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1. 发明申请

US20160148894A1 CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF 有权
标题翻译：用于大型二极管半导体封装的导电管接头膜及其制备有用的组合物
公开(公告)号：US20160148894A1
公开(公告)日：2016-05-26
申请号：US15010531
申请日：2016-01-29
申请人： Henkel IP & Holding GmbH
发明人： Pukun Zhu , Gina V. Hoang , Shashi K. Gupta , Andrew Laib
IPC分类号： H01L23/00 , H01B1/22
CPC分类号： H01L24/32 , C08G59/34 , C08K3/08 , C08K3/10 , C08K2003/0806 , C08K2201/001 , C08L63/00 , C08L63/10 , C08L79/08 , C08L79/085 , C08L2205/02 , C09J163/10 , H01B1/22 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/271 , H01L2224/27334 , H01L2224/2741 , H01L2224/27848 , H01L2224/2929 , H01L2224/29311 , H01L2224/29313 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29369 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/29439 , H01L2224/29455 , H01L2224/29499 , H01L2224/32 , H01L2224/32225 , H01L2224/32245 , H01L2224/83192 , H01L2224/83204 , H01L2224/83439 , H01L2224/83444 , H01L2224/83464 , H01L2224/83856 , H01L2224/83862 , H01L2924/01051 , H01L2924/0132 , H01L2924/0544 , H01L2924/0549 , H01L2924/06 , H01L2924/0635 , H01L2924/0645 , H01L2924/0665 , H01L2924/069 , H01L2924/0695 , H01L2924/07025 , H01L2924/0715 , H01L2924/20103 , H01L2924/20105 , H01L2924/20106 , H01L2924/2064 , H01L2924/3511 , H01L2924/07 , H01L2924/095 , H01L2924/00014 , H01L2924/01006 , H01L2924/0543 , H01L2924/01049 , H01L2924/0105 , H01L2924/00012
摘要： Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.
摘要翻译：本文提供了具有用于各种应用的有利性质的导电芯片附着膜，例如用于制备大型芯片半导体封装。还提供了可用于制备这种膜的制剂，以及制备这种制剂的方法。在本发明的另外的方面，提供了由根据本发明的组合物制备的导电网络。在另外的方面，本发明还涉及包含粘附到合适的基底上的这种导电管芯附着膜的制品。

2. 发明申请

US20190248952A1 HIGHLY FUNCTIONAL EPOXIDIZED RESINS AND COATINGS 审中-公开
公开(公告)号：US20190248952A1
公开(公告)日：2019-08-15
申请号：US16395304
申请日：2019-04-26
申请人： NDSU RESEARCH FOUNDATION
发明人： Dean C. WEBSTER , Partha Pratim SENGUPTA , Zhigang CHEN , Xiao PAN , Adlina PARAMARTA
IPC分类号： C08G59/02 , C08G59/17 , C08G59/16 , C08G59/14 , C09D175/08 , C09D163/08 , C08G59/42 , C09D163/00 , C08L63/00 , C08G59/34 , C08L63/10 , C07D303/16
CPC分类号： C08G59/027 , C07D303/16 , C08G59/02 , C08G59/1438 , C08G59/1455 , C08G59/1466 , C08G59/34 , C08G59/4207 , C08G59/4215 , C08G59/4223 , C08L63/00 , C08L63/10 , C09D163/00 , C09D163/08 , C09D175/08
摘要： The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

3. 发明授权

US08927641B2 Thermosetting resin composition and method of producing the same 有权
标题翻译：热固性树脂组合物及其制备方法
公开(公告)号：US08927641B2
公开(公告)日：2015-01-06
申请号：US12840025
申请日：2010-07-20
申请人： Toru Noguchi , Akira Magario
发明人： Toru Noguchi , Akira Magario
IPC分类号： C08L63/00 , B82Y30/00 , C08G59/40 , C08K3/04 , C08K7/06 , C08K9/08 , C08L63/08
CPC分类号： B82Y30/00 , C08G59/027 , C08G59/34 , C08G59/4035 , C08K3/04 , C08K3/041 , C08K7/06 , C08K9/08 , C08L63/00 , C08L63/08 , C08L2666/22 , C08K3/046 , C08L25/10
摘要： A thermosetting resin composition including: a matrix including a thermosetting resin and an elastomer; and carbon nanofibers dispersed in the matrix. The elastomer includes an unsaturated bond or a group having affinity to the carbon nanofibers.
摘要翻译：一种热固性树脂组合物，其包含：包含热固性树脂和弹性体的基体; 和分散在基质中的碳纳米纤维。弹性体包括不饱和键或对碳纳米纤维具有亲和性的基团。

