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1. 发明申请

US20170265311A1 METHOD OF FILLING VIAS WITH INK 审中-公开
公开(公告)号：US20170265311A1
公开(公告)日：2017-09-14
申请号：US15456528
申请日：2017-03-12
申请人： YARIV PINTO , Eli Asulin , Dotan Avera , Jankiel Kimelblat
发明人： YARIV PINTO , Eli Asulin , Dotan Avera , Jankiel Kimelblat
IPC分类号： H05K3/40 , H05K3/12 , H05K3/00
CPC分类号： H05K3/4053 , H05K3/007 , H05K3/125 , H05K3/1283 , H05K2203/0191 , H05K2203/0763 , H05K2203/107 , H05K2203/1105 , H05K2203/1126 , H05K2203/1147 , H05K2203/122
摘要： A method for selective processing of a panel, the method may include receiving a panel that has a bottom side and a top side and comprises a first group of drilled holes and a second group of drilled holes; at least partially sealing a bottom of any through hole of the first group; filling, by a selective filing process, any drilled hole of the first group that has a top opening to provide at least partially filled drilled holes of the first group without filling the second group of drilled holes; and plugging, by a selective plugging process, a top of any drilled hole of the first group.

2. 发明申请

US20160330834A1 SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC CONSTANT (Dk) CORES FOR USE IN PRINTED CIRCUIT BOARDS (PCBs), AND METHOD OF MAKING SAME 有权
公开(公告)号：US20160330834A1
公开(公告)日：2016-11-10
申请号：US15211809
申请日：2016-07-15
申请人： International Business Machines Corporation
发明人： Bruce J. Chamberlin , Joseph Kuczynski , Paula M. Nixa
IPC分类号： H05K1/03 , H05K1/11 , H05K3/42 , C03B37/075 , C03B37/022
CPC分类号： H05K1/0366 , C03B37/022 , C03B37/0756 , C09D139/04 , C09D143/04 , C09D183/04 , H05K1/024 , H05K1/115 , H05K3/42 , H05K3/429 , H05K2201/029 , H05K2201/09545 , H05K2203/1147
摘要： An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.

3. 发明授权

US09456496B2 Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same 有权
标题翻译：含有用于印刷电路板（PCB）的低介电常数（Dk）芯的低Dk芯玻璃纤维的基板及其制造方法
公开(公告)号：US09456496B2
公开(公告)日：2016-09-27
申请号：US14620880
申请日：2015-02-12
申请人： International Business Machines Corporation
发明人： Bruce J. Chamberlin , Joseph Kuczynski , Paula M. Nixa
IPC分类号： H05K1/03 , C09D143/04 , C09D139/04 , C09D183/00 , H05K1/11 , H05K3/42 , H05K3/46
CPC分类号： H05K1/0366 , C03B37/022 , C03B37/0756 , C09D139/04 , C09D143/04 , C09D183/04 , H05K1/024 , H05K1/115 , H05K3/42 , H05K3/429 , H05K2201/029 , H05K2201/09545 , H05K2203/1147
摘要： An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.
摘要翻译：用于印刷电路板（PCB）的增强型基板包括具有低介电常数（Dk）芯的低Dk芯玻璃纤维。在一些实施例中，低Dk芯玻璃纤维填充有低Dk流体，例如气体（例如空气，氮气和/或惰性气体）或液体。在基板中钻孔或以其他方式形成通孔之后，将硅烷施加到暴露在通孔中的中空玻璃纤维的端部，以密封中空玻璃纤维的芯内的低Dk流体。在一些实施方案中，低-Dk芯玻璃纤维用固体（例如低Dk树脂）填充。例如，可以设置中空玻璃纤维，然后以液态填充低Dk树脂。然后将中空玻璃纤维内的低Dk树脂固化成固态。

