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1. 发明授权

US08904266B2 Multi-standard viterbi processor 有权
标题翻译：多标准维特比处理器
公开(公告)号：US08904266B2
公开(公告)日：2014-12-02
申请号：US12853589
申请日：2010-08-10
申请人： Weihua Tang , Nur Engin , Frits Anthonie Steenhof , Marc Klaassen , Andries Pieter Hekstra , Sergie Valerjewitsch Sawitzki
发明人： Weihua Tang , Nur Engin , Frits Anthonie Steenhof , Marc Klaassen , Andries Pieter Hekstra , Sergie Valerjewitsch Sawitzki
IPC分类号： H03M13/17 , H03M13/00 , H03M13/41
CPC分类号： H03M13/4176 , H03M13/4107 , H03M13/4169 , H03M13/6519
摘要： Various embodiments relate to a multi-standard Viterbi decoder. Based on programmable values for constraint length, generator polynomials, and code rate, the multi-standard Viterbi decoder may adhere to a specific convolutional code standard. At a given time, the multi-standard Viterbi decoder may receive a variety of convolutional codes through a channel and may process them using various forms of the trace back method. Various embodiments include a branch metric unit and path metric unit that include a variety of sub-units that may or may not be active based on the value of the programmable value. Various embodiments also enable the multi-standard Viterbi decoder to handle different forms of convolutional codes, such as tail-biting codes. In some embodiments, the multi-standard Viterbi decoder may also process at least two convolutional codes concurrently.
摘要翻译：各种实施例涉及多标准维特比解码器。基于约束长度，生成多项式和码率的可编程值，多标准维特比解码器可以遵循特定的卷积码标准。在给定时间，多标准维特比解码器可以通过信道接收各种卷积码，并且可以使用各种形式的追溯方法来处理它们。各种实施例包括分支度量单位和路径度量单位，其包括可基于可编程值的值而可能或可以不是活动的各种子单元。各种实施例还使得多标准维特比解码器能够处理不同形式的卷积码，例如尾巴码。在一些实施例中，多标准维特比解码器也可以同时处理至少两个卷积码。

2. 发明申请

US20120042229A1 MULTI-STANDARD VITERBI PROCESSOR 有权
标题翻译：多标准VITERBI处理器
公开(公告)号：US20120042229A1
公开(公告)日：2012-02-16
申请号：US12853589
申请日：2010-08-10
申请人： Weihua Tang , Nur Engin , Frits Anthonie Steenhof , Marc Klaassen , Andries Pieter Hekstra , Sergei Valerjewitsch Sawitzki
发明人： Weihua Tang , Nur Engin , Frits Anthonie Steenhof , Marc Klaassen , Andries Pieter Hekstra , Sergei Valerjewitsch Sawitzki
IPC分类号： H03M13/03 , G06F11/10
CPC分类号： H03M13/4176 , H03M13/4107 , H03M13/4169 , H03M13/6519
摘要： Various embodiments relate to a multi-standard Viterbi decoder. Based on programmable values for constraint length, generator polynomials, and code rate, the multi-standard Viterbi decoder may adhere to a specific convolutional code standard. At a given time, the multi-standard Viterbi decoder may receive a variety of convolutional codes through a channel and may process them using various forms of the trace back method. Various embodiments include a branch metric unit and path metric unit that include a variety of sub-units that may or may not be active based on the value of the programmable value. Various embodiments also enable the multi-standard Viterbi decoder to handle different forms of convolutional codes, such as tail-biting codes. In some embodiments, the multi-standard Viterbi decoder may also process at least two convolutional codes concurrently.
摘要翻译：各种实施例涉及多标准维特比解码器。基于约束长度，生成多项式和码率的可编程值，多标准维特比解码器可以遵循特定的卷积码标准。在给定时间，多标准维特比解码器可以通过信道接收各种卷积码，并且可以使用各种形式的追溯方法来处理它们。各种实施例包括分支度量单位和路径度量单位，其包括可基于可编程值的值而可能或可以不是活动的各种子单元。各种实施例还使得多标准维特比解码器能够处理不同形式的卷积码，例如尾巴码。在一些实施例中，多标准维特比解码器也可以同时处理至少两个卷积码。

