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1. 发明授权

US11767424B2 Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof 有权
公开(公告)号：US11767424B2
公开(公告)日：2023-09-26
申请号：US17767241
申请日：2020-10-01
申请人： DIC Corporation
发明人： Shinji Onda , Kunihiro Morinaga
IPC分类号： C08G59/32 , C08L63/00 , C08J5/24 , B32B15/092 , B32B27/38 , H01L23/29 , C08L61/12 , C08G59/06 , C08G59/62
CPC分类号： C08L61/12 , C08G59/06 , C08J5/24 , C08J2361/12 , C08L2203/20
摘要： The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.

2. 发明公开

US20230235115A1 ESTER COMPOUND AND RESIN COMPOSITION 审中-公开
公开(公告)号：US20230235115A1
公开(公告)日：2023-07-27
申请号：US18296042
申请日：2023-04-05
申请人： AJINOMOTO CO., INC.
发明人： Ichiro OGURA
IPC分类号： C08G59/42 , C08G59/06 , C08G63/197 , C08G63/91 , H01L23/29 , H01L23/498
CPC分类号： C08G59/4276 , C08G59/06 , C08G63/197 , C08G63/916 , H01L23/295 , H01L23/49822
摘要： Compounds containing, in one molecule thereof, a structure represented by formula (1), a structure represented by formula (2), and a structure represented by formula (3) (all the symbols are those described in the specification).

are useful as epoxy resin curing agents.

3. 发明申请

US20160369041A1 EPOXY COMPOUND, EPOXY RESIN, CURABLE COMPOUND, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD 有权
标题翻译：环氧化合物，环氧树脂，可固化化合物，其固化产物，半导体密封材料和印刷电路板
公开(公告)号：US20160369041A1
公开(公告)日：2016-12-22
申请号：US14900309
申请日：2014-02-27
申请人： DIC CORPORATION
发明人： Yutaka Satou , Ayumi Takahashi
IPC分类号： C08G59/26 , C08G59/62 , H01L23/29 , C08K3/04 , H05K1/09 , H05K1/03 , C07D407/14 , C08K7/18
CPC分类号： C08G59/26 , C07D301/28 , C07D407/14 , C08G59/06 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/04 , C08K7/18 , H01L23/295 , H01L2924/0002 , H05K1/0326 , H05K1/0373 , H05K1/09 , H05K3/285 , H01L2924/00
摘要： There is provided an epoxy compound exhibiting excellent heat resistance and flame retardance of a cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and a cured product thereof; and a semiconductor sealing material. The epoxy compound has a diarylene[b,d]furan structure, in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.
摘要翻译：提供了其固化产物具有优异的耐热性和阻燃性的环氧化合物; 含有环氧化合物的环氧树脂; 可固化组合物及其固化产物; 和半导体密封材料。环氧化合物具有二亚芳基[b，d]呋喃结构，其中两个亚芳基中的至少一个具有亚萘基骨架，并且两个亚芳基各自在其芳香核上包含缩水甘油氧基。

4. 发明申请

US20160009841A1 DEOXYBENZOIN-DERIVED ANTI-FLAMMABLE POLYMERS 审中-公开
公开(公告)号：US20160009841A1
公开(公告)日：2016-01-14
申请号：US14859338
申请日：2015-09-20
申请人： University of Massachusetts
发明人： Todd Emrick , E. Bryan Coughlin , Thangamani Ranganathan , Michael Beaulieu , Richard Farris , Bon-Cheol Ku
IPC分类号： C08F222/20 , C08F212/08
CPC分类号： C08F222/20 , C08F12/22 , C08F12/32 , C08F20/18 , C08F212/08 , C08F212/14 , C08F212/32 , C08F2220/302 , C08F2222/205 , C08G18/10 , C08G18/3215 , C08G18/7614 , C08G18/7621 , C08G18/7671 , C08G18/771 , C08G59/04 , C08G59/06 , C08G59/50 , C08G59/504 , C08G61/04 , C08G63/00 , C08G63/193 , C08G64/06 , C08G2101/0008 , C08G18/6674
摘要： The invention provides novel flame-retardant polymers and materials, their synthesis and use. More particularly, the flame-retardant polymers are deoxybenzoin-derived polymers.

5. 发明授权

US07786219B2 Cyanate-terminated polyphenylene ether 有权
标题翻译：氰酸酯封端的聚苯醚
公开(公告)号：US07786219B2
公开(公告)日：2010-08-31
申请号：US12588884
申请日：2009-10-30
申请人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Katsutoshi Yamazaki
发明人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Katsutoshi Yamazaki
IPC分类号： B32B27/04 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： C08L63/00 , C08F283/08 , C08G59/00 , C08G59/06 , C08G59/40 , C08G65/485 , C08G2650/34 , C08L71/12 , C08L71/126 , C08L79/04 , H05K1/0326 , H05K3/285 , H05K3/4676 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529 , C08L2666/02 , C08L2666/22
摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要翻译：本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

6. 发明申请

US20100048826A1 Polyphenylene ether oligomer compound, derivatives thereof and use thereof 有权
标题翻译：聚苯醚低聚物化合物及其衍生物及其用途
公开(公告)号：US20100048826A1
公开(公告)日：2010-02-25
申请号：US12588884
申请日：2009-10-30
申请人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Makoto Yamazaki , Daisuke Ohno
发明人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Makoto Yamazaki , Daisuke Ohno
IPC分类号： C08L71/10 , C08G65/38
CPC分类号： C08L63/00 , C08F283/08 , C08G59/00 , C08G59/06 , C08G59/40 , C08G65/485 , C08G2650/34 , C08L71/12 , C08L71/126 , C08L79/04 , H05K1/0326 , H05K3/285 , H05K3/4676 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529 , C08L2666/02 , C08L2666/22
摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要翻译：本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