4. 发明申请

US20160186352A1 NON-METALLIC COATING AND METHOD OF ITS PRODUCTION 有权
标题翻译：非金属涂料及其生产方法
公开(公告)号：US20160186352A1
公开(公告)日：2016-06-30
申请号：US13984096
申请日：2012-02-07
申请人： Pavel SHASHKOV , Gennady KHOMUTOV , Aleksey YEROKHIN , Sergey USOV
发明人： Pavel SHASHKOV , Gennady KHOMUTOV , Aleksey YEROKHIN , Sergey USOV
IPC分类号： C25D5/18 , C25D21/12 , C25D11/30 , C25D11/26 , C25D15/00 , C25D11/04
CPC分类号： C25D5/18 , C25D11/00 , C25D11/005 , C25D11/02 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D15/00 , C25D21/12 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L2224/48227 , H01L2224/49109 , H01L2924/01327 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/021 , H05K1/053 , H05K1/115 , H05K1/18 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T428/1317 , Y10T428/24917 , Y10T428/249969 , H01L2924/00
摘要： A method of forming a non-metallic coating on a metallic substrate involves the steps of positioning the metallic substrate in an electrolysis chamber and applying a sequence of voltage pulses of alternating polarity to electrically bias the substrate with respect to an electrode. Positive voltage pulses anodically bias the substrate with respect to the electrode and negative voltage pulses cathodically bias the substrate with respect to the electrode. The amplitude of the positive voltage pulses is potentiostatically controlled, wheras the amplitude of the negative voltage pulses is galvanostatically controlled.
摘要翻译：在金属基材上形成非金属涂层的方法包括以下步骤：将金属基材定位在电解室中，并且施加一系列交替极性的电压脉冲以相对于电极使基板电偏置。正电压脉冲相对于电极阳极偏置衬底，负电压脉冲相对于电极阴极偏置衬底。正电压脉冲的幅度被电位控制，从而恒定地控制负电压脉冲的幅度。

5. 发明申请

US20160073497A1 CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20160073497A1
公开(公告)日：2016-03-10
申请号：US14943747
申请日：2015-11-17
申请人： BYD COMPANY LIMITED
发明人： Qiang XU , Xinping LIN
IPC分类号： H05K1/05 , H05K3/18 , H05K3/44
CPC分类号： H05K1/053 , C23C18/1608 , C23C18/1612 , C23C18/1868 , C23C18/1879 , C23C18/40 , C25D11/08 , C25D11/10 , C25D11/16 , C25D11/246 , H05K3/185 , H05K3/44 , H05K2201/0116 , H05K2203/0315 , H05K2203/107 , H05K2203/1147
摘要： Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
摘要翻译：本公开的实施例涉及电路板。电路板包括：铝基底板; 形成在所述铝基基板的至少一个表面上的氧化铝层; 以及形成在氧化铝层上的电路层。氧化铝层包括氧化铝和选自铬，镍，稀土金属及其组合的元素。

6. 发明申请

US20140268605A1 Electronic Package Mounting 有权
标题翻译：电子封装安装
公开(公告)号：US20140268605A1
公开(公告)日：2014-09-18
申请号：US13943833
申请日：2013-07-17
申请人： Lockheed Martin Corporation
发明人： Tom Rovere , James K. Lake , Rick Micha , Paul Coyne
IPC分类号： H05K1/18 , F16J15/02 , H05K3/30
CPC分类号： H05K3/301 , H01L2224/16225 , H05K3/3436 , H05K2201/2018 , H05K2201/2036 , H05K2203/1147 , Y10T29/4913
摘要： An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.
摘要翻译：一种用于将电子封装安装到印刷电路板（PCB）的组件和方法，其中垫圈被成形为紧密地配合在电子封装的周边边缘周围。

