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1. 发明授权

US08196296B2 Method for manufacturing wiring board 有权
标题翻译：线路板制造方法
公开(公告)号：US08196296B2
公开(公告)日：2012-06-12
申请号：US12250755
申请日：2008-10-14
申请人： Yuji Yukiiri , Izumi Tanaka
发明人： Yuji Yukiiri , Izumi Tanaka
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K3/0035 , H05K1/0366 , H05K3/421 , H05K3/4644 , H05K2201/0209 , H05K2201/09563 , H05K2203/0191 , H05K2203/0264 , H05K2203/066 , H05K2203/1383
摘要： There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.
摘要翻译：制备了具有支撑膜和设置在支撑膜的表面上的半固化绝缘层的绝缘层产生构件。随后，绝缘层产生件被固定到垫上，使得焊盘接触半固化绝缘层。半固化绝缘层被固化，从而产生绝缘层。随后，通过支撑膜将绝缘层暴露于激光，从而在绝缘层中打开开口。

2. 发明授权

US08561293B2 Method for manufacturing wiring board 有权
标题翻译：线路板制造方法
公开(公告)号：US08561293B2
公开(公告)日：2013-10-22
申请号：US13457188
申请日：2012-04-26
申请人： Yuji Yukiiri , Izumi Tanaka
发明人： Yuji Yukiiri , Izumi Tanaka
IPC分类号： H01K3/10
CPC分类号： H05K3/0035 , H05K1/0366 , H05K3/421 , H05K3/4644 , H05K2201/0209 , H05K2201/09563 , H05K2203/0191 , H05K2203/0264 , H05K2203/066 , H05K2203/1383
摘要： There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer.
摘要翻译：制备了具有支撑膜和设置在支撑膜的表面上的半固化绝缘层的绝缘层产生构件。随后，绝缘层产生件被固定到垫上，使得焊盘接触半固化绝缘层。半固化绝缘层被固化，从而产生绝缘层。随后，通过支撑膜将绝缘层暴露于激光，从而在绝缘层中打开开口。

3. 发明授权

US08034188B2 Method for cleaning surface of resin layer 有权
标题翻译：清洗树脂层表面的方法
公开(公告)号：US08034188B2
公开(公告)日：2011-10-11
申请号：US11567540
申请日：2006-12-06
申请人： Yoji Asahi , Yuji Yukiiri
发明人： Yoji Asahi , Yuji Yukiiri
IPC分类号： B08B3/08 , B08B3/12
CPC分类号： B08B3/12 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2203/0285 , H05K2203/0773 , H05K2203/0786
摘要： A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided.
摘要翻译：提供一种清洗树脂层的表面的方法，该树脂层的表面能够通过在含有添加有大量填料的树脂的树脂层上进行去污处理而将通过电镀形成的金属膜的剥离强度充分提高到粗糙化的表面上。

4. 发明申请

US20070131243A1 METHOD FOR CLEANING SURFACE OF RESIN LAYER 有权
标题翻译：清洁树脂层表面的方法
公开(公告)号：US20070131243A1
公开(公告)日：2007-06-14
申请号：US11567540
申请日：2006-12-06
申请人： Yoji Asahi , Yuji Yukiiri
发明人： Yoji Asahi , Yuji Yukiiri
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2203/0285 , H05K2203/0773 , H05K2203/0786
摘要： A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of filler is provided. The method is characterized in that, when a surface of a resin layer on which a metal film is formed by plating is roughened by a desmear treatment and, then, the thus-roughened surface of the resin layer is cleaned, the surface of the resin layer formed with a resin compounded with a filler in an amount of 20 wt % or more such that a difference of a coefficient of thermal expansion between the resin layer and the metal film is allowed to be reduced is roughened by subjecting it to the desmear treatment and, secondly, the filler which is deposited on the thus-roughened surface of the resin layer is removed by ultrasonic cleaning in which ultrasonic vibration of a frequency of from 35 to 50 kHz is applied.
摘要翻译：提供一种清洗树脂层的表面的方法，该树脂层的表面能够通过在含有添加有大量填料的树脂的树脂层上进行去污处理而将通过电镀形成的金属膜的剥离强度充分提高到粗糙化的表面上。该方法的特征在于，当通过电镀将其上形成金属膜的树脂层的表面通过去污处理进行粗糙化，然后清洁树脂层的这样粗糙化的表面时，树脂的表面由树脂层和金属膜之间的热膨胀系数的差减少20重量％以上的与填料混合的树脂形成的层进行粗糙化处理其次，通过施加频率为35〜50kHz的超声波振动的超声波清洗除去沉积在树脂层的粗糙化表面上的填料。

5. 发明授权

US08129626B2 Multilayer wiring substrate with a reinforcing layer for preventing a warp 有权
标题翻译：具有用于防止翘曲的增强层的多层布线基板
公开(公告)号：US08129626B2
公开(公告)日：2012-03-06
申请号：US12399450
申请日：2009-03-06
申请人： Natsuko Ueda , Yuji Yukiiri
发明人： Natsuko Ueda , Yuji Yukiiri
IPC分类号： H05K1/16
CPC分类号： H05K3/4682 , H01L2924/0002 , H05K1/0366 , H05K3/205 , H05K3/4602 , H05K3/4688 , H05K2203/1536 , H01L2924/00
摘要： A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which external connection terminals are bonded. At least one of the insulating layers contains a glass cloth.
摘要翻译：提供没有芯基板的多层布线基板。多层布线基板包括：层叠体，包括：多个绝缘层; 和多个布线层。层叠体具有安装有半导体元件的安装面，以及接合外部连接端子的接合面。绝缘层中的至少一层包含玻璃布。

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