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1. 发明授权

US07658860B2 Metal pattern and process for producing the same 失效
标题翻译：金属图案及其制造方法
公开(公告)号：US07658860B2
公开(公告)日：2010-02-09
申请号：US10568158
申请日：2005-01-13
申请人： Tohru Nakagawa
发明人： Tohru Nakagawa
IPC分类号： C03C15/00 , C03C25/68 , C25F3/00
CPC分类号： C25D5/022 , C23F1/02 , C23F1/14 , C23F1/18 , C23F1/30 , C23F1/40 , H01L21/0332 , H01L21/0337 , H01L21/32139 , H01L51/0019 , H01L51/0022 , H05K3/061 , H05K2201/015 , H05K2201/0239 , H05K2203/013 , H05K2203/0582 , H05K2203/0585 , H05K2203/122
摘要： A metal pattern of the present invention is a metal pattern (13′) formed on a surface of a substrate by etching, and a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n—, where n represents an integer) is formed on a surface of a metal film composing the metal pattern (13′), and a masking film (18) is formed by penetration of a molecule having a mercapto group (—SH) or a disulfide (—SS—) group into interstices between molecules composing the monomolecular film. The metal pattern is produced by: forming a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n—, where n represents an integer) on a surface of a metal film; forming a masking film by applying a solution in which a molecule having a mercapto group (—SH) or a disulfide (—SS—) group is dissolved over a surface of the monomolecular film so that the molecule having a mercapto group (—SH) or a disulfide (—SS—) group penetrates in interstices between molecules composing the monomolecular film; and etching the metal film by exposing the surface of the metal film to an etching solution so that a portion of the metal film in a region not covered with the masking film is removed.
摘要翻译：本发明的金属图案是通过蚀刻形成在基板的表面上的金属图案（13'），并且含有氟化烷基链（CF 3（CF 2）n - ，其中n表示整数）的单分子膜形成在构成金属图案（13'）的金属膜的表面和通过将具有巯基（-SH）或二硫化物（-SS-））基团的分子渗入分子之间的分子形成掩蔽膜（18）组成单分子膜。金属图案通过在金属膜的表面上形成含有氟化烷基链（CF 3（CF 2）n - ，其中n表示整数）的单分子膜; 通过将分子中具有巯基（-SH）或二硫键（-SS-））的分子溶解在单分子膜的表面上形成掩蔽膜，使得具有巯基的分子（-SH）或二硫化物（-SS-）基团穿透构成单分子膜的分子之间的间隙; 并且通过将金属膜的表面暴露于蚀刻溶液来蚀刻金属膜，从而去除未被掩模膜覆盖的区域中的金属膜的一部分。

2. 发明申请

US20090139421A1 Metal pattern and process for producing the same 失效
标题翻译：金属图案及其制造方法
公开(公告)号：US20090139421A1
公开(公告)日：2009-06-04
申请号：US10568158
申请日：2005-01-13
申请人： Tohru Nakagawa
发明人： Tohru Nakagawa
IPC分类号： B41N3/00
CPC分类号： C25D5/022 , C23F1/02 , C23F1/14 , C23F1/18 , C23F1/30 , C23F1/40 , H01L21/0332 , H01L21/0337 , H01L21/32139 , H01L51/0019 , H01L51/0022 , H05K3/061 , H05K2201/015 , H05K2201/0239 , H05K2203/013 , H05K2203/0582 , H05K2203/0585 , H05K2203/122
摘要： A metal pattern of the present invention is a metal pattern (13′) formed on a surface of a substrate by etching, and a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n—, where n represents an integer) is formed on a surface of a metal film composing the metal pattern (13′), and a masking film (18) is formed by penetration of a molecule having a mercapto group (—SH) or a disulfide (—SS—) group into interstices between molecules composing the monomolecular film. The metal pattern is produced by: forming a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n—, where n represents an integer) on a surface of a metal film; forming a masking film by applying a solution in which a molecule having a mercapto group (—SH) or a disulfide (—SS—) group is dissolved over a surface of the monomolecular film so that the molecule having a mercapto group (—SH) or a disulfide (—SS—) group penetrates in interstices between molecules composing the monomolecular film; and etching the metal film by exposing the surface of the metal film to an etching solution so that a portion of the metal film in a region not covered with the masking film is removed.
摘要翻译：本发明的金属图案是通过蚀刻形成在基板的表面上的金属图案（13'），并且含有氟化烷基链（CF 3（CF 2）n - ，其中n表示整数）的单分子膜形成在构成金属图案（13'）的金属膜的表面和通过将具有巯基（-SH）或二硫化物（-SS-））基团的分子渗入分子之间的分子形成掩蔽膜（18）组成单分子膜。金属图案通过在金属膜的表面上形成含有氟化烷基链（CF 3（CF 2）n - ，其中n表示整数）的单分子膜; 通过将分子中具有巯基（-SH）或二硫键（-SS-））的分子溶解在单分子膜的表面上形成掩蔽膜，使得具有巯基的分子（-SH）或二硫化物（-SS-）基团穿透构成单分子膜的分子之间的间隙; 并且通过将金属膜的表面暴露于蚀刻溶液来蚀刻金属膜，从而去除未被掩模膜覆盖的区域中的金属膜的一部分。

