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1. 发明公开

US20240271313A1 PLATING APPARATUS 审中-公开
公开(公告)号：US20240271313A1
公开(公告)日：2024-08-15
申请号：US18017613
申请日：2022-06-17
申请人： EBARA CORPORATION
发明人： Masaki TOMITA , Kentaro YAMAMOTO
IPC分类号： C25D21/08 , C25D17/02 , C25D17/06 , C25D21/12
CPC分类号： C25D21/08 , C25D17/02 , C25D17/06 , C25D21/12
摘要： Provided is a plating apparatus that allows cleaning a contact cleaning member.
The plating apparatus includes: a plating tank configured to house a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward, the substrate holder including a contact member for feeding power to the substrate; a contact cleaning member 482 for discharging a cleaning liquid to the contact member while the contact cleaning member is at a cleaning position between the plating tank and the substrate holder; a driving mechanism 476 configured to move the contact cleaning member 482 between the cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover an upper portion of the contact cleaning member 482 while the contact cleaning member 482 is at the retracted position.

2. 发明公开

US20240052501A1 TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY 审中-公开
公开(公告)号：US20240052501A1
公开(公告)日：2024-02-15
申请号：US18259231
申请日：2021-11-22
申请人： ISHIHARA CHEMICAL CO., LTD.
发明人： Masaru HATABE , Akihiro YOSHIZAWA , Takahiro TANAKA
IPC分类号： C23G1/02 , C25D21/08 , C25D5/48
CPC分类号： C23G1/02 , C25D21/08 , C25D5/48
摘要： A treatment method is for preventing compound contaminations derived from Sn or an Sn alloy, which have precipitated on members, such as a substrate and a conveyance tool, from accumulating after plating with Sn or the Sn alloy. The method includes washing at least one of the members used in a series of plating treatment steps with an acidic solution immediately after the plating with Sn or the Sn alloy. The acidic solution contains at least one acid or salt thereof having a pH of 5 or lower.

3. 发明授权

US11814744B2 Substrate cleaning components and methods in a plating system 有权
公开(公告)号：US11814744B2
公开(公告)日：2023-11-14
申请号：US16370265
申请日：2019-03-29
申请人： Applied Materials, Inc.
发明人： Nolan Zimmerman , Gregory J. Wilson , Andrew Anten , Richard W. Plavidal , Eric J. Bergman , Tricia Youngbull , Timothy Gale Stolt , Sam Lee
IPC分类号： C25D21/08 , C25D5/48 , H01L21/02 , C25D7/12 , C25D17/00 , H01L21/288
CPC分类号： C25D21/08 , C25D5/48 , C25D7/12 , C25D17/001 , H01L21/02068 , H01L21/2885
摘要： Systems for cleaning electroplating system components may include an electroplating apparatus including a plating bath vessel. The electroplating apparatus may include a rinsing frame extending above the plating bath vessel. The rinsing frame may include a rim extending circumferentially about an upper surface of the plating bath vessel and defining a rinsing channel between the rim and the upper surface of the plating bath vessel. The electroplating apparatus may also include a rinsing assembly including a splash guard that is translatable from a recessed first position to a second position extending at least partially across an access to the plating bath vessel. The rinsing assembly may also include a fluid nozzle extending from the rinsing frame.

4. 发明申请

US20180355507A1 PREVENT AND REMOVE ORGANICS FROM RESERVOIR WELLS 审中-公开
公开(公告)号：US20180355507A1
公开(公告)日：2018-12-13
申请号：US16108545
申请日：2018-08-22
申请人： International Business Machines Corporation
发明人： Charles L. Arvin , Glen N. Biggs , Phillip W. Palmatier , Joseph C. Sorbello , Tracy A. Tong , Freddie Torres
IPC分类号： C25D21/18 , C25D21/10 , C25D17/02 , C25D21/08
CPC分类号： C25D21/18 , C25D17/02 , C25D21/08 , C25D21/10
摘要： Plating bath and well structures and methods are described to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing up the reservoir wall. An electroplating apparatus includes a vessel holding a liquid solution including metal plating material and an organic species, and a method of operating an electroplating apparatus. The apparatus is designed with plating bath and structures and methods to stop the organic compounds present in plating reservoir wells or bath solution from rising, i.e., climbing or wicking up the inner surfaces of reservoir walls, and to wash them back down on a continuous or cyclical basis in order to maintain a concentration of organic compounds in the plating solution within upper and lower specification limits.

