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    • 5. 发明授权
    • Memory scrubbing in third dimension memory
    • 第三维存储器中的内存擦除
    • US08271855B2
    • 2012-09-18
    • US12653896
    • 2009-12-18
    • Robert Norman
    • Robert Norman
    • G11C29/00
    • G11C13/0064G11C11/56G11C13/004G11C13/0069G11C29/00G11C2013/0054G11C2211/5634G11C2211/5645G11C2213/71
    • A method for memory scrubbing is provided. In this method, a first resistance of a reference memory element is read. A second resistance of a memory element also is read. A difference between the first resistance and the second resistance is sensed and a programming error associated with the second resistance is detected based on the difference. Each memory element is non-volatile and re-writeable, and can be positioned in a two-terminal memory cell that is one of a plurality of memory cells positioned in a two-terminal cross-point memory array. Active circuitry for performing the memory scrubbing can be fabricated FEOL in a logic layer and one or more layers of the two-terminal cross-point memory arrays can be fabricated BEOL over the logic layer. Each memory cell can optionally include non-ohmic device (NOD) electrically in series with the memory element and the two terminals of the memory cell.
    • 提供了一种用于记忆擦洗的方法。 在该方法中,读取参考存储元件的第一电阻。 还读取存储元件的第二电阻。 感测到第一电阻和第二电阻之间的差异,并且基于该差异检测与第二电阻相关联的编程误差。 每个存储器元件是非易失性的和可重写的,并且可以被定位在位于两端交叉点存储器阵列中的多个存储单元之一的两端存储单元中。 可以在逻辑层中制造用于执行存储器擦除的有源电路,并且可以在逻辑层上制造两端的交叉点存储器阵列的一层或多层BEOL。 每个存储器单元可以可选地包括与存储器单元和存储单元的两个端子串联的非欧姆器件(NOD)。