3. 发明申请

US20080003527A1 WIRING LINE STRUCTURE AND METHOD FOR FORMING THE SAME 有权
标题翻译：接线结构及其形成方法
公开(公告)号：US20080003527A1
公开(公告)日：2008-01-03
申请号：US11852365
申请日：2007-09-10
申请人： Tzeng-Guang Tsai , Kuo-Yu Huang , Hui-Fen Lin , Yu-Wei Liu
发明人： Tzeng-Guang Tsai , Kuo-Yu Huang , Hui-Fen Lin , Yu-Wei Liu
IPC分类号： G03C5/00 , B05D5/12 , C23C28/00
CPC分类号： H01L21/76885 , G02F2001/136295 , H01L21/76834 , H05K3/0023 , H05K3/064 , H05K3/108 , H05K3/388 , H05K2201/0108 , H05K2203/0571 , H05K2203/0585 , H05K2203/0597
摘要： The wiring line structure comprises a transparent substrate, a barrier layer, a metal layer, and a photosensitive protecting layer. The barrier layer and a metal layer are successively disposed on the transparent substrate. The photosensitive protecting layer is formed on the barrier layer and both sides of the metal layer. A method for fabricating the wiring line structure is also disclosed.
摘要翻译：布线线结构包括透明基板，阻挡层，金属层和光敏保护层。阻挡层和金属层依次设置在透明基板上。感光保护层形成在阻挡层和金属层的两侧。还公开了一种用于制造布线结构的方法。

4. 发明授权

US06664029B1 Method of forming pattern 失效
标题翻译：形成图案的方法
公开(公告)号：US06664029B1
公开(公告)日：2003-12-16
申请号：US09582557
申请日：2000-08-30
申请人： Genji Imai , Kengo Ohnishi , Hiroyuki Honma , Hideo Kogure
发明人： Genji Imai , Kengo Ohnishi , Hiroyuki Honma , Hideo Kogure
IPC分类号： G03F700
CPC分类号： H01J11/44 , G03F7/0007 , G03F7/094 , G03F7/30 , H05K1/0306 , H05K3/28 , H05K2203/0585
摘要： A pattern-forming method which comprises the following steps: (1) laminating an actinic ray-curable coating film layer onto the surface of an insulating film-forming resin layer. (2) irradiating directly or through a photomask an actinic ray or host wave thereonto so as to obtain a predetermined pattern. (3) subjecting the actinic ray-curable coating film layer to a developing treatment to form a resist pattern coating film consisting of the actinic ray-curable coating film layer, (4) and subjecting the insulating film-forming resin layer to a developing treatment, followed by removing.
摘要翻译：一种图案形成方法，包括以下步骤：（1）将光化学射线固化涂膜层层压到绝缘膜形成树脂层的表面上;（2）直接或通过光掩模照射光化射线或主波（3）使光化学射线固化性涂膜进行显影处理，形成由光化固化性涂膜层构成的抗蚀剂图案涂膜，（4），对绝缘体成膜树脂层进行显影处理，然后除去。

