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1. 发明授权

US10554912B2 Semiconductor apparatus, solid-state image sensing apparatus, and camera system 有权
公开(公告)号：US10554912B2
公开(公告)日：2020-02-04
申请号：US15800744
申请日：2017-11-01
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04M1/56 , H04N5/359 , H01L27/146 , H03M1/56 , H03M1/08 , H03M1/12 , H04N5/378 , H04N5/225 , H04N5/374 , H04N5/3745
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

2. 发明授权

US10484634B2 Image pickup element, control method, and image pickup device 有权
公开(公告)号：US10484634B2
公开(公告)日：2019-11-19
申请号：US15119636
申请日：2015-02-24
申请人： SONY CORPORATION
发明人： Naoki Kawazu , Atsushi Suzuki , Takashi Shoji , Masashi Akamatsu , Nobutaka Shimamura , Hayato Wakabayashi , Yuuki Yamagata , Norihiro Nikai , Tohru Kikawada , Takumi Oka , Toshiki Kainuma
IPC分类号： H04N5/374 , H04N5/378 , H04N5/345 , H04N5/347 , H04N5/3745 , H04N9/04
摘要： The present technology relates to an image pickup element, a control method, and an image pickup device which realize easier and more diversified data output. In one aspect of the present technology, a plurality of signal lines for transmitting a pixel signal read from a pixel is allocated to each column, and different reading modes of the pixel signals are respectively allocated to the signal lines of each column. Regarding each column of the pixel array connected to the pixel corresponding to the mode, the pixel signal is read from the pixel connected to the signal line corresponding to the reading mode of the pixel signal in the mode, and the read pixel signal is transmitted via the signal line. The present technology is applied to, for example, an image pickup element and an image pickup device.

3. 发明授权

US10009565B2 Current/voltage conversion circuit and imaging apparatus 有权
公开(公告)号：US10009565B2
公开(公告)日：2018-06-26
申请号：US14421043
申请日：2013-08-08
申请人： Sony Corporation
发明人： Takahiro Sonoda , Atsushi Suzuki
IPC分类号： H01J40/14 , H04N5/3745 , G01T1/20 , H01L27/146 , H04N5/369 , G01T1/17 , H04N5/378
CPC分类号： H04N5/37455 , G01T1/17 , G01T1/2018 , H01L27/14612 , H01L27/14661 , H04N5/32 , H04N5/3698 , H04N5/3745 , H04N5/378
摘要： An imaging apparatus 10 includes an imaging panel 11 formed by arranging imaging element units 20 included in one pixel or a plurality of pixels, in a two-dimensional matrix form. Each of the imaging element units 20 includes an imaging element 30 which converts an incident electromagnetic wave to a current, and a current/voltage conversion circuit 40A which converts the current from the imaging element to a voltage.

4. 发明申请

US20170134678A1 SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 审中-公开
公开(公告)号：US20170134678A1
公开(公告)日：2017-05-11
申请号：US15414019
申请日：2017-01-24
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04N5/378 , H03M1/56 , H03M1/08 , H03M1/12 , H04N5/374 , H01L27/146
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

5. 发明授权

US09571773B2 Drive apparatus, drive method, and electronic device 有权
标题翻译：驱动装置，驱动方法和电子装置
公开(公告)号：US09571773B2
公开(公告)日：2017-02-14
申请号：US14524169
申请日：2014-10-27
申请人： Sony Corporation
发明人： Naoki Kawazu , Atsushi Suzuki , Yosuke Isoo
IPC分类号： H04N5/378 , H04N5/359 , H04N5/343 , H04N5/345 , H04N5/376
CPC分类号： H04N5/378 , H04N5/343 , H04N5/3456 , H04N5/3591 , H04N5/376
摘要： Provided is a drive apparatus including an address decoder circuit provided in each pixel row of a pixel array inside a solid state image sensor, the address decoder circuit being configured to generate at least a control signal to cause, based on a V address signal to identify the pixel row in the pixel array, pixels of the pixel row corresponding to the V address signal to perform a read operation that reads accumulated charges from the relevant pixels or an electronic shutter operation that sweeps away the accumulated charges from the relevant pixels. The V address signals of at least two mutually different systems are supplied to the address decoder circuit, and at least the two mutually different address decoder circuits generate the control signal for at least the two mutually different pixel rows within one horizontal scanning period.
摘要翻译：提供了一种驱动装置，其包括设置在固态图像传感器内部的像素阵列的每个像素行中的地址解码器电路，所述地址解码器电路被配置为至少产生控制信号，以基于V地址信号来识别像素阵列中的像素行，对应于V地址信号的像素行的像素，以执行从相关像素读取累积电荷的读取操作或从相关像素扫除累积电荷的电子快门操作。至少两个相互不同的系统的V地址信号被提供给地址解码器电路，并且至少两个相互不同的地址解码器电路在一个水平扫描周期内为至少两个相互不同的像素行生成控制信号。

6. 发明申请

US20140232916A1 SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 有权
标题翻译：半导体设备，固态图像感应装置和相机系统
公开(公告)号：US20140232916A1
公开(公告)日：2014-08-21
申请号：US14348722
申请日：2012-10-10
申请人： SONY CORPORATION
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/378 , H04N5/359
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. A first chip and a second chip are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip having a function of sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and a function of quantizing the sampled signals to obtain digital signals.
摘要翻译：一种半导体装置，固态图像感测装置和能够减少通过相邻通孔传播的信号之间的干扰的照相机系统，防止了通孔数量的增加，减少了具有传感器的芯片的面积和其安装步骤的数量。第一芯片和第二芯片被结合在一起以形成层叠结构，第一芯片和第二芯片之间的布线通过通孔连接，第一芯片通过时间离散由各个传感器产生的模拟信号获得的信号到第二芯片通过对应的通孔，第二芯片具有在与第一芯片对信号采样的定时不同的定时通过通孔对从第一芯片发送的信号进行采样的功能，以及量化采样信号以获得数字信号。

7. 发明申请

US20180124340A1 SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 审中-公开
公开(公告)号：US20180124340A1
公开(公告)日：2018-05-03
申请号：US15800744
申请日：2017-11-01
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04N5/378 , H01L27/146 , H04N5/374 , H04N5/359 , H04N5/225 , H03M1/56 , H03M1/12 , H03M1/08 , H04N5/3745
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

8. 发明申请

US20170288691A1 SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 审中-公开
公开(公告)号：US20170288691A1
公开(公告)日：2017-10-05
申请号：US15630608
申请日：2017-06-22
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H03M1/56 , H03M1/12 , H03M1/08
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

9. 发明授权

US09654708B2 Semiconductor apparatus, solid-state image sensing apparatus, and camera system 有权
公开(公告)号：US09654708B2
公开(公告)日：2017-05-16
申请号：US15264272
申请日：2016-09-13
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04N5/378 , H04N5/374 , H01L27/146
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

10. 发明申请

US20170134679A1 SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 审中-公开
公开(公告)号：US20170134679A1
公开(公告)日：2017-05-11
申请号：US15414028
申请日：2017-01-24
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04N5/378 , H03M1/08 , H03M1/56 , H01L27/146 , H04N5/3745 , H03M1/12
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

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