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1. 发明申请

US20170310303A1 BULK ACOUSTIC WAVE (BAW) RESONATOR STRUCTURE 审中-公开
公开(公告)号：US20170310303A1
公开(公告)日：2017-10-26
申请号：US15135254
申请日：2016-04-21
申请人： Avago Technologies General IP (Singapore) Pte. Ltd.
发明人： Robert Thalhammer , Alexandre Shirakawa , Thomas Faust , Phil Nikkel
IPC分类号： H03H9/58
CPC分类号： H03H9/02118 , H03H9/02102 , H03H9/02125 , H03H9/173 , H03H9/58 , H03H9/582
摘要： A bulk acoustic wave (BAW) resonator comprises: a first electrode; a second electrode comprising a plurality of sides, wherein at least one of the sides is a connection side; a piezoelectric layer disposed between the first and second electrodes, and an acoustic reflective element disposed beneath the first electrode, the second electrode and the piezoelectric layer, wherein an overlap of the reflective element, the first electrode, the second electrode, and the piezoelectric layer defines an active area of the acoustic resonator; a bridge adjacent to a termination of the active area of the BAW resonator; and a discontinuity disposed in the bridge.

2. 发明授权

US07479685B2 Electronic device on substrate with cavity and mitigated parasitic leakage path 失效
标题翻译：衬底上的电子器件具有空腔和减轻的寄生泄漏路径
公开(公告)号：US07479685B2
公开(公告)日：2009-01-20
申请号：US11373434
申请日：2006-03-10
申请人： R. Shane Fazzio , Richard C. Ruby , Christopher P. Wade , Michael Louis Frank , David A. Feld
发明人： R. Shane Fazzio , Richard C. Ruby , Christopher P. Wade , Michael Louis Frank , David A. Feld
IPC分类号： H01L29/78
CPC分类号： H03H9/02118 , H03H3/02 , H03H9/02125 , H03H9/172
摘要： An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.
摘要翻译：电子设备。电子器件包括第一电极和涂层。电子器件制造在衬底上; 衬底具有在衬底的顶表面中产生的空腔; 并且第一电极电耦合到衬底。涂层涂覆在空腔中的基底表面的至少一部分，并且涂层的存在导致在第一电极和在基底上制造的附加电极之间的至少一个寄生泄漏路径的减轻。

3. 发明申请

US20040183400A1 Piezoelectric resonator apparatus with acoustic reflector 有权
标题翻译：具有声反射器的压电谐振器
公开(公告)号：US20040183400A1
公开(公告)日：2004-09-23
申请号：US10750225
申请日：2003-12-31
申请人： Infineon Technologies AG
发明人： Robert Aigner , Lueder Elbrecht , Stephan Marksteiner , Hans-Joerg Timme
IPC分类号： H01L041/08
CPC分类号： H03H9/175 , H03H9/02125
摘要： A resonator apparatus has a piezoelectric resonator as well as an acoustic reflector which has a layer having a high acoustic impedance and a layer having a low acoustic impedance. The thickness of one layer is set different from a quarter of the wavelength in this layer at the operating frequency due to technological limitations in the manufacturing of this layer, and the thickness of the other layer is set dependent from the one layer, such that a predetermined minimum quality of the acoustic reflector is attained.
摘要翻译：谐振器装置具有压电谐振器以及具有高声阻抗层的声反射器和具有低声阻抗的层。由于该层的制造中的技术限制，一层的厚度在工作频率上与该层中的波长的四分之一不同，并且另一层的厚度取决于一层，使得实现声反射器的预定最小质量。

