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1. 发明申请

US20130251887A1 NANO-PATTERNING APPARATUS, SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF 审中-公开
标题翻译：纳米图案装置，具有该装置的系统及其控制方法
公开(公告)号：US20130251887A1
公开(公告)日：2013-09-26
申请号：US13483606
申请日：2012-05-30
申请人： Seon Young Myoung , Young Ju Lee , Yun Bog Kim , Suk Jin Ham , Seong Chan Park , Hyun Jung Lee
发明人： Seon Young Myoung , Young Ju Lee , Yun Bog Kim , Suk Jin Ham , Seong Chan Park , Hyun Jung Lee
IPC分类号： B05C5/02 , B05D1/26
CPC分类号： B23K3/0623 , H05K3/1241 , H05K3/3484 , H05K2201/0257
摘要： Disclosed herein is a nano-patterning system including a nano-patterning apparatus. The nano-patterning apparatus includes: a holder unit including a transfer unit and an insulating unit; a tip unit inserted into the holder unit, downwardly protruded, and having a flow channel; a flow path having one end connected to the flow channel through one side of the transfer unit or the insulating unit and extending to the outside to serve as a movement path allowing a nano-patterning material to move therealong; a pressing unit pressing the nano-patterning material at one side of the flow path; and a storage unit connected to the other end of the flow path and storing the nano-patterning material.
摘要翻译：本文公开了包括纳米图案形成装置的纳米图案化系统。纳米图案形成装置包括：保持单元，包括转印单元和绝缘单元; 插入保持器单元中的尖端单元向下突出并具有流动通道; 流路，其一端通过传送单元或绝缘单元的一侧连接到流动通道，并延伸到外部，用作使纳米图案材料沿着其移动的移动路径; 按压单元，在所述流路的一侧按压所述纳米图案形成材料; 以及存储单元，连接到流路的另一端并存储纳米图案材料。

2. 发明申请

US20130248583A1 REFLOW INSPECTION SYSTEM AND CONTROL METHOD THEREOF 审中-公开
标题翻译：反射检查系统及其控制方法
公开(公告)号：US20130248583A1
公开(公告)日：2013-09-26
申请号：US13532482
申请日：2012-06-25
申请人： Yun Bog Kim , Young Ju Lee , Seon Young Myoung , Suk Jin Ham , Seong Chan Park , Hyun Jung Lee
发明人： Yun Bog Kim , Young Ju Lee , Seon Young Myoung , Suk Jin Ham , Seong Chan Park , Hyun Jung Lee
IPC分类号： B23K31/12 , H04N7/18
CPC分类号： B23K1/008 , B23K3/08 , H01L21/0273 , H05K3/3484 , H05K2203/043
摘要： Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process.
摘要翻译：这里公开了回流检查系统。根据本发明实施例的回流检查系统包括炉子，在炉内放置回流检查对象的台，并且包括用于检测形成在一侧的回流检查对象的温度的温度检测传感器的; 光源单元，其形成在烤箱的一侧，用光照射回流检查对象;成像单元，吸入在回流检查对象物中产生的烟雾，得到回流检查对象的图像信息，从而将获得的图像信息发送到外部，处理在摄像单元中获得的图像信息的图像处理单元，以及与该台连接的控制单元，温度检测传感器和图像处理单元，以执行回流检查处理的控制。

3. 发明申请

US20130292457A1 SOLDER SHEET AND SMOLDERING METHOD USING THE SAME 审中-公开
标题翻译：使用该方法的焊接工艺和使用方法
公开(公告)号：US20130292457A1
公开(公告)日：2013-11-07
申请号：US13554006
申请日：2012-07-20
申请人： Hyun Jung Lee , Young Ju Lee , Yun Bog Kim , Seon Young Myoung , Suk Jin Ham , Seong Chan Park
发明人： Hyun Jung Lee , Young Ju Lee , Yun Bog Kim , Seon Young Myoung , Suk Jin Ham , Seong Chan Park
IPC分类号： B23K35/02 , B23K1/00
CPC分类号： B23K35/0244 , B23K3/0623 , B23K3/08 , B23K3/087 , B23K35/0222 , B23K35/0227 , Y10T428/24174
摘要： Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.
摘要翻译：这里公开了一种焊料片和使用其的焊接方法。焊料片包括：多个焊料棒，其布置成具有均匀的高度h和面积密度N; 以及具有在其一个表面上形成的粘合剂并且支撑多个焊料棒的支撑件，使得多个焊料棒中的每一个的一端附接成垂直于其上形成有粘合剂的表面。可以通过在没有掩模的情况下通过单个工艺使用焊料片而在基板的焊接部分上形成焊料凸块，因此可以简化工艺，可以降低成本，并且可以降低缺陷率，从而提高可靠性。