3. 发明申请

US20110161787A1 POWER-REDUCED PRELIMINARY DECODED BITS IN VITERBI DECODERS 有权
标题翻译： VITERBI解码器中的功率降低的初步解码器
公开(公告)号：US20110161787A1
公开(公告)日：2011-06-30
申请号：US12647885
申请日：2009-12-28
申请人： Andries Pieter Hekstra , Weihua Tang
发明人： Andries Pieter Hekstra , Weihua Tang
IPC分类号： H03M13/23 , G06F11/10 , H04L23/02
CPC分类号： H03M13/4184
摘要： Various embodiments relate to a storage unit and a related method in a Viterbi decoder for decoding a binary convolutional code with power efficiency. A storage unit for storing survivor paths may use a register exchange method to append additional information received from an add-compare-select unit onto the end of the survivor path. An exemplary method produces a prediction path after a specified depth in the survivor path processing history and subtracts the prediction path from the survivor path. This may cause a majority of bits that comprise the survivor path to be converted to a low-energy bit, such as a logical “0”. During subsequent copies of a differential survivor path using the register exchange method, less energy is consumed when copying the entire survivor path, as a majority of the bits in the survivor paths are a logical “0”.
摘要翻译：各种实施例涉及维特比解码器中的存储单元和相关方法，用于以功率效率对二进制卷积码进行解码。用于存储幸存路径的存储单元可以使用寄存器交换方法将从加法比较选择单元接收到的附加信息附加到幸存路径的末端。示例性方法在幸存路径处理历史中的指定深度之后产生预测路径，并从幸存路径中减去预测路径。这可能导致构成幸存者路径的大多数位被转换为低能量位，例如逻辑“0”。在使用寄存器交换方法的差分幸存者路径的随后复制期间，当复制整个幸存者路径时消耗较少的能量，因为幸存路径中的大多数位是逻辑“0”。

4. 发明授权

US08566683B2 Power-reduced preliminary decoded bits in viterbi decoders 有权
标题翻译：维特比解码器中功耗降低的初步解码位
公开(公告)号：US08566683B2
公开(公告)日：2013-10-22
申请号：US12647885
申请日：2009-12-28
申请人： Andries Pieter Hekstra , Weihua Tang
发明人： Andries Pieter Hekstra , Weihua Tang
IPC分类号： H03M13/03
CPC分类号： H03M13/4184
摘要： Various embodiments relate to a storage unit and a related method in a Viterbi decoder for decoding a binary convolutional code with power efficiency. A storage unit for storing survivor paths may use a register exchange method to append additional information received from an add-compare-select unit onto the end of the survivor path. An exemplary method produces a prediction path after a specified depth in the survivor path processing history and subtracts the prediction path from the survivor path. This may cause a majority of bits that comprise the survivor path to be converted to a low-energy bit, such as a logical “0”. During subsequent copies of a differential survivor path using the register exchange method, less energy is consumed when copying the entire survivor path, as a majority of the bits in the survivor paths are a logical “0”.
摘要翻译：各种实施例涉及维特比解码器中的存储单元和相关方法，用于以功率效率对二进制卷积码进行解码。用于存储幸存路径的存储单元可以使用寄存器交换方法将从加法比较选择单元接收到的附加信息附加到幸存路径的末端。示例性方法在幸存路径处理历史中的指定深度之后产生预测路径，并从幸存路径中减去预测路径。这可能导致构成幸存者路径的大多数位被转换为低能量位，例如逻辑“0”。在使用寄存器交换方法的差分幸存者路径的随后复制期间，当复制整个幸存者路径时消耗较少的能量，因为幸存路径中的大多数位是逻辑“0”。

5. 发明申请

US20150001736A1 DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS 审中-公开
标题翻译：使用不同类型的不同地区的DIE连接
公开(公告)号：US20150001736A1
公开(公告)日：2015-01-01
申请号：US13931909
申请日：2013-06-29
申请人： Hualiang Shi , Shengquan Ou , Sairam Agraharam , Shan Zhong , Sivakumar Nagarajan , Weihua Tang
发明人： Hualiang Shi , Shengquan Ou , Sairam Agraharam , Shan Zhong , Sivakumar Nagarajan , Weihua Tang
IPC分类号： H01L21/762 , H01L25/065
CPC分类号： H01L25/0657 , H01L21/563 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/27312 , H01L2224/27334 , H01L2224/29078 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/30051 , H01L2224/30131 , H01L2224/30135 , H01L2224/30151 , H01L2224/30152 , H01L2224/30505 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/3301 , H01L2224/33181 , H01L2224/48225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/9211 , H01L2225/06513 , H01L2225/06565 , H01L2924/00014 , H01L2924/181 , H01L2924/384 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Die connections are described using different underfill types for different regions. In one example, a first electrically-non-conductive underfill paste (NCP) type is applied to an I/O region of a first die. A second NCP type is applied outside the I/O region of the first die, the second NCP type having more filler than the first NCP type, and the second die is bonded to a first die using the NCP.
摘要翻译：针对不同区域使用不同的底部填充型描述了模具连接。在一个示例中，将第一非导电底层填充膏（NCP）类型施加到第一管芯的I / O区域。第二NCP类型被施加在第一管芯的I / O区域之外，第二NCP类型具有比第一NCP型更多的填充物，并且第二管芯使用NCP结合到第一管芯。