4. 发明申请

US20040163244A1 Method of manufacturing and mounting electronic devices to limit the effects of parasitics 审中-公开
标题翻译：制造和安装电子设备以限制寄生效应的方法
公开(公告)号：US20040163244A1
公开(公告)日：2004-08-26
申请号：US10742916
申请日：2003-12-23
申请人： Agere Systems Inc.
发明人： Linus Albert Fetter , Yin-Huen Wong , Michael George Zierdt
IPC分类号： H05K003/34
CPC分类号： H03H9/172 , G01R31/2824 , H01L24/81 , H01L2224/8121 , H01L2224/81815 , H01L2924/01019 , H01L2924/14 , H03H3/02 , H03H9/02125 , Y10T29/42 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , H01L2924/00
摘要： A method of producing and mounting electronic devices to negate the effects of parasitics on device performance. In one aspect, the substrate surface of the device is coated with a thin, etch-resistant film during fabrication that acts as a barrier to allow removal of substrate material beneath the film, creating a suspended structure upon which the remaining layers of circuitry rest. Alternatively the device is made with a film that is integral to the device, and that acts as the supporting membrane. To mount the device on a carrier or package, solder bumps are applied near the ends of the conductors of the device, and the die is then secured to a carrier or package, and positioned so that leads extending from the conductors mate up with bonding strips on the carrier or package. The solder bumps are then reflowed or melted to establish electrical connection between leads of the device and corresponding bonding strips of the carrier. The resultant electronic device is essentially immune to the effects or parasitic capacitances and parasitic inductances, with the device as mounted being further configured so as to tune out any residual parasitics which may still exist after fabrication.
摘要翻译：一种制造和安装电子设备以消除寄生效应对设备性能的方法。在一个方面，在制造期间，器件的衬底表面涂覆有薄的耐蚀刻膜，其用作屏障以允许去除膜下方的衬底材料，产生悬挂结构，剩余的电路层在其上休息。或者，该装置由与装置成一体的膜制成，并且用作支撑膜。为了将器件安装在载体或封装上，焊料凸块在器件的导体的端部附近施加，然后将管芯固定到载体或封装上，并将其定位成使得从导体延伸的引线与接合条匹配在载体或包装上。焊料凸块然后被回流或熔化，以在器件的引线和载体的相应接合条之间建立电连接。所得到的电子器件基本上免受影响或寄生电容和寄生电感的影响，安装的器件被进一步配置以便调出在制造之后可能仍然存在的任何残留寄生效应。

5. 发明授权

US06377137B1 Acoustic resonator filter with reduced electromagnetic influence due to die substrate thickness 有权
标题翻译：声谐振器滤波器，由于芯片基板的厚度而降低了电磁影响
公开(公告)号：US06377137B1
公开(公告)日：2002-04-23
申请号：US09659254
申请日：2000-09-11
申请人： Richard C. Ruby
发明人： Richard C. Ruby
IPC分类号： H03H954
CPC分类号： H03H9/02125 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/16195 , H03H3/02 , H03H9/1014 , H03H9/564 , H03H2003/021 , Y10S438/959 , Y10T29/42 , H01L2924/00014
摘要： A plurality of acoustic resonators are manufactured in a batch process by forming cavities in a substrate and filling the cavities with a sacrificial layer. An FBAR membrane comprising a bottom electrode, a piezoelectric layer, and a top electrode is formed over each cavity and the sacrificial layer. The substrate is then thinned and the substrate is separated into a plurality of dice using a scribe and break process. The sacrificial layer is then removed and the FBAR filter is mounted in a package with thermal vias being thermal communication with underside of the FBAR filter. The production method improves thermal properties by increasing the efficiency of heat dissipation from the FBAR filter. In addition, electromagnetic interference is decreased by reducing the distance between a primary current flowing over the surface of the FBAR filter and an image current flowing in a ground plane beneath the FBAR filter.
摘要翻译：通过在衬底中形成空腔并用牺牲层填充空腔，以分批工艺制造多个声谐振器。在每个空腔和牺牲层上形成包括底电极，压电层和顶电极的FBAR膜。然后将基板变薄，并且使用划线和断裂工艺将基板分离成多个骰子。然后去除牺牲层，并且FBAR过滤器安装在具有与FBAR过滤器的下侧热连通的热通孔的封装中。该生产方法通过提高FBAR过滤器的散热效率来改善热性能。此外，通过减少在FBAR滤波器的表面上流过的初级电流与在FBAR滤波器下面的接地平面中流动的图像电流之间的距离减小电磁干扰。

