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1. 发明授权

US5998240A Method of extracting heat from a semiconductor body and forming microchannels therein 失效
标题翻译：从半导体主体提取热量并在其中形成微通道的方法
公开(公告)号：US5998240A
公开(公告)日：1999-12-07
申请号：US71776
申请日：1998-05-04
申请人： Robin E. Hamilton , Paul G. Kennedy , John Ostop , Martin L. Baker , Gregory A. Arlow , John C. Golombeck , Thomas J. Fagan, Jr.
发明人： Robin E. Hamilton , Paul G. Kennedy , John Ostop , Martin L. Baker , Gregory A. Arlow , John C. Golombeck , Thomas J. Fagan, Jr.
IPC分类号： H01L23/473 , H01L21/44
CPC分类号： H01L23/473 , F28F2260/02 , F28F3/12 , H01L2924/0002 , H01L2924/3011
摘要： Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.
摘要翻译：密集封装的半导体器件的冷却是通过微通道实现的，微通道通过强制对流提取热量以及使用尽可能靠近热源的流体冷却剂。微通道使散热器表面积最大化，并提供改进的传热系数，从而允许半导体器件的功率密度更高，而不会增加结温或降低可靠性。在其优选实施例中，多个微通道直接形成在安装在电路板的接地平面元件上的硅或碳化硅芯片或裸片的衬底部分中，并且其中液体冷却剂被馈送到微通道并通过地面飞机微通道包括多个具有大致矩形横截面的闭合端的槽或凹槽。制造方法包括沉积和蚀刻，剥离加工，微加工和激光切割技术。

2. 发明授权

US5801442A Microchannel cooling of high power semiconductor devices 失效
标题翻译：大功率半导体器件的微通道冷却
公开(公告)号：US5801442A
公开(公告)日：1998-09-01
申请号：US681207
申请日：1996-07-22
申请人： Robin E. Hamilton , Paul G. Kennedy , John Ostop , Martin L. Baker , Gregory A. Arlow , John C. Golombeck , Thomas J Fagan, Jr.
发明人： Robin E. Hamilton , Paul G. Kennedy , John Ostop , Martin L. Baker , Gregory A. Arlow , John C. Golombeck , Thomas J Fagan, Jr.
IPC分类号： H01L23/473 , H01L23/34
CPC分类号： H01L23/473 , F28F2260/02 , F28F3/12 , H01L2924/0002 , H01L2924/3011
摘要： Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.
摘要翻译：密集封装的半导体器件的冷却是通过微通道实现的，微通道通过强制对流提取热量以及使用尽可能靠近热源的流体冷却剂。微通道使散热器表面积最大化，并提供改进的传热系数，从而允许半导体器件的功率密度更高，而不会增加结温或降低可靠性。在其优选实施例中，多个微通道直接形成在安装在电路板的接地平面元件上的硅或碳化硅芯片或裸片的衬底部分中，并且其中液体冷却剂被馈送到微通道并通过地面飞机微通道包括多个具有大致矩形横截面的闭合端的槽或凹槽。制造方法包括沉积和蚀刻，剥离加工，微加工和激光切割技术。

3. 发明授权

US4475794A Aluminum, aluminum oxide, cromium, gold mirror 失效
标题翻译：铝，氧化铝，金，金镜
公开(公告)号：US4475794A
公开(公告)日：1984-10-09
申请号：US345437
申请日：1982-02-03
申请人： Martin L. Baker , Robert A. Iacovazzi
发明人： Martin L. Baker , Robert A. Iacovazzi
IPC分类号： C23C14/02 , G02B1/10 , G02B5/08 , C25D11/02
CPC分类号： C23C14/024 , C23C14/028 , G02B5/0858 , G02B5/0875 , G02B5/10 , Y10S359/90 , Y10T428/1259
摘要： A composite mirror and a method for making the mirror. The mirror has an aluminum reflective surface and coatings of aluminum oxide, chromium and gold deposited thereon, thus making the mirror highly reflective yet corrosion resistant. The method of making the mirror includes the steps of polishing the aluminum surface and depositing the coatings in sequence.
摘要翻译：复合镜和制造镜的方法。镜子具有铝反射表面和沉积在其上的氧化铝，铬和金的涂层，从而使镜子具有高反射性并且具有耐腐蚀性。制造镜子的方法包括依次抛光铝表面和沉积涂层的步骤。

4. 发明授权

US06189766B1 Zero stress bonding of silicon carbide to diamond 失效
标题翻译：碳化硅与金刚石的零应力结合
公开(公告)号：US06189766B1
公开(公告)日：2001-02-20
申请号：US09112429
申请日：1998-07-10
申请人： Martin L. Baker , William F. Cashion , Fred B. Hagedorn
发明人： Martin L. Baker , William F. Cashion , Fred B. Hagedorn
IPC分类号： G23K119
CPC分类号： H01L23/3735 , H01L21/0445 , H01L23/3732 , H01L2924/0002 , Y10T428/30 , H01L2924/00
摘要： A multi-layer structure including a first layer; a second layer, with a coefficient of thermal expansion different than a coefficient of thermal expansion of the first layer, a bulk modulus different than a bulk modulus of the first layer and a thermal conductivity different than a thermal conductivity of the first layer; a bonding layer, having an isostatic pressure versus temperature curve with one of the first layer and the second layer which is substantially similar to an isostatic pressure versus temperature curve of the first layer and the second layer, such that a substantially stress-free bond is formed between the first layer and the second layer; wherein the first layer, the second layer, and the bonding layer are arranged as a sandwich, with the bonding layer in between the first layer and the second layer. The bonding layer may also be optional, in principle, and the first layer and the second layer bonded by diffusion, if the first layer and the second layer have sufficiently low melting temperatures.
摘要翻译：一种包括第一层的多层结构; 具有不同于第一层的热膨胀系数的热膨胀系数的第二层，不同于第一层的体积弹性模量的体积模量和不同于第一层的热导率的热导率的第二层; 具有与第一层和第二层中的一个基本相似的等静压力与温度曲线的粘合层，其基本上类似于第一层和第二层的等静压力对温度曲线，使得基本上无应力的键为形成在第一层和第二层之间; 其中所述第一层，所述第二层和所述接合层被布置为夹层，所述接合层位于所述第一层和所述第二层之间。如果第一层和第二层具有足够低的熔融温度，接合层原则上也可以是任选的，而第一层和第二层通过扩散结合。

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