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1. 发明公开

US20240061342A1 ELECTRON BEAM LITHOGRAPHY WITH DYNAMIC FIN OVERLAY CORRECTION 审中-公开
公开(公告)号：US20240061342A1
公开(公告)日：2024-02-22
申请号：US18498437
申请日：2023-10-31
申请人： International Business Machines Corporation
发明人： Simon DAWES , Ernst Kratschmer
IPC分类号： G03F7/20
CPC分类号： G03F7/2061 , G03F9/70
摘要： An electron beam lithography (Ebeam) method for a wafer having alignment and device layers with a design alignment. The Ebeam method includes executing an Ebeam scan of predefined length and resolution based on the design alignment over a pattern edge of the device layer, generating a signal from reflections of the Ebeam scan off the pattern edge, determining an offset of the device layer relative to the alignment layer from a comparison of the signal and the design alignment and applying the offset to the design alignment to obtain an actual measurement of Ebeam alignment.

2. 发明申请

US20190235396A1 OPTICAL MEASUREMENT DEVICE AND METHOD 审中-公开
公开(公告)号：US20190235396A1
公开(公告)日：2019-08-01
申请号：US16338669
申请日：2017-09-25
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Zhiyong YANG , Bing XU , Yuzhi LI , Chang ZHOU
IPC分类号： G03F7/20 , G01B9/02
CPC分类号： G03F7/70775 , G01B9/02019 , G01B11/16 , G01B11/161 , G03F7/20 , G03F7/70783 , G03F9/70
摘要： An optical measurement device includes: a frame measurement unit for measuring magnitude of deformation of an optical detection platform frame, and a correction module for correcting the position of a substrate carrier and/or the position of an optical detection unit according to the magnitude of deformation of the optical detection platform frame, so as to eliminate an error in measurement of mark positions due to deformation of the frame. An optical measurement method is also disclosed.

3. 发明授权

US09910361B2 Exposure apparatus, exposure method, and device manufacturing method 有权
公开(公告)号：US09910361B2
公开(公告)日：2018-03-06
申请号：US15628982
申请日：2017-06-21
申请人： NIKON CORPORATION
发明人： Yuichi Shibazaki
IPC分类号： G03B27/54 , G03F7/20 , G03F9/00
CPC分类号： G03F7/70108 , G03F7/70058 , G03F7/70191 , G03F7/70516 , G03F7/70725 , G03F7/70758 , G03F7/70775 , G03F7/70975 , G03F9/70 , G03F9/7046 , Y10T29/49004
摘要： A movement area of a stage includes first-fifth areas. In the first area, three of four heads except for a first head respectively face three of four sections of a scale member except for a first section. In the second area, three of four heads except for a second head respectively face three of four sections except for a second section of the scale member. In the third area, three of four heads except for a third head respectively face three of four sections except for a third section of the scale member. In the fourth area, three of four heads except for a fourth head respectively face three of four sections of the scale member. In the fifth area, the four heads respectively face the four sections. During exposure, the stage is moved from one of the first-fourth areas to another of those areas via the fifth area.

4. 发明申请

US20180010906A1 OPTICAL MEASUREMENT ELEMENT FOR ALIGNMENT IN WAFER-LEVEL TESTING AND METHOD FOR ALIGNING AN OPTICAL PROBE USING THE SAME 审中-公开
公开(公告)号：US20180010906A1
公开(公告)日：2018-01-11
申请号：US15641384
申请日：2017-07-05
申请人： NEC CORPORATION , PHOTONICS ELECTRONICS TECHNOLOGY RESEARCH ASSOCIATION
发明人： Masatoshi TOKUSHIMA
IPC分类号： G01B11/14
CPC分类号： G01B11/14 , G01B11/272 , G02B6/00 , G02B6/305 , G02B6/34 , G02B6/422 , G02B6/4222 , G02B6/4225 , G03F9/70
摘要： An alignment optical measurement element includes a grating coupler, and a reflector coupled to the grating coupler. The alignment optical measurement element is arranged so that: the grating coupler diffracts an incident light in a first direction into a first diffracted light to propagate the first diffracted light as a first propagating light in a second direction, the reflector reflects the first propagating light into a second propagating light in a third direction opposite to the second direction; and the grating coupler diffracts the second propagating light into a second diffracted light to emit the second diffracted light as an emitted light in a fourth direction opposite to the first direction.