6. 发明申请

US20160164488A1 BULK ACOUSTIC WAVE RESONATOR 有权
标题翻译：大容量声波谐振器
公开(公告)号：US20160164488A1
公开(公告)日：2016-06-09
申请号：US14918242
申请日：2015-10-20
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Jea Shik SHIN , Yeong Gyu LEE , Ho Soo PARK
IPC分类号： H03H9/02 , H03H9/17
CPC分类号： H03H9/171 , H03H9/02118 , H03H9/02125 , H03H9/132 , H03H9/17 , H03H9/173
摘要： A bulk acoustic wave resonator may include: a piezoelectric layer including a piezoelectric material; a first electrode disposed on one surface of the piezoelectric layer; a second electrode disposed on the another surface of the piezoelectric layer; and a frame disposed on the one surface of the piezoelectric layer and surrounding the first electrode, wherein the frame is spaced apart from the first electrode by a predetermined gap.
摘要翻译：体声波谐振器可以包括：包括压电材料的压电层; 设置在所述压电层的一个表面上的第一电极; 设置在所述压电层的另一个表面上的第二电极; 以及设置在所述压电层的一个表面上且围绕所述第一电极的框架，其中所述框架与所述第一电极间隔开预定的间隙。

7. 发明申请

US20110042764A1 APPARATUS COMPRISING A DEVICE AND METHOD FOR PRODUCING SAME 有权
标题翻译：包含装置的装置及其制造方法
公开(公告)号：US20110042764A1
公开(公告)日：2011-02-24
申请号：US12938568
申请日：2010-11-03
申请人： Klaus-Guenter Oppermann , Martin Franosch , Martin Handtmann
发明人： Klaus-Guenter Oppermann , Martin Franosch , Martin Handtmann
IPC分类号： H01L29/84
CPC分类号： H03H9/02125 , H01L21/6835 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/96 , H01L24/97 , H01L2221/68368 , H01L2224/0401 , H01L2224/11002 , H01L2224/16225 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01072 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/1421 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/00
摘要： An apparatus comprises a device layer structure, a device integrated into the device layer structure, an insulating carrier substrate and an insulating layer being continuously positioned between the device layer structure and the insulating carrier substrate, the insulating layer having a thickness which is less than 1/10 of a thickness of the insulating carrier substrate. An apparatus further comprises a device integrated into a device layer structure disposed on an insulating layer, a housing layer disposed on the device layer structure and housing the device, a contact providing an electrical connection between the device and a surface of the housing layer opposed to the device layer structure and a molding material surrounding the housing layer and the insulating layer, the molding material directly abutting on a surface of the insulating layer being opposed to the device layer structure.
摘要翻译：一种装置包括器件层结构，集成到器件层结构中的器件，绝缘载体衬底和绝缘层，其连续地位于器件层结构和绝缘载体衬底之间，绝缘层的厚度小于1 绝缘载体基板的厚度的1/10。一种装置还包括集成在设置在绝缘层上的器件层结构中的器件，设置在器件层结构上并容纳该器件的壳体层，提供该器件与壳体层相对的表面之间的电连接的触点所述器件层结构和围绕所述壳体层和所述绝缘层的模制材料，所述模制材料直接邻接在所述绝缘层的与所述器件层结构相对的表面上。

8. 发明授权

US07525399B2 Thin-film piezoelectric resonator, filter and voltage-controlled oscillator 有权
标题翻译：薄膜压电谐振器，滤波器和压控振荡器
公开(公告)号：US07525399B2
公开(公告)日：2009-04-28
申请号：US11376266
申请日：2006-03-16
申请人： Naoko Yanase , Kenya Sano , Takaaki Yasumoto , Ryoichi Ohara , Kazuhiko Itaya
发明人： Naoko Yanase , Kenya Sano , Takaaki Yasumoto , Ryoichi Ohara , Kazuhiko Itaya
IPC分类号： H03H9/54 , H03H9/15
CPC分类号： H03H3/02 , H03H9/02125 , H03H9/02157 , H03H9/564 , H03H9/568 , H03H2003/023 , H03H2003/025
摘要： A thin-film piezoelectric resonator includes a substrate, and first and second excitation portions. The substrate includes first and second cavities. The first excitation portion is disposed over the first cavity, and includes a first electrode, a first piezoelectric material and a second electrode laminated successively. An overlapping region among the first electrode, the first piezoelectric material and the second electrode defines a contour of a periphery of the first excitation portion. A first distance is defined as a distance from an end of the first excitation portion to an opening end of the first cavity. The second excitation portion is disposed over the second cavity, and includes a third electrode, a second piezoelectric material and a fourth electrode laminated successively. A second distance is defined as a distance from an end of the second excitation portion to an opening end of the second cavity and different from the first distance.
摘要翻译：薄膜压电谐振器包括基板以及第一和第二激励部分。衬底包括第一和第二腔。第一激励部分设置在第一腔上方，并且包括依次层压的第一电极，第一压电材料和第二电极。第一电极，第一压电材料和第二电极之间的重叠区域限定第一激励部分的周边的轮廓。第一距离被定义为从第一激励部分的端部到第一腔体的开口端的距离。第二激励部分设置在第二腔上，并且包括依次层压的第三电极，第二压电材料和第四电极。第二距离被定义为从第二激励部分的端部到第二腔体的开口端的距离，并且与第一距离不同。

