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    • 10. 发明授权
    • Method for etching insulating film and method for manufacturing semiconductor optical device
    • 绝缘膜的蚀刻方法及半导体光学元件的制造方法
    • US08652862B2
    • 2014-02-18
    • US13223586
    • 2011-09-01
    • Yukihiro Tsuji
    • Yukihiro Tsuji
    • H01L21/00
    • H01S5/12H01S5/2086H01S5/2222H01S5/2275
    • A method for etching an insulating film includes the steps of forming an insulating film; forming a first resin layer composed of a non-silicon-containing resin on the insulating film; forming a pattern including projections and recesses in the first resin layer; forming a second resin layer composed of a silicon-containing resin to cover the projections and the recesses of the pattern in the first resin layer; etching the second resin layer by reactive ion etching with etching gas containing CF4 gas and oxygen gas until the projections of the first resin layer are exposed, a Si component of the second resin layer being oxidized in etching the second resin layer; selectively etching the first resin layer until the insulating film is exposed using as a mask the second resin layer buried in the recesses of the first resin layer to form a resin layer mask; and etching the insulating film using the resin layer mask. Further, in the step of etching the second resin layer, the reactive ion etching is performed under applying a self-bias voltage so that a Si product is removed, the Si product being provided from the Si component remaining in the second resin layer without being oxidized.
    • 蚀刻绝缘膜的方法包括形成绝缘膜的步骤; 在绝缘膜上形成由非含硅树脂构成的第一树脂层; 在第一树脂层中形成包括凸起和凹陷的图案; 形成由含硅树脂构成的第二树脂层,以覆盖第一树脂层中的图案的突起和凹部; 用包含CF 4气体和氧气的蚀刻气体进行反应离子蚀刻来蚀刻第二树脂层,直到第一树脂层的突起露出,第二树脂层的Si成分在蚀刻第二树脂层时被氧化; 选择性地蚀刻第一树脂层直到绝缘膜作为掩模曝露在第一树脂层的凹陷中的第二树脂层以形成树脂层掩模; 并使用树脂层掩模蚀刻绝缘膜。 此外,在蚀刻第二树脂层的步骤中,在施加自偏压下进行反应离子蚀刻,从而除去Si产物,Si产物由残留在第二树脂层中的Si成分提供而不是 氧化