5. 发明申请

US20170329241A1 ALIGNMENT METHOD AND ALIGNMENT SYSTEM THEREOF 审中-公开
公开(公告)号：US20170329241A1
公开(公告)日：2017-11-16
申请号：US15587544
申请日：2017-05-05
申请人： Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
发明人： Qiang ZHANG , Jing An HAO
IPC分类号： G03F9/00 , G03F7/20
CPC分类号： G03F9/7015 , G03F7/70775 , G03F9/70 , G03F9/7003 , G03F9/7034 , G03F9/7073 , G03F9/7088 , H01L21/67288 , H01L21/68 , H01L23/544 , H01L2223/54426 , H01L2223/54453
摘要： An alignment method and an alignment system are provided. The alignment method includes: providing a wafer including an exposed surface, wherein an alignment mark and a reference point with a reference distance are provided on the exposed surface; placing the wafer on a reference plane; performing an alignment measurement on the exposed surface to obtain a projection distance, configured as a measurement distance, between the alignment mark and the reference point on the reference plane; performing a levelling measurement between the exposed surface and the reference plane to obtain levelling data of the exposed surface; obtaining a distance, configured as an expansion reference value, between the alignment mark and the reference point in the exposed surface; obtaining an expansion compensation value based on a difference between the expansion reference value and the reference distance; and adjusting parameters of a photolithography process based on the expansion compensation value for an alignment.

6. 发明申请

US20170285485A1 EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD 审中-公开
公开(公告)号：US20170285485A1
公开(公告)日：2017-10-05
申请号：US15628982
申请日：2017-06-21
申请人： NIKON CORPORATION
发明人： Yuichi SHIBAZAKI
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F7/70108 , G03F7/70058 , G03F7/70191 , G03F7/70516 , G03F7/70725 , G03F7/70758 , G03F7/70775 , G03F7/70975 , G03F9/70 , G03F9/7046 , Y10T29/49004
摘要： An exposure apparatus is equipped with an encoder system which measures positional information of a wafer stage by irradiating a measurement beam using four heads installed on the wafer stage on a scale plate which covers the movement range of the wafer stage except for the area right under a projection optical system. Placement distances of the heads here are each set to be larger than width of the opening of the scale plates, respectively. This allows the positional information of the wafer stage to be measured, by switching and using the three heads facing the scale plate out of the four heads according to the position of the wafer stage.

7. 发明申请

US20170160649A1 MOVABLE BODY DRIVE METHOD AND MOVABLE BODY DRIVE SYSTEM, PATTERN FORMATION METHOD AND APPARATUS, EXPOSURE METHOD AND APPARATUS, DEVICE MANUFACTURING METHOD, AND CALIBRATION METHOD 有权
公开(公告)号：US20170160649A1
公开(公告)日：2017-06-08
申请号：US15433269
申请日：2017-02-15
申请人： NIKON CORPORATION
发明人： Yuichi SHIBAZAKI
IPC分类号： G03F7/20
CPC分类号： G03F7/70775 , G01B21/042 , G03F7/70341 , G03F7/70483 , G03F7/70716 , G03F7/70725 , G03F7/70975 , G03F9/70 , G03F9/7046 , G03F9/7049 , H01L21/68 , H01L21/681 , Y10T29/49002
摘要： A substrate is exposed with an illumination light via a projection optical system. A stage that holds the substrate moves below the projection optical system. A measurement system measures positional information of the stage with a plurality of heads that face a grating section. Movement of the stage is controlled based on the positional information measured with the measurement system, while compensating for a measurement error of the measurement system that occurs due to the heads.