4. 发明授权

US09029991B2 Semiconductor packages with reduced solder voiding 有权
标题翻译：半导体封装具有减少的焊料无效
公开(公告)号：US09029991B2
公开(公告)日：2015-05-12
申请号：US12927549
申请日：2010-11-16
申请人： Robert W. Warren , Hyun Jung Lee , Nic Rossi
发明人： Robert W. Warren , Hyun Jung Lee , Nic Rossi
IPC分类号： H01L23/495 , H01L21/48 , H01L23/00 , H01L23/31
CPC分类号： H01L23/49503 , H01L21/4828 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L24/97 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the fabricated semiconductor die is attached to a top surface of the thermal pad, and a wire bond connecting the bond pad to the I/O pad, where a bottom surface of the thermal pad has channels.
摘要翻译：描述了具有减少的焊料空隙的示例性半导体封装，其具有具有I / O焊盘和热焊盘的引线框架，具有接合焊盘的制造的半导体管芯，其中所制造的半导体管芯附接到散热焊盘的顶表面以及将接合焊盘连接到I / O焊盘的引线键合，其中散热焊盘的底表面具有通道。

5. 发明授权

US08455990B2 Systems and methods of tamper proof packaging of a semiconductor device 有权
标题翻译：一种半导体器件防篡改封装的系统和方法
公开(公告)号：US08455990B2
公开(公告)日：2013-06-04
申请号：US12713141
申请日：2010-02-25
申请人： Robert W Warren , Hyun Jung Lee , Nic Rossi
发明人： Robert W Warren , Hyun Jung Lee , Nic Rossi
IPC分类号： H01L23/58 , H01L21/50
CPC分类号： H01L24/33 , H01L23/576 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/19107 , H01L2924/30107 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.
摘要翻译：阻挡层可以在半导体封装中附接到一个或多个敏感器件。阻挡层可用于阻止恶意代理人尝试访问敏感设备上的敏感信息的篡改。如果物理篡改，屏障层可能导致敏感设备变得不可操作。保护性包装的其他方面提供了对X射线和热探测以及化学和电气篡改尝试的保护。

6. 发明申请

US20120119341A1 Semiconductor packages with reduced solder voiding 有权
标题翻译：半导体封装具有减少的焊料无效
公开(公告)号：US20120119341A1
公开(公告)日：2012-05-17
申请号：US12927549
申请日：2010-11-16
申请人： Robert W. Warren , Hyun Jung Lee , Nic Rossi
发明人： Robert W. Warren , Hyun Jung Lee , Nic Rossi
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L23/49503 , H01L21/4828 , H01L23/3107 , H01L23/49548 , H01L24/48 , H01L24/97 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the fabricated semiconductor die is attached to a top surface of the thermal pad, and a wire bond connecting the bond pad to the I/O pad, where a bottom surface of the thermal pad has channels.
摘要翻译：描述了具有减少的焊料空隙的示例性半导体封装，其具有具有I / O焊盘和热焊盘的引线框架，具有接合焊盘的制造的半导体管芯，其中所制造的半导体管芯附接到散热焊盘的顶表面以及将接合焊盘连接到I / O焊盘的引线键合，其中散热焊盘的底表面具有通道。

7. 发明申请

US20100022535A1 2-Pyridyl substituted imidazoles as ALK5 and/or ALK4 Inhibitors 有权
标题翻译： 2-吡啶基取代的咪唑作为ALK5和/或ALK4抑制剂
公开(公告)号：US20100022535A1
公开(公告)日：2010-01-28
申请号：US12457479
申请日：2009-06-11
申请人： Ju Young Lee , Jae-Sun Kim , Jung-Hoon Oh , Hoe-chul Jung , Hyun Jung Lee , Sang-hwan Kang , Yong-Hyuk Kim , Sung-hoon Park , Keun-Ho Ryu , Jung Bum Yi , Hun-Taek Kim , Key-An Um , Bong-yong Lee
发明人： Ju Young Lee , Jae-Sun Kim , Jung-Hoon Oh , Hoe-chul Jung , Hyun Jung Lee , Sang-hwan Kang , Yong-Hyuk Kim , Sung-hoon Park , Keun-Ho Ryu , Jung Bum Yi , Hun-Taek Kim , Key-An Um , Bong-yong Lee
IPC分类号： A61K31/5377 , A61K31/498 , A61K31/4709 , C07D413/14 , C07D401/14
CPC分类号： C04B35/632 , C07D401/14
摘要： 2-pyridyl-substituted imidazoles which are used advantageously in the treatment of diseases mediated by ALK 5 or ALK 4 inhibitors or both.
摘要翻译： 2-吡啶基取代的咪唑，其有利地用于治疗由ALK 5或ALK 4抑制剂或两者所介导的疾病。

