inaccurate and parameters of the VM model are updated responsive to receipt of the actual metrology data for the sample wafer of the plurality of wafers. The system also includes an APC controller for receiving the predicted metrology data and the actual metrology data and controlling an operation of the process tool based on the received data
摘要翻译：描述了实现VM APC平台的系统和方法。在一个实施例中，VM APC系统包括用于处理多个晶片的处理工具，用于测量多个晶片中的样品晶片并产生其实际测量数据的计量工具，以及用于预测每个晶片的测量数据的VM模型多个晶片。实际计量数据从计量工具中接收并用于更新VM模型。虚拟测量模型的关键变量仅在响应于确定VM模型不准确并且响应于接收到多个晶片的样本晶片的实际测量数据来更新VM模型的参数而被更新。该系统还包括用于接收预测计量数据和实际计量数据的APC控制器，并且基于接收到的数据来控制处理工具的操作

8. 发明申请

US20100292824A1 SYSTEM AND METHOD FOR IMPLEMENTING A WAFER ACCEPTANCE TEST ("WAT") ADVANCED PROCESS CONTROL ("APC") WITH NOVEL SAMPLING POLICY AND ARCHITECTURE 有权
标题翻译：用新的采样政策和架构实施水轮接收测试（“WAT”）高级过程控制（“APC”）的系统和方法
公开(公告)号：US20100292824A1
公开(公告)日：2010-11-18
申请号：US12465064
申请日：2009-05-13
申请人： Andy Tsen , Jo Fei Wang , Po-Feng Tsai , Ming-Yu Fan , Jill Wang , Jong-I Mou , Sunny Wu
发明人： Andy Tsen , Jo Fei Wang , Po-Feng Tsai , Ming-Yu Fan , Jill Wang , Jong-I Mou , Sunny Wu
IPC分类号： G05B13/04
CPC分类号： G05B13/048 , G05B19/41875 , Y02P90/22 , Y02P90/86
摘要： System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.
摘要翻译：描述了实现晶片验收测试（“WAT”）高级过程控制（“APC”）的系统和方法。在一个实施例中，该方法包括对大量晶片的晶片的样本数进行密钥处理; 执行关键过程的关键在线测量以产生晶片的测量数据; 使用直线到WAT模型预测来自计量数据的WAT数据; 并且使用预测的WAT数据来调整用于控制调谐过程或过程APC过程的WAT APC过程。

9. 发明授权

US10047439B2 Method and system for tool condition monitoring based on a simulated inline measurement 有权
公开(公告)号：US10047439B2
公开(公告)日：2018-08-14
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , C23C16/52 , H01L21/66
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.

10. 发明授权

US09349660B2 Integrated circuit manufacturing tool condition monitoring system and method 有权
标题翻译：集成电路制造工具状态监测系统及方法
公开(公告)号：US09349660B2
公开(公告)日：2016-05-24
申请号：US13308644
申请日：2011-12-01
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , H01L21/66
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A system and method for monitoring a process tool of an integrated circuit manufacturing system are disclosed. An exemplary method includes defining zones of an integrated circuit manufacturing process tool; grouping parameters of the integrated circuit manufacturing process tool based on the defined zones; and evaluating a condition of the integrated circuit manufacturing process tool based on the grouped parameters.
摘要翻译：公开了一种用于监控集成电路制造系统的处理工具的系统和方法。示例性方法包括限定集成电路制造工艺工具的区域; 基于定义的区域对集成电路制造工艺工具进行分组参数; 并基于分组的参数来评估集成电路制造处理工具的状况。

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