7. 发明授权

US07632912B2 Carboxylic acid-modified bisphenol epoxy di(meth)acrylate 有权
标题翻译：羧酸改性双酚环氧二（甲基）丙烯酸酯
公开(公告)号：US07632912B2
公开(公告)日：2009-12-15
申请号：US12385837
申请日：2009-04-21
申请人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Makoto Yamazaki , Daisuke Ohno
发明人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Makoto Yamazaki , Daisuke Ohno
IPC分类号： G08G59/14 , G08G65/332 , G08G65/40 , C08L63/10 , C08L71/12
CPC分类号： C08L63/00 , C08F283/08 , C08G59/00 , C08G59/06 , C08G59/40 , C08G65/485 , C08G2650/34 , C08L71/12 , C08L71/126 , C08L79/04 , H05K1/0326 , H05K3/285 , H05K3/4676 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529 , C08L2666/02 , C08L2666/22
摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要翻译：本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

8. 发明授权

US07491789B2 Disulfide-containing phenolic resin as curing agent for epoxy resin 有权
标题翻译：二硫键酚醛树脂作为环氧树脂固化剂
公开(公告)号：US07491789B2
公开(公告)日：2009-02-17
申请号：US11779181
申请日：2007-07-17
申请人： Haruaki Sue , Takashi Kumaki , Hideyasu Tsuiki , Hiroshi Matsutani , Toshihiko Takasaki , Iwao Fukuchi
发明人： Haruaki Sue , Takashi Kumaki , Hideyasu Tsuiki , Hiroshi Matsutani , Toshihiko Takasaki , Iwao Fukuchi
IPC分类号： C07C321/16 , C08G75/14 , C08L63/00
CPC分类号： C07C323/29 , C07C323/16 , C07C323/20 , C07C323/56 , C07C323/66 , C08G59/06
摘要： The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1— (1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.
摘要翻译：本发明公开了一种含硫酚醛树脂，其含有下述式（1）表示的有机基团：<？在线式说明=“在线式”末端=“铅”→R1-S -R2-S-R1-（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R1表示碳原子数2〜6的烃基，R2表示烃基具有1至10个碳原子，酚碳和酚碳之间，由下式（5）表示的苯酚衍生物：其中R5表示C2-3亚烷基，R6表示C1-10亚烷基，G表示H， C1-10烷基等，以及含有（A）上述式（5）的固化剂和（B）环氧树脂作为必要成分的环氧树脂组合物。

9. 发明授权

US07276563B2 Polyphenylene ether oligomer compound, derivatives thereof and use thereof 有权
标题翻译：聚苯醚低聚物化合物及其衍生物及其用途
公开(公告)号：US07276563B2
公开(公告)日：2007-10-02
申请号：US10980246
申请日：2004-11-04
申请人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Makoto Yamazaki , Daisuke Ohno
发明人： Kenji Ishii , Yasumasa Norisue , Kiyonari Hiramatsu , Makoto Miyamoto , Makoto Yamazaki , Daisuke Ohno
IPC分类号： B32B27/04 , B32B27/38 , C08K3/36 , C08L63/00 , C08L71/12
CPC分类号： C08L63/00 , C08F283/08 , C08G59/00 , C08G59/06 , C08G59/40 , C08G65/485 , C08G2650/34 , C08L71/12 , C08L71/126 , C08L79/04 , H05K1/0326 , H05K3/285 , H05K3/4676 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529 , C08L2666/02 , C08L2666/22
摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要翻译：本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

10. 再颁专利

USRE39615E1 Adhesive compositions and copper foils and copper clad laminates using same 失效
标题翻译：粘合剂组合物和使用其的铜箔和铜包层压板
公开(公告)号：USRE39615E1
公开(公告)日：2007-05-08
申请号：US10617653
申请日：2002-10-17
申请人： Charles A. Poutasse
发明人： Charles A. Poutasse
IPC分类号： B23B3/00
CPC分类号： H05K3/386 , C08G59/02 , C08G59/06 , C08G59/40 , C08L61/04 , C09J163/00 , H05K3/022 , H05K3/384 , H05K3/385 , H05K3/389 , H05K2201/0239 , H05K2201/0355 , H05K2201/0358 , H05K2203/0315 , H05K2203/0723 , Y10S428/901 , Y10T428/24917 , Y10T428/30 , Y10T428/31511 , Y10T428/31525 , Y10T428/31529 , Y10T428/31678
摘要： The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(═NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.
摘要翻译：本发明涉及粘合剂组合物，其包含：（A）至少一种酚醛树脂树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由下式表示的化合物反应制备的产物：其中在式（I）和（II）中：G，T和 Q独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（-NH））m的官能团。 NH 2，NR 2 COOH，NR 1，SO 2，C（O）NHR 2， 1，R 2，R 2，R 2，R 2，OH，R 2，其中R 1，R 2，R 2，R 2，R 2， / SUP>是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; T也可以是R 1，或者1或2或更高的C 1 H 4 > -NH 2 2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

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