5. 发明申请

US20170370016A1 CLEANING APPARATUS, PLATING APPARATUS USING THE SAME, AND CLEANING METHOD 审中-公开
公开(公告)号：US20170370016A1
公开(公告)日：2017-12-28
申请号：US15636041
申请日：2017-06-28
申请人： EBARA CORPORATION
发明人： Junitsu YAMAKAWA
IPC分类号： C25D17/00 , H01L21/02 , B08B5/02 , B08B3/04 , C25D21/08 , B08B3/02 , H01L21/288
CPC分类号： C25D17/001 , B08B3/022 , B08B3/04 , B08B5/023 , C25D21/08 , H01L21/02068 , H01L21/2885 , H05K3/0085 , H05K3/26 , H05K2203/075
摘要： A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.

6. 发明申请

US20170231328A1 CARBORUNDUM WEAR-RESISTANT SHOE SPIKE AND PREPARATION METHOD THEREOF 审中-公开
公开(公告)号：US20170231328A1
公开(公告)日：2017-08-17
申请号：US14907136
申请日：2015-08-31
申请人： DONGGUAN SHING HING METAL MANUFACTURING CO., LTD.
发明人： Jinxiong TANG , Qianhong PENG
IPC分类号： A43C15/00 , C25D21/08 , C25D5/14 , C25D15/00 , A43B5/00 , C25D3/12
CPC分类号： A43C15/00 , A43B5/00 , A43C15/16 , C25D3/12 , C25D5/14 , C25D5/48 , C25D5/54 , C25D11/38 , C25D15/00 , C25D21/08
摘要： The present invention belongs to the technical field of shoe spikes, and more particularly relates to a carborundum wear-resistant shoe spike. The carborundum wear-resistant shoe spike comprises a shoe spike main body and a nickel coating attached to the surface of the shoe spike main body; the surface of the shoe spike main body is also provided with a carborundum layer, and the nickel coating is disposed between the shoe spike main body and the carborundum layer. Compared with the prior art, the present invention lies in that the outer surface of the nickel coating is provided with the carborundum layer, and since the carborundum layer has the characteristics of good toughness, high hardness, good wear resistance and the like, the wear resistance property of the shoe spike can be greatly improved, and the service life of sports shoes using the shoe spike is prolonged.

7. 发明申请

US20160265135A1 METHOD OF CLEANING SUBSTRATE HOLDER 审中-公开
标题翻译：清洗基板支架的方法
公开(公告)号：US20160265135A1
公开(公告)日：2016-09-15
申请号：US15163588
申请日：2016-05-24
申请人： EBARA CORPORATION
发明人： Jumpei FUJIKATA , Masashi SHIMOYAMA
IPC分类号： C25D21/08 , C25D17/06 , B08B3/08
CPC分类号： C25D21/08 , B08B3/08 , C25D5/12 , C25D17/001 , C25D17/06
摘要： A plating apparatus includes: a plating bath configured to store a plating solution therein; a substrate transport device configured to remove a substrate before plating from a substrate cassette and return the substrate after plating to the substrate cassette; a substrate holder configured to detachably hold the substrate with a sealing member sealing a peripheral portion of the substrate and immerse the substrate in the plating solution in the plating bath; a dummy substrate arranged in a position accessible by the substrate transport device; and a substrate holder cleaning bath configured to immerse the substrate holder in a cleaning liquid to clean the substrate holder when holding the dummy substrate with the sealing member sealing a peripheral portion of the dummy substrate.
摘要翻译：电镀装置包括：电镀液，其被配置为在其中存储电镀液; 基板输送装置，其被配置为在从基板盒进行电镀之前去除基板，并且在电镀之后将所述基板返回到所述基板盒; 衬底保持器，其被构造成用封闭所述衬底的周边部分的密封构件可拆卸地保持所述衬底，并将所述衬底浸入所述电镀液中的所述电镀溶液中; 布置在由所述基板输送装置可接近的位置的虚设基板; 以及衬底保持器清洗槽，其被配置为当用密封构件密封虚设衬底的周边部分来保持虚设衬底时，将衬底保持器浸入清洁液中以清洁衬底保持器。