5. 发明授权

US06518160B1 Method of manufacturing connection components using a plasma patterned mask 有权
标题翻译：使用等离子体图案化掩模制造连接部件的方法
公开(公告)号：US06518160B1
公开(公告)日：2003-02-11
申请号：US09245227
申请日：1999-02-05
申请人： Joseph Fjelstad , Belgacem Haba , David Light
发明人： Joseph Fjelstad , Belgacem Haba , David Light
IPC分类号： H01L2144
CPC分类号： H01L21/486 , H05K3/0041 , H05K3/061 , H05K3/108 , H05K3/421 , H05K2201/0394 , H05K2203/0554 , H05K2203/0585
摘要： A connection component is made by providing an assembly comprising a base layer of a dielectric material, a metal layer overlying the base layer, and a top layer of a plasma-etchable material overlying the metal layer; forming openings in the top layer to produce a top layer mask; and forming first conductive elements from the metal layer by removing metal from regions of the metal layer aligned with the openings in the top layer mask. This method may be used to form a connection component having vias or bond windows formed therein for connection with other elements of a microelectronic device and conductive elements may be formed on either or both sides of the base layer.
摘要翻译：通过提供包括电介质材料的基底层，覆盖在基底层上的金属层和覆盖在金属层上的等离子体可蚀刻材料的顶层的组件来制造连接部件; 在顶层中形成开口以产生顶层掩模; 以及通过从与顶层掩模中的开口对准的金属层的区域中去除金属，从金属层形成第一导电元件。该方法可以用于形成具有形成在其中的通孔或接合窗口的连接部件，用于与微电子器件的其它元件连接，并且可以在基底层的一侧或两侧上形成导电元件。

6. 发明授权

US5010389A Integrated circuit substrate with contacts thereon for a packaging structure 失效
标题翻译：集成电路基板，其上具有用于封装结构的触点
公开(公告)号：US5010389A
公开(公告)日：1991-04-23
申请号：US529827
申请日：1990-05-29
申请人： Peter Gansauge , Volker Kreuter , Helmut Schettler
发明人： Peter Gansauge , Volker Kreuter , Helmut Schettler
IPC分类号： H01L21/60 , H01L21/48 , H05K1/11 , H05K3/06 , H05K3/24 , H05K3/38
CPC分类号： H01L21/4846 , H01L21/4853 , H05K3/243 , H01L2224/0401 , H01L2224/0603 , H01L2224/1403 , H05K1/113 , H05K2201/0347 , H05K2201/0367 , H05K2203/0574 , H05K2203/0585 , H05K3/061 , H05K3/388
摘要： An integrated circuit chip packaging structure comprising a substrate, preferably a semiconductor base substrate, a conductive layer on said substrate in regions where connections to metallization layers of the substrate are formed, solder balls and gold bumps connected to said conductive layer in said regions of said conductive layer, and a solder stop layer on said conductive layer at least around said solder balls. The conductive layer, further comprises wiring lines. Further, a method of forming the structure is disclosed which uses only two masks for providing terminals for connecting the substrate to integrated circuits and to other substrates or to the printed circuit board and wiring lines. Thus, there is a need for one less metallization layer. The method is applicable to 200 mm wafers and allows two different packaging technologies (C-4 and TAB or wire-bonding) on the same substrate. Thus, packaging of VLSI circuits is improved.

