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    • 9. 发明授权
    • Memory device
    • 内存设备
    • US09368553B2
    • 2016-06-14
    • US14624920
    • 2015-02-18
    • Kabushiki Kaisha Toshiba
    • Yoshiaki Asao
    • H01L27/24G11C13/00H01L23/528H01L45/00
    • H01L27/2463G11C13/004G11C13/0069G11C2013/005G11C2013/0071H01L23/528H01L27/2436H01L45/065H01L45/1233H01L45/144H01L2924/0002H01L2924/00
    • According to one embodiment, a memory device includes a first active area, formed on the substrate, which extends in a third direction. The memory device also includes three gate electrodes, provided on the first active area, which extend in a second direction intersecting the third direction. The memory device also includes at least two or more upper-layer interconnects and at least two or more lower-layer interconnects, provided on the first active area, which extend in a first direction intersecting the second direction and the third direction. The memory device also includes first transistors of three, each of them is provided at the intersection point between the first active area and the three gate electrodes. The memory device also includes the first transistors of three are one device isolation transistor and two cell transistors.
    • 根据一个实施例,存储器件包括形成在衬底上的第一有源区,其在第三方向上延伸。 存储器件还包括设置在第一有源区上的三个栅电极,其在与第三方向相交的第二方向上延伸。 存储器件还包括至少两个或多个上层互连和至少两个或更多个下层互连,所述至少两个或更多个下层互连设置在第一有源区上,其沿与第二方向和第三方向相交的第一方向延伸。 存储器件还包括三个第一晶体管,它们中的每一个设置在第一有源区和三个栅电极之间的交点处。 存储器件还包括三个的第一晶体管是一个器件隔离晶体管和两个单元晶体管。