6. 发明申请

US20140291843A1 HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING 有权
标题翻译：混合焊剂和微电子包装中的填充胶料
公开(公告)号：US20140291843A1
公开(公告)日：2014-10-02
申请号：US13853982
申请日：2013-03-29
申请人： Hongjin Jiang , Arun Kumar C. Nallani , Rajen S. Sidhu , Martha A. Dudek , Weihua Tang
发明人： Hongjin Jiang , Arun Kumar C. Nallani , Rajen S. Sidhu , Martha A. Dudek , Weihua Tang
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/01322 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/3494 , H05K2201/066 , H05K2201/068 , H05K2201/1056 , H05K2203/041 , H05K2203/0435 , H05K2203/047 , Y10S428/929 , Y10T428/12181 , Y10T428/12479 , H01L2924/014 , H01L2924/00 , H01L2224/81805
摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
摘要翻译：描述了用于焊球和填充糊的混合焊料。焊球可以由较高温度焊料液滴和低温焊料涂层形成。这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。焊球和糊剂可用于微电子器件的焊接封装。可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料互连。

7. 发明申请

US20150060527A1 NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL COMPRESSION BONDING 审中-公开
标题翻译：用于在热压缩结合期间减少温度梯度的非均匀加热器
公开(公告)号：US20150060527A1
公开(公告)日：2015-03-05
申请号：US14013626
申请日：2013-08-29
申请人： Weihua Tang , Sung-Won Moon , Sangil Lee
发明人： Weihua Tang , Sung-Won Moon , Sangil Lee
IPC分类号： H01L23/00 , B23K31/02 , H05B3/00 , B23K1/00
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/008 , B23K3/0623 , B23K20/023 , B23K20/16 , B23K2101/40 , H01L24/75 , H01L2224/75253 , H01L2224/75264 , H01L2224/753 , H01L2224/81204 , H01L2224/81801
摘要： Embodiments of a method for performing a thermal compression bonding process with a non-uniform temperature pattern and a heater having the non-uniform temperature pattern are disclosed. In some embodiments, the heater includes a plurality of heating element segments configured to generate the non-uniform temperature pattern. The configuration comprises a plurality of heating element segment densities or a plurality of heating element segment resistances.
摘要翻译：公开了一种用于执行具有不均匀温度图案的热压接工艺和具有不均匀温度图案的加热器的方法的实施例。在一些实施例中，加热器包括被配置为产生不均匀温度图案的多个加热元件段。该构造包括多个加热元件段密度或多个加热元件段电阻。

8. 发明授权

US08920934B2 Hybrid solder and filled paste in microelectronic packaging 有权
标题翻译：混合焊料和填充糊在微电子封装
公开(公告)号：US08920934B2
公开(公告)日：2014-12-30
申请号：US13853982
申请日：2013-03-29
申请人： Hongjin Jiang , Arun Kumar C. Nallani , Rajen S. Sidhu , Martha A. Dudek , Weihua Tang
发明人： Hongjin Jiang , Arun Kumar C. Nallani , Rajen S. Sidhu , Martha A. Dudek , Weihua Tang
IPC分类号： B32B5/18 , H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/01322 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/3494 , H05K2201/066 , H05K2201/068 , H05K2201/1056 , H05K2203/041 , H05K2203/0435 , H05K2203/047 , Y10S428/929 , Y10T428/12181 , Y10T428/12479 , H01L2924/014 , H01L2924/00 , H01L2224/81805
摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
摘要翻译：描述了用于焊球和填充糊的混合焊料。焊球可以由较高温度焊料液滴和低温焊料涂层形成。这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。焊球和糊剂可用于微电子器件的焊接封装。可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料互连。

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