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    • 2. 发明授权
    • Line material, electronic device using the line material and liquid
crystal display
    • 线材,电子装置采用线材和液晶显示
    • US5428250A
    • 1995-06-27
    • US095702
    • 1993-07-22
    • Mitsushi IkedaMichio Murooka
    • Mitsushi IkedaMichio Murooka
    • G02F1/1362H01L23/482H01L23/498H01L23/48
    • H01L23/4825G02F1/136286H01L23/49866G02F1/136213G02F2001/13629H01L2924/0002
    • The line material is of a laminated structure consisting of: a Ta containing N alloy layer (lower layer) which is a first metal layer made of at least an alloy selected from the group consisting of a TaN alloy, a Ta--Mo--N alloy, a Ta--Nb--N alloy and a Ta--W--N alloy; a second metal layer (upper layer) formed integrally with the first metal layer and made of at least an alloy selected from the group consisting of Ta, a Ta--Mo alloy, a Ta--Nb alloy, a Ta--W alloy, a TaN alloy, a Ta--Mo--N alloy, a Ta--Nb--N alloy and a Ta--W--N alloy; and/or a pin hole-free oxide film. The line material of the laminated structure is to be applied to the formation of signal lines and electrodes of, e.g., a liquid crystal display. The line material has a low resistance and the insulating film formed by anodization and the like exhibits excellent insulation and thermal stability. Therefore, when the line material is applied to signal lines of various devices, it exhibits excellent characteristics.
    • 该线材是由以下组成的叠层结构:含有N合金层(下层)的Ta,该合金层是由至少选自TaN合金,Ta-Mo-N合金 ,Ta-Nb-N合金和Ta-WN合金; 与第一金属层一体形成并由至少一种选自Ta,Ta-Mo合金,Ta-Nb合金,Ta-W合金,TaN的合金制成的第二金属层(上层) 合金,Ta-Mo-N合金,Ta-Nb-N合金和Ta-WN合金; 和/或无针孔的氧化膜。 层叠结构的线材应用于例如液晶显示器的信号线和电极的形成。 线材具有低电阻,并且通过阳极氧化等形成的绝缘膜显示出优异的绝缘性和热稳定性。 因此,当将线材施加到各种装置的信号线时,其表现出优异的特性。
    • 3. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5431773A
    • 1995-07-11
    • US991954
    • 1992-12-17
    • Mitsushi IkedaMichio Murooka
    • Mitsushi IkedaMichio Murooka
    • G02F1/136G02F1/1362G02F1/1368H01L21/02H01L21/302H01L21/3065H01L21/311H01L21/336H01L21/77H01L21/84H01L29/49H01L29/78H01L29/786C23F1/00
    • H01L29/4908G02F1/1362H01L21/31122H01L28/40H01L29/66765G02F2001/13629H01L27/124
    • A method of manufacturing a semiconductor device, which comprises steps of providing a substrate, forming an oxide layer of a metal material, which includes a tantalum or an alloy mainly containing a tantalum on the substrate, placing the substrate into a first chamber, activating an etching gas which includes a fluorine containing gas and an oxygen containing gas, in a second chamber, introducing the activated etching gas into the second chamber, and etching the oxide layer by the introduced gas selectively against the substrate. A method of manufacturing a liquid crystal display device, which comprises steps of providing a substrate, forming an anodic oxide layer of a tantalum containing material on the substrate, forming an etching mask on the anodic oxide layer, placing the substrate into a first region, activating a mixture of fluorine and oxygen containing gas in a second region, apart from the first region, introducing the activated etching gas into the first region through a gas introducing portion, and etching the oxide layer on the substrate selectively against the substrate, by using the etching mask.
    • 一种制造半导体器件的方法,包括以下步骤:在衬底上形成包含钽或主要含有钽的合金的金属材料的氧化物层的衬底,将衬底放置在第一腔室中,激活 在第二室中包括含氟气体和含氧气体的蚀刻气体,将活化的蚀刻气体引入到第二室中,并且通过引入的气体选择性地对衬底蚀刻氧化物层。 一种制造液晶显示装置的方法,包括以下步骤:在基板上形成含钽材料的阳极氧化层,在阳极氧化层上形成蚀刻掩模,将基板放置在第一区域中, 在第一区域的第二区域中激活含氟和含氧气体的混合物,通过气体导入部分将活化的蚀刻气体引入第一区域,并通过使用 蚀刻掩模。