4. 发明申请

US20140154939A1 HALOGEN-FREE LOW-DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER FOIL LAMINATE MADE BY USING SAME 审中-公开
标题翻译：无卤素低介电树脂组合物，以及使用它们的制备和铜箔层压板
公开(公告)号：US20140154939A1
公开(公告)日：2014-06-05
申请号：US14235984
申请日：2011-10-18
申请人： Qianping Rong , Yueshan He , Shiguo Su
发明人： Qianping Rong , Yueshan He , Shiguo Su
IPC分类号： H05K1/03
CPC分类号： H05K1/038 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/306 , B32B2457/08 , C08C19/06 , C08G59/34 , C08G73/0233 , C08K5/0066 , C08K5/5313 , C08L15/00 , C08L63/00 , C08L79/02 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209 , Y10T428/249921 , Y10T442/20 , Y10T442/656
摘要： A halogen-free low-dielectric resin composition, and a prepreg and a copper foil laminate made by using same. The halogen-free low-dielectric resin composition, based on parts by weight of the organic solid content, comprises: 5 to 90 parts by weight of epoxidized polybutadiene resin; 10 to 90 parts by weight of benzoxazine resin; 10 to 90 parts by weight of epoxy resin; 1 to 50 parts by weight of curing agent; 10 to 50 parts by weight of organic fire retardant; 0.01 to 1 part by weight of curing catalyst; 0.1 to 10 parts by weight of initiator; and 10 to 100 parts by weight of packing. The halogen-free low-dielectric resin composition of the present invention uses the epoxidized polybutadiene resin, so as to not only solve the defect of the polybutadiene but also maintain the advantages on the dielectric property and flexibility, thereby improving the adhesive force thereof with the copper foil. The prepreg and the copper foil laminate that are used for the printed circuit board and made by using the resin composition have the desirable dielectric property, desirable heat resistance, and a high glass-transition temperature, and can satisfy the requirements of high-frequency electronic signal transmission and high-speed information processing in the industry of printed circuit board copper foil plate.
摘要翻译：无卤低电介质树脂组合物和通过使用它们制备的预浸料和铜箔层压体。无卤低电介质树脂组合物以有机固体成分重量计含有：5〜90重量份的环氧化聚丁二烯树脂; 10〜90重量份苯并恶嗪树脂; 10〜90重量份的环氧树脂; 1〜50重量份固化剂; 10〜50重量份有机阻燃剂; 0.01〜1重量份固化催化剂; 0.1至10重量份引发剂; 和10至100重量份的包装。本发明的无卤低电介质树脂组合物使用环氧化聚丁二烯树脂，不仅可以解决聚丁二烯的缺点，而且还能够保持其介电性和柔软性的优点，从而提高其粘合力铜箔。用于印刷电路板并通过使用该树脂组合物制成的预浸料和铜箔层压板具有所需的介电性能，所需的耐热性和高玻璃化转变温度，并且可以满足高频电子信号传输和高速信息处理在印刷电路板铜箔板行业。

