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1. 发明授权

US09972583B2 Durable, heat-resistant multi-layer coatings and coated articles 有权
公开(公告)号：US09972583B2
公开(公告)日：2018-05-15
申请号：US13959601
申请日：2013-08-05
申请人： Applied Microstructures, Inc.
发明人： Boris Kobrin , Nikunj Dangaria , Romuald Nowak , Michael T. Grimes
IPC分类号： H01L23/00 , H01L21/02 , B81C1/00 , H01L23/29 , B81B3/00 , H01L21/312 , H01L21/314 , H01L21/316
CPC分类号： H01L23/564 , B81B3/0075 , B81B2207/115 , B81C1/00206 , B81C1/0038 , H01L21/02126 , H01L21/02164 , H01L21/02214 , H01L21/02271 , H01L21/02304 , H01L21/3127 , H01L21/3141 , H01L21/31604 , H01L21/31612 , H01L21/3162 , H01L23/29 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： An article having a surface treated to provide a protective coating structure in accordance with the following method: vapor depositing a first layer on a substrate, wherein the first layer is a metal oxide adhesion layer selected from the group consisting of an oxide of a Group IIIA metal element, a Group IVB metal element, a Group VB metal element, and combinations thereof; vapor depositing a second layer upon the first layer, wherein the second layer includes a silicon-containing layer selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride; and vapor depositing a third layer upon the second layer, wherein the third layer is a functional organic-comprising layer, wherein the functional organic-comprising layer is a SAM.

2. 发明授权

US09845235B2 Refractory seed metal for electroplated MEMS structures 有权
$Refractory seed metal for electroplated MEMS structures$
公开(公告)号：US09845235B2
公开(公告)日：2017-12-19
申请号：US14844132
申请日：2015-09-03
申请人： General Electric Company
发明人： Joleyn Eileen Brewer , Christopher Fred Keimel , Marco Francesco Aimi , Andrew Minnick , Renner Stephen Ruffalo
IPC分类号： B81B3/00 , H01L29/84 , B81C1/00 , G01L9/00 , B81B7/00
CPC分类号： B81B3/0027 , B81B3/0075 , B81B7/0003 , B81B7/008 , B81B2201/01 , B81B2201/014 , B81B2201/0228 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2203/053 , B81B2207/015 , B81B2207/115 , B81C1/00134 , B81C1/0015 , B81C1/00158 , B81C1/00182 , B81C1/00373 , B81C2201/0107 , G01L9/0042 , G01L9/0044
摘要： A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

3. 发明授权

US09756429B2 MEMS device and process 有权
公开(公告)号：US09756429B2
公开(公告)日：2017-09-05
申请号：US15470107
申请日：2017-03-27
申请人： Cirrus Logic International Semiconductor Ltd.
发明人： Colin Robert Jenkins , Tsjerk Hans Hoekstra , Euan James Boyd
IPC分类号： H01L21/00 , H04R19/00 , H04R1/22 , H01L41/09 , B81B3/00 , B81C1/00
CPC分类号： H04R19/005 , B81B3/0021 , B81B3/0075 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , H01L41/09 , H01L41/0926 , H01L2224/16225 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H04R1/222 , H04R23/006 , H04R2201/003 , Y10T29/49005 , H01L2924/00014
摘要： A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.