8. 发明授权

US07421416B2 Method of managing web sites registered in search engine and a system thereof 有权
标题翻译：管理在搜索引擎中注册的网站的方法及其系统
公开(公告)号：US07421416B2
公开(公告)日：2008-09-02
申请号：US10551752
申请日：2004-03-25
申请人： Sun Kyoon Na , Hyun Jung Lee , Ki Jeong Choi
发明人： Sun Kyoon Na , Hyun Jung Lee , Ki Jeong Choi
IPC分类号： G06N5/00
CPC分类号： G06F17/30864 , G06F17/3089
摘要： Disclosed is a method and system for managing web sites registered in a search engine that provides information about web sites on the Internet, wherein information about the web sites registered in the search engine is analyzed to prevent the provision of search results different from essential contents contained in the web sites. In the method, information of the registered web site is received and recorded in a database after being classified by predetermined fields. A search robot is controlled to read a source file constituting a web page of the registered web site, and the read source file is then analyzed. It is determined based on a predetermined basis whether or not the registered web site is a deceptive site. Predetermined processing is performed on the registered web site if the web site is determined to be a deceptive site. The source file is preferably an HTML document.
摘要翻译：公开了一种用于管理在搜索引擎中注册的网站的方法和系统，该搜索引擎提供关于因特网上的网站的信息，其中分析了关于在搜索引擎中注册的网站的信息，以防止提供与包含的基本内容不同的搜索结果在网站上。在该方法中，通过预定字段分类后，接收记录在网站中的信息并将其记录在数据库中。控制搜索机器人读取构成注册网站的网页的源文件，然后分析读取的源文件。基于预定的基础来确定注册的网站是否是欺骗性的网站。如果网站被确定为欺骗性站点，则在注册的网站上执行预定处理。源文件优选为HTML文档。

9. 发明申请

US20140037243A1 INTERPOSER FOR OPTICAL MODULE, OPTICAL MODULE USING THE SAME, METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：用于光模块的间隔器，使用其的光学模块，其制造方法
公开(公告)号：US20140037243A1
公开(公告)日：2014-02-06
申请号：US14111589
申请日：2012-04-13
申请人： Geon Cheon Lee , Hyun Jung Lee
发明人： Geon Cheon Lee , Hyun Jung Lee
IPC分类号： G02B6/12
CPC分类号： G02B6/12 , G02B6/42 , G02B6/428 , G02B6/43 , H05K1/0274 , Y10T29/49165
摘要： An interposer for an optical module includes a first substrate having an optical device mounting part on which an optical device is mounted, and a second substrate including a connection via electrically connected to a terminal pattern of the optical device mounting part. The first and second substrates are coupled with each other while forming a predetermined inclination angle therebetween.
摘要翻译：一种用于光学模块的插入器包括具有光学装置安装部分的第一基板，光学装置安装在该第一基板上，第二基板包括电连接到光学装置安装部分的端子图案的连接。第一和第二基板彼此耦合，同时形成预定的倾斜角。

10. 发明授权

US08410146B2 2-pyridyl substituted imidazoles as ALK5 and/or ALK4 inhibitors 有权
标题翻译： 2-吡啶基取代的咪唑作为ALK5和/或ALK4抑制剂
公开(公告)号：US08410146B2
公开(公告)日：2013-04-02
申请号：US12457479
申请日：2009-06-11
申请人： Ju Young Lee , Jae-Sun Kim , Jung-Hoon Oh , Hoe-chul Jung , Hyun Jung Lee , Sang-hwan Kang , Yong-Hyuk Kim , Sung-hoon Park , Keun-Ho Ryu , Jung Bum Yi , Hun-Taek Kim , Key-An Um , Bong-yong Lee
发明人： Ju Young Lee , Jae-Sun Kim , Jung-Hoon Oh , Hoe-chul Jung , Hyun Jung Lee , Sang-hwan Kang , Yong-Hyuk Kim , Sung-hoon Park , Keun-Ho Ryu , Jung Bum Yi , Hun-Taek Kim , Key-An Um , Bong-yong Lee
IPC分类号： A61K31/44
CPC分类号： C04B35/632 , C07D401/14
摘要： 2-pyridyl substituted imidazoles of the formula (I) as shown in claim 1, are provided, which are useful in the treatment of diseases mediated by ALK5 or ALK4 inhibitors or both.
摘要翻译：提供了如权利要求1所述的式（I）的2-吡啶基取代的咪唑，其可用于治疗由ALK5或ALK4抑制剂或两者介导的疾病。

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