5. 发明申请

US20080167405A1 Nitrous Bridged Derivatives of 6H-Dibenz[C,E][1,2]-Oxaphosphorine-6-Oxides, Process For the Preparation and Use Thereof 失效
标题翻译： 6H-二苯并[C，E] [1,2] - 次磷酸-6-氧化物的亚麻桥接衍生物，其制备方法及用途
公开(公告)号：US20080167405A1
公开(公告)日：2008-07-10
申请号：US10598012
申请日：2005-11-03
申请人： Berthold Just , Uwe Dittrich , Holger Keller , Manfred Doering , Uwe Storzer , Michael Ciesielski
发明人： Berthold Just , Uwe Dittrich , Holger Keller , Manfred Doering , Uwe Storzer , Michael Ciesielski
IPC分类号： C07D251/32 , C08K5/34 , C07F9/547
CPC分类号： C08G59/34 , C07D251/34 , C07F9/657172 , C09K21/12
摘要： Nitrous bridged derivatives of 6H-dibenz[c,e][1,2]-oxaphosphorine-6-oxides, process for the preparation and use thereof.The invention refers to nitrous bridged derivatives of 6H-dibenz[c,e][1,2]-oxaphosphorine-6-oxides, a process for the preparation thereof and their use as flameproofing agents for polymers such as polyesters, polyamides, polycarbonates, polystyrenes, polyethylene, polypropylene, phenolic and epoxy resins. The derivatives have the Formulae I or II:
摘要翻译： 6H-二苯并[c，e] [1,2] - 氧磷磷-6-氧化物的亚硝基桥联衍生物，其制备和使用方法。本发明涉及6H-二苯并[c，e] [1,2] - 氧磷磷-6-氧化物的亚硝基桥联衍生物，其制备方法及其作为聚合物如聚酯，聚酰胺，聚碳酸酯等的防火剂的用途，聚苯乙烯，聚乙烯，聚丙烯，酚醛树脂和环氧树脂。衍生物具有式I或II：

6. 发明申请

US20170275415A1 FATTY ACID POLYESTER DERIVATIVES OF POLYGLYCOSIDES 审中-公开
公开(公告)号：US20170275415A1
公开(公告)日：2017-09-28
申请号：US15504872
申请日：2015-07-21
申请人： UNIVERSITE DE MONTPELLIER , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
发明人： Stéphane PATRY , Jean-Pierre HABAS
IPC分类号： C08G59/32 , C08G59/42 , C08G59/50 , C07H15/203 , C07H13/06
CPC分类号： C08G59/3236 , C07H13/02 , C07H13/06 , C07H15/203 , C08G59/027 , C08G59/34 , C08G59/4238 , C08G59/5026
摘要： Fatty acid polyester derivatives of polyglycosides formed from a polyol having between 2 and 10 hydroxy functions, the 2 hydroxy functions or at least 2 of these hydroxy functions being bound to the anomeric carbon of a reducing carbohydrate that is identical or different for each hydroxy group and selected from the monosaccharides and disaccharides, in which at least one of the other hydroxy groups of the monosaccharide or the disaccharide is esterified by a lipid derivative bearing at least one double bond optionally originating from a vegetable or animal oil, from a mixture of vegetable or animal oils, the double bond or the at least one of the double bonds of the lipid derivative being functionalized by a group selected from the epoxy, amine, alcohol and acid groups, and use thereof in particular in reaction formulations for the production of polymer materials.

7. 发明申请

US20170073457A1 SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING SAID EPOXY RESIN, AND CURED PRODUCT THEREOF 有权
标题翻译：硅氧烷改性环氧树脂，含有环氧树脂的组合物及其固化产品
公开(公告)号：US20170073457A1
公开(公告)日：2017-03-16
申请号：US15120482
申请日：2015-02-18
申请人： Shin-Etsu Chemical Co., Ltd. , Nippon Kayaku Kabushiki Kaisha
发明人： Toshio Shiobara , Junichi Sawada , Miyuki Wakao , Tsutomu Kashiwagi , Naofusa Miyagawa , Yoshihiro Kawada , Chie Sasaki , Naosuke Taniguchi
IPC分类号： C08G59/02 , C08G59/42 , C08G59/68 , C08G59/34 , C08G77/20
CPC分类号： C08G77/50 , C08G59/027 , C08G59/306 , C08G59/3281 , C08G59/34 , C08G59/40 , C08G59/4215 , C08G59/4276 , C08G59/4284 , C08G59/50 , C08G59/688 , C08G77/14 , C08G77/20 , C08G77/38 , C09J183/14 , C08K5/11 , C08K5/12 , C08K5/17
摘要： The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition.Disclosed is an epoxy resin represented by the following Formula (1): wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.
摘要翻译：发明内容本发明的目的在于提供一种硅氧烷改性环氧树脂及其组合物，其具有低透气性和极强强度的固化产物，以及通过使该组合物固化得到的环氧树脂固化物。 [溶液]式（1）表示的环氧树脂。 [式中，R 1分别为C 6〜C 12一价芳香族烃基，R 2独立地为C 1〜C 12一价脂肪族烃基，R 3独立地为C 1〜C 12一价脂肪族烃基或C 6〜C 12单价芳香族烃基，R 4为二价烃具有氧原子或脂肪族环结构的基团，R5是末端具有降冰片烷基环氧结构的硅氧烷链，X表示具有降冰片烷基环氧基的有机基团。

