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    • 4. 发明授权
    • Vacuum processing apparatus and operating method of the same
    • 真空处理装置及其操作方法
    • US09245780B2
    • 2016-01-26
    • US13592408
    • 2012-08-23
    • Takahiro ShimomuraYoshifumi OgawaSusumu Tauchi
    • Takahiro ShimomuraYoshifumi OgawaSusumu Tauchi
    • H01L21/677H01L21/67
    • H01L21/67161H01L21/67184
    • A vacuum processing apparatus includes a row of containers of vacuum transfer chambers connected to each other behind a lock chamber, a wafer being transferred through depressurized inside of the row of the containers of the vacuum transfer containers, an intermediate chamber disposed between the containers of the vacuum transfer chambers, a plurality of processing units including processing containers respectively connected to left or right side walls of the containers of the vacuum transfer chambers and the wafer is processed therein, and a bypass chamber which constitutes a bypass path connecting the processing units, where only either the wafer which is being transferred from the lock chamber toward one of the processing units or the wafer which was processed in one of the processing units and is being transferred toward the lock chamber is transferred through the containers of the vacuum transfer chambers.
    • 真空处理装置包括一排在锁室后面彼此连接的真空传送室的容器,通过真空传送容器的容器排中的减压内部传送的晶片,设置在真空传送容器的容器之间的中间室 在真空传送室中处理多个处理单元,包括分别连接到真空传送室的容器的左侧壁或右侧壁的处理容器和晶片,以及构成连接处理单元的旁路的旁路室,其中, 只有从锁定室转移到处理单元之一的晶片或在一个处理单元中被处理并且被转移到锁定室的晶片被传送通过真空传送室的容器。
    • 8. 发明授权
    • Method of holding substrate and substrate holding system
    • 保持基板和基板保持系统的方法
    • US5906684A
    • 1999-05-25
    • US50417
    • 1998-03-31
    • Naoyuki TamuraKazue TakahashiYouichi ItoYoshifumi OgawaHiroyuki ShichidaTsunehiko Tsubone
    • Naoyuki TamuraKazue TakahashiYouichi ItoYoshifumi OgawaHiroyuki ShichidaTsunehiko Tsubone
    • H01L21/00H01L21/68H01L21/683C23C16/00H05H1/00
    • H01L21/6835H01L21/67109H01L21/6831H01L21/6833H01L2924/3025Y10T279/23
    • In a method of holding a substrate and a substrate holding system where, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
    • 在保持基板和基板保持系统的方法中,可以减少基板的背面上的异物量,并且只有少量的异物从安装台传递到基板。 为此,基板保持系统具有环形防漏表面,在对应于基板的周边的样品台上提供平滑的支撑表面,多个接触保持部分抵靠在样品台上的基板上, 与基板周边相对应的位置和与基板中心相对应的位置,以及静电吸引装置,用于通过使基板的背面与环状的防漏表面接触而固定基板,以及接触保持部 。 将基板暴露于环状防漏表面处的冷却表面和位于环形防漏表面内的位置处的接触保持部。 基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。