8. 发明申请

US20160145761A1 AUTOMATED CLEANING OF WAFER PLATING ASSEMBLY 审中-公开
标题翻译：自动清洗滤波器组件
公开(公告)号：US20160145761A1
公开(公告)日：2016-05-26
申请号：US14949681
申请日：2015-11-23
申请人： Novellus Systems, Inc.
发明人： Steven T. Mayer , Thomas A. Ponnuswamy , Lee Peng Chua , Robert Rash
IPC分类号： C25D21/08 , C25D21/00 , C23G1/02
CPC分类号： C25D21/08 , B08B1/006 , B08B1/04 , B08B3/00 , C23G1/02 , C25D21/00 , C25D21/12 , G01N21/9501 , H01L21/67028 , H01L21/67046 , H01L21/6723
摘要： Disclosed herein are cleaning discs for cleaning one or more elements of a semiconductor processing apparatus. In some embodiments, the disc may have a substantially circular upper surface, a substantially circular lower surface, a substantially circular edge joining the upper and lower surfaces, and a plurality of pores opening at the edge and having an interior extending into the interior of the disc. In some embodiments, the pores are dimensioned such that a cleaning agent may be retained in the interior of the pores by an adhesive force between the cleaning agent and the interior surface of the pores. Also disclosed herein are cleaning methods involving loading a cleaning agent into a plurality of pores of a cleaning disc, positioning the cleaning disc within a semiconductor processing apparatus, and releasing cleaning agent from the plurality of pores such that elements of the apparatus are contacted by the released cleaning agent.
摘要翻译：这里公开了用于清洁半导体处理装置的一个或多个元件的清洁盘。在一些实施例中，盘可以具有基本上圆形的上表面，基本上圆形的下表面，连接上表面和下表面的基本圆形的边缘，以及在边缘处开口的多个孔，并且具有延伸到内侧的内部光盘。在一些实施例中，孔的尺寸使得清洁剂可以通过清洁剂和孔的内表面之间的粘合力保持在孔的内部。本文还公开了一种清洁方法，其包括将清洁剂装载到清洁盘的多个孔中，将清洁盘定位在半导体处理装置内，以及从多个孔释放清洁剂，使得装置的元件与释放清洁剂。

9. 发明授权

US08240061B2 Surface treatment apparatus 有权
标题翻译：表面处理装置
公开(公告)号：US08240061B2
公开(公告)日：2012-08-14
申请号：US13195053
申请日：2011-08-01
申请人： Hideki Nakada , Kouhei Kohama , Tetsuro Uemura , Takashi Sato , Ryosuke Hamada
发明人： Hideki Nakada , Kouhei Kohama , Tetsuro Uemura , Takashi Sato , Ryosuke Hamada
IPC分类号： F26B11/22
CPC分类号： C25D17/00 , C25D17/06 , C25D17/10 , C25D21/06 , C25D21/08
摘要： The surface treatment apparatus includes: a supply device for supplying an introduced workpiece to the inside of a treatment cell of a subsequent surface treatment device; a surface treatment device for supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell, thereby performing a surface treatment on the workpiece; a workpiece collection device for inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, thereby collecting the workpiece into a collection vessel; a drying device for receiving the collection vessel from the workpiece collection device, and exposing the workpiece within the collection vessel to air, thereby drying the workpiece; and a carrying device for carrying the treatment cell between the surface treatment devices, and between the surface treatment device and the workpiece device, wherein the surface treatment apparatus includes the one or more surface treatment devices.
摘要翻译：表面处理装置包括：供给装置，用于将引入的工件供给到随后的表面处理装置的处理槽的内部; 表面处理装置，用于在旋转处理池的同时向表面处理液体的内部供给表面处理液体，对工件进行表面处理; 工件收集装置，用于翻转处理池，并从下面用水喷射处理池内部，使工件流出，从而将工件收集到收集容器中; 干燥装置，用于从所述工件收集装置接收所述收集容器，并且将所述收集容器内的工件暴露于空气中，从而干燥所述工件; 以及用于在表面处理装置之间以及表面处理装置与工件装置之间承载处理槽的承载装置，其中表面处理装置包括一个或多个表面处理装置。

10. 发明授权

US08202404B2 Surface treatment apparatus 有权
公开(公告)号：US08202404B2
公开(公告)日：2012-06-19
申请号：US13195046
申请日：2011-08-01
申请人： Hideki Nakada , Kouhei Kohama , Tetsuro Uemura , Takashi Sato , Ryosuke Hamada
发明人： Hideki Nakada , Kouhei Kohama , Tetsuro Uemura , Takashi Sato , Ryosuke Hamada
IPC分类号： C25F3/30
CPC分类号： C25D17/00 , C25D17/06 , C25D17/10 , C25D21/06 , C25D21/08
摘要： The surface treatment apparatus includes: a supply device for supplying an introduced workpiece to the inside of a treatment cell of a subsequent surface treatment device; a surface treatment device for supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell, thereby performing a surface treatment on the workpiece; a workpiece collection device for inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, thereby collecting the workpiece into a collection vessel; a drying device for receiving the collection vessel from the workpiece collection device, and exposing the workpiece within the collection vessel to air, thereby drying the workpiece; and a carrying device for carrying the treatment cell between the surface treatment devices, and between the surface treatment device and the workpiece device, wherein the surface treatment apparatus includes the one or more surface treatment devices.

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