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    • 2. 发明授权
    • Temperature sensor comprising a high-overtone bulk acoustic resonator
    • 温度传感器包括高泛音体声波谐振器
    • US09459156B2
    • 2016-10-04
    • US13980421
    • 2012-01-18
    • Sylvain Jean Ballandras
    • Sylvain Jean Ballandras
    • H03B5/30G01K11/26H03H9/15
    • G01K11/26G01K11/265H03H9/02078H03H9/15H03H9/172
    • This temperature sensor includes an HBAR resonator, a unit for determining the difference between two distinct resonance frequencies at a temperature T, measured between two electrodes of a same pair of the HBAR resonator and a unit for determining the temperature of the resonator from the difference in frequencies and from a one-to-one function providing the match between the temperature and the frequency difference. The resonator is formed by a stack of a first electrode, a transducer, a second electrode, and acoustic substrate and the cuts of the transducer and of the substrate are selected so as to obtain high electro-acoustic couplings and a difference in frequency temperature sensitivities between two distinct vibration modes co-existing within the resonator, greater than or equal to 1 ppm·K−1.
    • 该温度传感器包括HBAR谐振器,用于确定在同一对HBAR谐振器对的两个电极之间测量的在温度T处的两个不同谐振频率之间的差异的单元和用于从谐振器的温差确定谐振器的温度的单元 频率和一对一功能,提供温度和频率差之间的匹配。 谐振器由第一电极,换能器,第二电极和声学基板的叠层形成,并且选择换能器和基板的切口以获得高电声耦合和频率温度敏感度的差异 在谐振器内共存的两种不同振动模式之间,大于或等于1ppm·K-1。
    • 8. 发明授权
    • Method of fabrication an ultra-thin quartz resonator
    • 制造超薄石英谐振器的方法
    • US08769802B1
    • 2014-07-08
    • US12831028
    • 2010-07-06
    • David T. ChangRandall L. KubenaPamela R. Patterson
    • David T. ChangRandall L. KubenaPamela R. Patterson
    • H04R31/00
    • H03H9/172H03H3/04
    • A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.
    • 在本申请中提出了一种用于制造谐振器的方法。 该方法包括提供处理衬底,提供主体衬底,提供包括与第二表面相对的第一表面的石英衬底,将中介层膜施加到石英衬底的第一表面,将石英衬底接合到处理衬底,其中插入膜 设置在石英基板和手柄基板之间,使石英基板的第二表面变薄,去除一部分键合的石英基板以暴露中间层膜的一部分,将石英基板接合到主基板,并且移除手柄 基板和内插膜,从而释放石英基板。
    • 9. 发明申请
    • TEMPERATURE SENSOR COMPRISING A HIGH-OVERTONE BULK ACOUSTIC RESONATOR
    • 包含高音质大音量谐振器的温度传感器
    • US20140023109A1
    • 2014-01-23
    • US13980421
    • 2012-01-18
    • Sylvain, Jean Ballandras
    • Sylvain, Jean Ballandras
    • G01K11/26
    • G01K11/26G01K11/265H03H9/02078H03H9/15H03H9/172
    • This temperature sensor (2) includes an HBAR resonator (10), a unit (20) for determining the difference between two distinct resonance frequencies at a temperature T, measured between two electrodes of a same pair of the HBAR resonator and a unit (30) for determining the temperature of the resonator from the difference in frequencies and from a one-to-one function providing the match between the temperature and the frequency difference. The resonator (10) is formed by a stack of a first electrode (18), a transducer (12), a second electrode (19), and acoustic substrate (14) and the cuts of the transducer (12) and of the substrate (14) are selected so as to obtain high electro-acoustic couplings and a difference in frequency temperature sensitivities between two distinct vibration modes co-existing within the resonator, greater than or equal to 1 ppm·K−1.
    • 该温度传感器(2)包括HBAR谐振器(10),用于确定在同一对HBAR谐振器对的两个电极和单元(30)之间测量的在温度T处的两个不同谐振频率之间的差异的单元(20) ),用于根据频率差和从提供温度和频率差之间的匹配的一对一功能来确定谐振器的温度。 谐振器(10)由第一电极(18),换能器(12),第二电极(19)和声学基板(14)以及换能器(12)的切口和基板 (14),以便获得高谐振器内的两个不同振动模式之间的高电感耦合和频率温度敏感度差异,大于或等于1ppm·K-1。