9. 发明授权

US07321183B2 Film bulk acoustic resonator and method for manufacturing the same 失效
标题翻译：薄膜体声波谐振器及其制造方法
公开(公告)号：US07321183B2
公开(公告)日：2008-01-22
申请号：US10890989
申请日：2004-07-15
申请人： Yasuo Ebuchi , Takako Motai , Kenya Sano
发明人： Yasuo Ebuchi , Takako Motai , Kenya Sano
IPC分类号： H01L41/053 , H01L41/083
CPC分类号： H03H9/172 , H03H3/02 , H03H9/02125 , H03H9/02133 , H03H9/173 , H03H9/587
摘要： A film bulk acoustic resonator, includes first to fourth insulator patterns disposed apart from each other. The third and fourth insulator patterns are disposed opposite the second and first insulator patterns in relation to the first and second insulating patterns, respectively. A bottom conductive layer is disposed above the first and third insulator patterns spreading from a region between the first and second insulator patterns to the third insulator pattern. A piezoelectric film is provided on the bottom conductive layer, disposed above the region between the first and second insulating patterns. A top conductive layer is facing the bottom conductive layer so as to sandwich the piezoelectric film, spreading from the region between the first and second insulator patterns to the fourth insulator pattern.
摘要翻译：薄膜体声波谐振器包括彼此分开布置的第一至第四绝缘体图案。第三绝缘体图案和第四绝缘体图案分别相对于第一和第二绝缘图案与第二和第一绝缘体图案相对设置。底部导电层设置在从第一和第二绝缘体图案之间的区域延伸到第三绝缘体图案的第一和第三绝缘体图案之上。在底部导电层上设置压电薄膜，设置在第一和第二绝缘图案之间的区域之上。顶部导电层面向底部导电层，以夹持压电膜，从第一和第二绝缘体图案之间的区域延伸到第四绝缘体图案。

10. 发明授权

US06998940B2 Component operating with bulk acoustic waves and a method for producing the component 有权
标题翻译：使用体声波操作的部件和用于制造部件的方法
公开(公告)号：US06998940B2
公开(公告)日：2006-02-14
申请号：US10757841
申请日：2004-01-15
申请人： Thomas Metzger
发明人： Thomas Metzger
IPC分类号： H03H9/54 , H03H9/15 , H03H3/02
CPC分类号： H03H9/175 , H03H3/02 , H03H9/02125 , H03H9/584 , H03H9/589 , Y10T29/42
摘要： A component operating with bulk acoustic waves has a carrier substrate, a thin-film resonator and an acoustic mirror arranged between the resonator and carrier substrate. The acoustic mirror is formed by at least one high acoustic impedance layer, which is covered by a low acoustic impedance layer and the uppermost low impedance acoustic layer is planarized to form a flat planar surface on which the thin-film resonator is formed.
摘要翻译：使用体声波工作的部件具有布置在谐振器和载体基板之间的载体衬底，薄膜谐振器和声镜。声镜由至少一个高声阻抗层形成，其被低声阻抗层覆盖，并且最上面的低阻抗声层被平坦化以形成其上形成有薄膜谐振器的平坦平面。

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