7. 发明授权

US3734732A Polymetal printing plates 失效
标题翻译：聚合物印版
公开(公告)号：US3734732A
公开(公告)日：1973-05-22
申请号：US3734732D
申请日：1971-09-27
申请人： STALEY MFG CO A E
发明人： JONES R , THOMPSON W
IPC分类号： B41M5/00 , G03F7/28 , G03G11/00 , G03C5/00
CPC分类号： B41M5/0029 , G03F7/28 , G03G11/00 , H05K2203/0525 , H05K2203/0585 , H05K2203/1355
摘要： METHOD OF FORMING A POLYMETAL PRINGING PLATE WHICH COMPRISES THE STEPS OF EXPOSING A POLYMETAL PLATE HAVING A THIN HYDROPHOBIC METAL LAYER DISPOSED OVER A HYDROPHILIC METAL SURFACE, SAID HYDROPHOBIC METAL LAYER BEARING A LIGHT-SENSITIVE LAYER CAPABLE OF DEVELOPING A RD OF 1.0 TO 2.2, TO ACTINIC RADIATION TO PRODUCE A POTENTIAL RD OF 1.0 TO 2.2, DEVELOPING SAID LIGHT-SENSITIVE LAYER WITH WATER-INSOLUBLE POWDER PARTICLES USING PHYSICAL FORCE TO EMBED THE POWDER PARTICLES IN THE LIGHT-SENSITIVE LAYER, REMOVING NON-EMBEDDED POWDER PARTICLES, FUSING THE WATER-INSOLUBLE POWDER PARTICLES TO THE HYDROPHOBIC METAL SUBBING LAYER BY HEEATING, AND ETCHING THE HYDROPHOBIC METAL LAYER IN THE AREAS UNPROTECTED BY THE FUSED WATER-INSOLUBLE POWDER PARTICLES.

8. 发明授权

US2666008A Methods and apparatus for making conductive patterns of predetermined configuration 失效
标题翻译：用于制作预定配置的导电图案的方法和装置
公开(公告)号：US2666008A
公开(公告)日：1954-01-12
申请号：US17752450
申请日：1950-08-03
申请人： STROMBERG CARLSON CO
发明人： KURT ENSLEIN , HASKINS FRED J
IPC分类号： C23F1/02 , H01J29/08 , H05K3/06 , H05K3/20 , H05K3/38
CPC分类号： H01J29/08 , C23F1/02 , H05K3/061 , H05K3/205 , H05K3/386 , H05K2203/0117 , H05K2203/0585 , H05K2203/0726

9. 发明授权

US09622353B2 Imaging on substrates with alkaline strippable UV blocking compositions and aqueous soluble UV transparent films 有权
公开(公告)号：US09622353B2
公开(公告)日：2017-04-11
申请号：US14853364
申请日：2015-09-14
申请人： Rohm and Haas Electronic Materials LLC
发明人： Krishna Balantrapu , Brian D. Amos , Stephen McCammon
IPC分类号： G03F7/12 , H05K3/00 , G03F7/09 , G03F7/20 , G03F7/42 , G03F7/32 , G03F7/035 , G03F7/038 , G03F7/11 , H05K3/28 , H05K3/34
CPC分类号： H05K3/0079 , G03F7/035 , G03F7/038 , G03F7/09 , G03F7/091 , G03F7/11 , G03F7/20 , G03F7/2018 , G03F7/322 , G03F7/425 , H05K3/0076 , H05K3/0082 , H05K3/28 , H05K3/3452 , H05K2203/013 , H05K2203/0551 , H05K2203/0585
摘要： Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline strippable UV blocking composition is selectively applied to the surface of the UV transparent film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.

10. 发明申请

US20100243601A1 Multilayer wiring board and manufacturing method thereof 失效
标题翻译：多层布线板及其制造方法
公开(公告)号：US20100243601A1
公开(公告)日：2010-09-30
申请号：US12659893
申请日：2010-03-24
申请人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
发明人： Hiroyuki Uematsu , Kenichi Kawabata , Kenji Nagase
IPC分类号： C23F1/00 , H01B13/00
CPC分类号： H05K3/427 , H05K3/002 , H05K3/0035 , H05K3/0038 , H05K3/0041 , H05K3/0044 , H05K3/061 , H05K3/064 , H05K3/382 , H05K3/389 , H05K3/421 , H05K3/4652 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0394 , H05K2203/025 , H05K2203/0353 , H05K2203/054 , H05K2203/0585 , H05K2203/0733
摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.
摘要翻译：提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案。将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用作为掩模的图案化层，对底漆树脂层21进行图案化。使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

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