4. 发明申请

US20170210616A1 ELASTIC DEVICE 审中-公开
公开(公告)号：US20170210616A1
公开(公告)日：2017-07-27
申请号：US15328315
申请日：2014-07-30
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： James Elmer Abbott, JR. , Zhizhang CHEN , John L. Williams
IPC分类号： B81B3/00 , B41J2/14
CPC分类号： B81B3/0075 , B41J2/14 , B81B7/0061 , B81B2201/0242 , B81B2203/01 , B81B2203/0118 , B81B2203/0127
摘要： An elastic device may comprise an amorphous metal comprising at least one refractory metal, at least two elements selected from periods, 4, 5, 6, 9, and 10, and at least one metalloid. A membrane may comprise a layer of silicon dioxide and a layer of amorphous metal. A MEMS device may comprise a layer of amorphous metal comprising at least one refractory metal, at least two elements selected from periods, 4, 5, 6, 9, and 10, and a metalloid. In one example, the amorphous material comprises Tantalum (Ta), Tungsten (W), and Silicon (Si). In another example, the metalloid is Silicon. In yet another example, the refractory metals comprise Niobium, Molybdenum, Tantalum, Tungsten, Rhenium, or combinations thereof.

5. 发明授权

US09637374B2 MEMS device and process 有权
公开(公告)号：US09637374B2
公开(公告)日：2017-05-02
申请号：US15290361
申请日：2016-10-11
申请人： Cirrus Logic International Semiconductor Ltd.
发明人： Colin Robert Jenkins , Tsjerk Hans Hoekstra , Euan James Boyd
IPC分类号： H01L21/00 , B81B3/00 , B81C1/00 , H04R19/00 , H04R23/00 , H01L41/09
CPC分类号： H04R19/005 , B81B3/0021 , B81B3/0075 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , H01L41/09 , H01L41/0926 , H01L2224/16225 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H04R1/222 , H04R23/006 , H04R2201/003 , Y10T29/49005 , H01L2924/00014
摘要： A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.

6. 发明授权

US09487389B2 MEMS device and process 有权
公开(公告)号：US09487389B2
公开(公告)日：2016-11-08
申请号：US14959737
申请日：2015-12-04
申请人： Cirrus Logic International Semiconductor Ltd.
发明人： Colin Robert Jenkins , Tsjerk Hans Hoekstra , Euan James Boyd
IPC分类号： H01L41/09 , B81B3/00 , B81C1/00 , H04R19/00 , H04R23/00
CPC分类号： H04R19/005 , B81B3/0021 , B81B3/0075 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , H01L41/09 , H01L41/0926 , H01L2224/16225 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H04R1/222 , H04R23/006 , H04R2201/003 , Y10T29/49005 , H01L2924/00014
摘要： A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.

7. 发明申请

US20150140215A1 DURABLE CONFORMAL WEAR-RESISTANT CARBON-DOPED METAL OXIDE-COMPRISING COATING 审中-公开
标题翻译：耐久耐磨耐磨碳涂金属氧化物涂层
公开(公告)号：US20150140215A1
公开(公告)日：2015-05-21
申请号：US14539172
申请日：2014-11-12
申请人： Applied Microstructures, Inc.
发明人： Boris Kobrin , Romuald Nowak , Jeffrey D. Chinn
IPC分类号： C09D1/00 , C23C16/455 , C23C16/40 , C08K3/04 , C08K3/22
CPC分类号： C09D1/00 , B81B3/0075 , C23C16/403 , C23C16/405 , C23C16/45525
摘要： The present invention is related to carbon-doped metal oxide films. A method of depositing a low friction metal oxide film on a substrate is provided, including: using an atomic layer deposition technique, wherein said metal oxide film is deposited using at least an organo-metallic precursor, and wherein said substrate is at a temperature of 150° C. or lower during deposition of said metal oxide film, whereby a carbon-doped metal oxide film is obtained. The carbon-doped metal oxide films provide a low coefficient of friction, for example ranging from about 0.05 to about 0.4. In addition, the carbon-doped metal oxide films provide anti-stiction properties, where the measured work of adhesion is less than 10 μJ/m2. In addition, the carbon-doped metal oxide films provide unexpectedly good water vapor transmission properties. The carbon content in the carbon-doped metal oxide films ranges from about 5 atomic % to about 20 atomic %.
摘要翻译：本发明涉及碳掺杂金属氧化物膜。提供了一种在衬底上沉积低摩擦金属氧化物膜的方法，包括：使用原子层沉积技术，其中使用至少一种有机金属前体沉积所述金属氧化物膜，并且其中所述衬底处于在所述金属氧化物膜的沉积期间为150℃以下，由此获得碳掺杂的金属氧化物膜。碳掺杂的金属氧化物膜提供低摩擦系数，例如约0.05至约0.4。此外，掺杂碳的金属氧化物膜提供抗静电性能，其中所测量的粘附力小于10μJ/ m 2。此外，掺杂碳的金属氧化物膜提供出乎意料的良好的水蒸汽透过性能。碳掺杂的金属氧化物膜中的碳含量为约5原子％至约20原子％。