7. 发明授权

US08835761B2 Sealing structure 有权
标题翻译：密封结构
公开(公告)号：US08835761B2
公开(公告)日：2014-09-16
申请号：US12602979
申请日：2008-03-07
申请人： Takahiro Hayashi , Makoto Hora , Keiichi Miyajima
发明人： Takahiro Hayashi , Makoto Hora , Keiichi Miyajima
IPC分类号： H01J5/00 , H01J15/00 , H05K5/06 , H05K1/00 , H05K1/02
CPC分类号： H05K1/028 , H05K2201/09663 , H05K2203/1147
摘要： To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.
摘要翻译：为了在将密封构件整体形成在柔性布线板上时的热影响最小化，密封结构包括壳体，插入其中的柔性布线板以及与柔性布线板一体形成的密封构件，以密封地密封壳体和柔性布线板，柔性布线板包括由弹性材料制成的基底基板，形成在基底基板的表面上的导电印刷布线层和覆盖印刷布线层的表面的覆盖膜，并且印刷与密封构件交叉的布线层仅在与密封构件及其附近的交叉区域形成为多个分割印刷布线层。

8. 发明授权

US08821793B2 Sensor substrate and method of fabricating same 有权
标题翻译：传感器基板及其制造方法
公开(公告)号：US08821793B2
公开(公告)日：2014-09-02
申请号：US11924402
申请日：2007-10-25
申请人： Shaun Pendo , Rajiv Shah , Edward Chernoff
发明人： Shaun Pendo , Rajiv Shah , Edward Chernoff
IPC分类号： H05K1/14 , H05K1/18 , H05K3/28 , H05K3/40 , H05K1/03 , A61B5/00
CPC分类号： H05K3/28 , A61B5/0006 , H05K1/0306 , H05K3/4061 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/09472 , H05K2203/082 , H05K2203/085 , H05K2203/1147 , H05K2203/1476 , H05K2203/1572 , H05K2203/308
摘要： A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
摘要翻译：具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。通孔可以填充有导电材料，例如无油墨。由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。

9. 发明申请

US20130206445A1 WIRING UNIT AND SEALING STRUCTURE 有权
标题翻译：接线单元和密封结构
公开(公告)号：US20130206445A1
公开(公告)日：2013-08-15
申请号：US13879726
申请日：2011-10-14
申请人： Kazunori Miura , Takatoshi Suzuki
发明人： Kazunori Miura , Takatoshi Suzuki
IPC分类号： H01B7/04
CPC分类号： H01B7/04 , H01R12/77 , H01R13/5205 , H05K1/02 , H05K2201/2009 , H05K2203/1147
摘要： Sealing performance between a sealing member and a reinforcing plate adhered to a wiring unit is prevent from being deteriorated. An FPC 1 is integrated with a sealing member 2, and a cover 3 is attached to a front end portion. On upper and lower surfaces of the FPC 1, reinforcing plates 12 each having a shape of a rectangular flat plate are arranged and adhered in an opposing manner interposing the FPC 1. The sealing member 2 is formed of elastic material such as rubber, and is fixedly attached to the FPC 1 such that the sealing member 2 covers the reinforcing plates 12 adhered to the upper and lower surfaces of the FPC 1 together with the FPC 1 located along front edges and rear edges of the reinforcing plates 12.
摘要翻译：防止密封构件与附着于布线单元的加强板之间的密封性能劣化。 FPC1与密封构件2一体化，盖3附接到前端部。在FPC1的上表面和下表面上，具有矩形平板形状的加强板12以相对的方式布置并粘附在FPC1上。密封件2由诸如橡胶的弹性材料形成，并且是固定地连接到FPC1，使得密封构件2与位于加强板12的前边缘和后边缘处的FPC1一起覆盖粘附到FPC1的上表面和下表面的加强板12。

10. 发明授权

US08338714B2 Heat-radiating substrate and manufacturing method thereof 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US08338714B2
公开(公告)日：2012-12-25
申请号：US12852323
申请日：2010-08-06
申请人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
发明人： Jung Eun Kang , Hye Sook Shin , Ki Ho Seo
IPC分类号： H05K1/00
CPC分类号： H05K3/445 , H01L2924/0002 , H05K3/4608 , H05K3/465 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T29/49128 , H01L2924/00
摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.
摘要翻译：本文公开了一种散热基板。散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。此外，公开了制造散热基板的方法。

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