8. 发明申请

US20160096916A1 HIGHLY FUNCTIONAL EPOXIDIZED RESINS AND COATINGS 审中-公开
标题翻译：高功能环氧树脂和涂料
公开(公告)号：US20160096916A1
公开(公告)日：2016-04-07
申请号：US14801306
申请日：2015-07-16
申请人： NDSU RESEARCH FOUNDATION
发明人： Dean C. WEBSTER , Partha Pratim SENGUPTA , Zhigang CHEN , Xiao PAN , Adlina PARAMARTA
IPC分类号： C08G59/02 , C09D163/08 , C09D175/08 , C07D303/16
CPC分类号： C08G59/027 , C07D303/16 , C08G59/02 , C08G59/1438 , C08G59/1455 , C08G59/1466 , C08G59/34 , C08G59/4207 , C08G59/4215 , C08G59/4223 , C08L63/00 , C08L63/10 , C09D163/00 , C09D163/08 , C09D175/08
摘要： The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.
摘要翻译：本发明提供高功能的环氧树脂，其可以自己用于涂料配方和应用中，但可以通过环氧基团的开环反应进一步官能化，从而产生衍生树脂与其它有用的官能团。高功能环氧树脂由具有4个或更多个羟基/分子的多元醇的植物油或种子油酯的环氧化合成。在一个实施方案中，多元醇是蔗糖，植物油或种子油选自玉米油，蓖麻油，大豆油，红花油，向日葵油，亚麻籽油，妥尔油脂肪酸，桐油，葵花籽油及其混合物。公开了环氧树脂及其衍生树脂的制备方法，即涂料组合物和使用每种树脂的涂覆物体。

9. 发明授权

US08759422B2 B-stageable and skip-curable wafer back side coating adhesives 有权
标题翻译： B级和可跳过固化的晶片背面涂层粘合剂
公开(公告)号：US08759422B2
公开(公告)日：2014-06-24
申请号：US13799363
申请日：2013-03-13
申请人： Henkel Corporation
发明人： Eric C. Wang , Kevin Harris Becker , Qizhuo Zhuo
IPC分类号： C09J163/00 , C09J163/02 , C09J163/04 , C08L63/00 , C08L63/02 , C08L63/04 , C08G59/20 , C08G59/22 , C08G59/32 , B32B27/18 , B32B27/38
CPC分类号： C09J163/04 , C08G59/08 , C08G59/34 , C08G59/68 , C09J4/06 , C09J121/00 , C09J163/10
摘要： An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
摘要翻译：包含弹性体聚合物，环氧树脂，反应性稀释剂和填料的粘合剂组合物适用于电子工业内，特别是用于晶片背面涂料粘合剂。弹性体聚合物是乙烯基弹性体和环氧弹性体的混合物; 反应性稀释剂是两种或更多种稀释剂的组合，其中之一必须具有碳碳不饱和度，在固化后提供组合物内的交联; 并且填料是非导电填料。

10. 发明申请

US20100286309A1 THERMOSETTING RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME 有权
标题翻译：热固性树脂组合物及其制备方法
公开(公告)号：US20100286309A1
公开(公告)日：2010-11-11
申请号：US12840025
申请日：2010-07-20
申请人： Toru NOGUCHI , Akira Magario
发明人： Toru NOGUCHI , Akira Magario
IPC分类号： C08J3/20
CPC分类号： B82Y30/00 , C08G59/027 , C08G59/34 , C08G59/4035 , C08K3/04 , C08K3/041 , C08K7/06 , C08K9/08 , C08L63/00 , C08L63/08 , C08L2666/22 , C08K3/046 , C08L25/10
摘要： A thermosetting resin composition including: a matrix including a thermosetting resin and an elastomer; and carbon nanofibers dispersed in the matrix. The elastomer includes an unsaturated bond or a group having affinity to the carbon nanofibers.
摘要翻译：一种热固性树脂组合物，其包含：包含热固性树脂和弹性体的基体; 和分散在基质中的碳纳米纤维。弹性体包括不饱和键或对碳纳米纤维具有亲和性的基团。

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