8. 发明授权

US09507267B2 Exposure apparatus, exposure method, and device manufacturing method 有权
标题翻译：曝光装置，曝光方法和装置制造方法
公开(公告)号：US09507267B2
公开(公告)日：2016-11-29
申请号：US15040875
申请日：2016-02-10
申请人： NIKON CORPORATION
发明人： Yuichi Shibazaki
IPC分类号： G03B27/42 , G03B27/54 , G03F7/20 , G03F9/00
CPC分类号： G03F7/70108 , G03F7/70058 , G03F7/70191 , G03F7/70516 , G03F7/70725 , G03F7/70758 , G03F7/70775 , G03F7/70975 , G03F9/70 , G03F9/7046 , Y10T29/49004
摘要： An exposure apparatus comprises a metrology frame that supports a projection optical system, a first drive system that drives a first stage, a second drive system that drives a second stage, a first encoder system that measures positional information of the first stage, a second encoder system having four heads and measures positional information of the second stage, and a controller. The controller controls the first drive system based on measurement information of the first encoder system and the second drive system based on measurement information of the second encoder system for scanning exposure of a substrate. The controller also controls the second drive system based on correction information for compensating for a measurement error of the second encoder system which occurs due to performing drive control of the second stage and positional information.
摘要翻译：曝光装置包括支撑投影光学系统的计量框架，驱动第一平台的第一驱动系统，驱动第二平台的第二驱动系统，测量第一平台的位置信息的第一编码器系统，第二编码器具有四个头并且测量第二阶段的位置信息的系统，以及控制器。基于第二编码器系统的测量信息，控制器基于第一编码器系统和第二驱动系统的测量信息来控制第一驱动系统，用于扫描基板的曝光。控制器还基于用于补偿由于执行第二级的驱动控制和位置信息而发生的第二编码器系统的测量误差的校正信息来控制第二驱动系统。

9. 发明申请

US20160291484A1 EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD 审中-公开
公开(公告)号：US20160291484A1
公开(公告)日：2016-10-06
申请号：US15182166
申请日：2016-06-14
申请人： NIKON CORPORATION
发明人： Yuichi SHIBAZAKI
IPC分类号： G03F7/20
CPC分类号： G03F7/70108 , G03F7/70058 , G03F7/70191 , G03F7/70516 , G03F7/70725 , G03F7/70758 , G03F7/70775 , G03F7/70975 , G03F9/70 , G03F9/7046 , Y10T29/49004
摘要： An exposure apparatus is equipped with an encoder system which measures positional information of a wafer stage by irradiating a measurement beam using four heads installed on the wafer stage on a scale plate which covers the movement range of the wafer stage except for the area right under a projection optical system. Placement distances of the heads here are each set to be larger than width of the opening of the scale plates, respectively. This allows the positional information of the wafer stage to be measured, by switching and using the three heads facing the scale plate out of the four heads according to the position of the wafer stage.

10. 发明授权

US09429854B2 Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method 有权
公开(公告)号：US09429854B2
公开(公告)日：2016-08-30
申请号：US14459883
申请日：2014-08-14
申请人： NIKON CORPORATION
发明人： Yuichi Shibazaki
IPC分类号： G01B11/00 , G01B11/22 , G03B27/32 , G03B27/58 , H02K41/02 , H02K41/03 , G03F7/20 , H01L21/68 , G03F9/00 , G01B21/04
CPC分类号： G03F7/70775 , G01B21/042 , G03F7/70341 , G03F7/70483 , G03F7/70716 , G03F7/70725 , G03F7/70975 , G03F9/70 , G03F9/7046 , G03F9/7049 , H01L21/68 , H01L21/681 , Y10T29/49002
摘要： A controller measures positional information of a stage within an XY plane using three encoders which at least include one each of an X encoder and a Y encoder of an encoder system, and the stage is driven in the XY plane, based on measurement results of the positional information and positional information (p1, q1), (p2, q2), and (p3, q3) in a surface parallel to the XY plane of a head (an encoder) used for measurement of the positional information. Accordingly, it becomes possible to control the movement of the stage with good precision, while switching the head (the encoder) used for control during the movement of the stage using the encoder system which includes a plurality of heads.

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