8. 发明授权

US08436453B2 Micromechanical device lubrication 有权
标题翻译：微机械装置润滑
公开(公告)号：US08436453B2
公开(公告)日：2013-05-07
申请号：US11617459
申请日：2006-12-28
申请人： Simon Joshua Jacobs , Seth A. Miller
发明人： Simon Joshua Jacobs , Seth A. Miller
IPC分类号： H01L23/20
CPC分类号： B81B3/0005 , B81B3/0075 , G02B26/0833
摘要： The present application is directed to a reservoir for use with a micro-electromechanical device having a first surface area to be lubricant. The reservoir comprises a solid component with a porous structure having a second surface area. The second surface area is greater than the first surface area. The reservoir also comprises a lubricant capable of reversibly reacting with either the solid component or the first surface area of the micro-electromechanical device.
摘要翻译：本申请涉及一种与具有第一表面积为润滑剂的微机电装置一起使用的贮存器。储存器包括具有第二表面积的多孔结构的固体成分。第二表面积大于第一表面积。储存器还包括能够与微机电装置的固体组分或第一表面区域可逆地反应的润滑剂。

9. 发明申请

US20120127683A1 ELECTRONIC DEVICE, RESONATOR, OSCILLATOR AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备，谐振器，振荡器和制造电子器件的方法
公开(公告)号：US20120127683A1
公开(公告)日：2012-05-24
申请号：US13359965
申请日：2012-01-27
申请人： Shogo INABA , Akira SATO
发明人： Shogo INABA , Akira SATO
IPC分类号： H05K7/06
CPC分类号： B81B3/0075 , H01L24/05 , H01L2224/05554 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer; a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer; and a second covering layer for closing the opening.
摘要翻译：电子设备包括基板，形成在基板上的功能结构体和用于限定具有设置在其中的功能结构体的空腔部分的覆盖结构，其中覆盖结构设置有设置在基板上的侧壁，围绕空腔部分的绝缘层和布线层; 覆盖所述空腔部的上部的第一覆盖层，具有穿过所述空腔部的开口，由包含耐腐蚀层的层叠结构构成的第一覆盖层; 以及用于封闭开口的第二覆盖层。

10. 发明授权

US08129804B2 Electronic device, resonator, oscillator and method for manufacturing electronic device 有权
标题翻译：电子设备，谐振器，振荡器和电子设备制造方法
公开(公告)号：US08129804B2
公开(公告)日：2012-03-06
申请号：US13168561
申请日：2011-06-24
申请人： Shogo Inaba , Akira Sato
发明人： Shogo Inaba , Akira Sato
IPC分类号： H01L29/84
CPC分类号： B81B3/0075 , H01L24/05 , H01L2224/05554 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/00
摘要： An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer; a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer; and a second covering layer for closing the opening.
摘要翻译：电子设备包括基板，形成在基板上的功能结构体和用于限定具有设置在其中的功能结构体的空腔部分的覆盖结构，其中覆盖结构设置有设置在基板上的侧壁，围绕空腔部分的绝缘层和布线层; 覆盖所述空腔部的上部的第一覆盖层，具有穿过所述空腔部的开口，由包含耐腐蚀层的层叠结构构成的第一覆盖层; 以及用于封闭开口的第二覆盖层。

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