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1. 发明授权

US10056541B2 Metallic glass meshes, actuators, sensors, and methods for constructing the same 有权
公开(公告)号：US10056541B2
公开(公告)日：2018-08-21
申请号：US14690221
申请日：2015-04-17
申请人： Apple Inc.
发明人： Joseph C. Poole , Theodore A. Waniuk , Jeffrey L. Mattlin , Michael S. Nashner , Christopher D. Prest
IPC分类号： C22C45/00 , H01L41/18 , C22C1/00 , H01L41/12 , G01K13/00 , G01K3/04 , H01L41/20 , H01L41/33 , B22F1/00 , C22C33/00 , C22C45/02 , B22F3/10 , B22F3/105 , B22F3/11 , B33Y80/00
CPC分类号： H01L41/18 , B22F1/00 , B22F3/1028 , B22F3/1055 , B22F3/1103 , B22F2203/11 , B33Y80/00 , C22C1/002 , C22C33/003 , C22C45/00 , C22C45/02 , C22C2200/02 , G01K3/04 , G01K13/00 , H01L41/12 , H01L41/20 , H01L41/33 , Y02P10/295 , Y10T428/12361
摘要： Described herein are methods of constructing a part using metallic glass alloys, layer by layer, as well as metallic glass-forming materials designed for use therewith. Metallic glass meshes, metallic glass actuators, three dimensional metallic glass thermal history sensors, and methods of their manufacture are also disclosed.

2. 发明授权

US09976209B2 Sliding member and method for manufacturing the same 有权
公开(公告)号：US09976209B2
公开(公告)日：2018-05-22
申请号：US13982613
申请日：2012-02-09
申请人： Hirotaka Ito , Kenji Yamamoto
发明人： Hirotaka Ito , Kenji Yamamoto
IPC分类号： B21D39/00 , C23C14/02 , C04B41/00 , F16C33/24 , C23C16/02 , F16C33/04 , F16C33/06 , F16C33/16
CPC分类号： C23C14/022 , C04B41/00 , C23C16/0227 , F16C33/043 , F16C33/06 , F16C33/16 , F16C33/24 , F16C2202/02 , F16C2202/04 , F16C2240/40 , F16C2240/44 , Y10T428/12361 , Y10T428/12396 , Y10T428/24331 , Y10T428/24612
摘要： Provided is a sliding member having slidability and abrasion resistance both at satisfactory levels. This sliding member has a sliding surface including a base and a filling part. The base includes a first material and bears regularly arranged concavities. The filling part includes a second material and is arranged in the sliding surface to fill the concavities. The first material includes one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The second material includes at least one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The first and second materials differ from each other in at least one of frictional coefficient and hardness. The base and the filling part are substantially flush with each other in the sliding surface.

3. 发明授权

US09802241B2 Flat semi-finished product made of metal and methods for producing same as well as components thereof 有权
公开(公告)号：US09802241B2
公开(公告)日：2017-10-31
申请号：US13643118
申请日：2011-04-28
申请人： Gerd Zielke , Karl-Christian Regent
发明人： Gerd Zielke , Karl-Christian Regent
IPC分类号： B21H8/00 , E04C3/07 , E04C2/32 , E04C2/08
CPC分类号： B21H8/00 , E04C2/08 , E04C2/326 , E04C3/07 , Y10T428/12361 , Y10T428/1241
摘要： The invention relates, in a first aspect, to a flat semi-finished product made of metal (1), wherein said semi-finished product comprises at least out structured section (2) and at least one non-structured section, wherein said semi-finished product has non-structured edge sections (4) and exhibits a high strength. The semi-finished product made of metal (1) according to the invention is characterized in that it is designed as one piece and predetermined sections (2) are structured and predetermined sections are non-structured, wherein at least one non-structured section (4) is designed as a connecting region for positive or non-positive connection or for connecting by bonding. Furthermore, methods for producing the semi-finished products according to the invention are provided.

4. 发明授权

US09758890B2 Production method and device of surface roughened copper plate, and surface roughened copper plate 有权
公开(公告)号：US09758890B2
公开(公告)日：2017-09-12
申请号：US14337264
申请日：2014-07-22
申请人： Furukawa Electric Co., Ltd.
发明人： Hajime Watanabe , Sadao Ishihama , Kiyoteru Yamamoto , Takahiro Imai , Toshihiro Oyoshi
IPC分类号： C25D5/02 , C25D5/10 , C25D5/34 , C25F3/02 , H05K3/38 , C25D5/18 , C25D5/48 , C25D17/00 , C25D7/00 , H05K3/00 , C25D3/38 , H05K1/05
CPC分类号： C25D5/02 , C25D3/38 , C25D5/10 , C25D5/18 , C25D5/34 , C25D5/48 , C25D7/00 , C25D17/00 , C25F3/02 , H05K1/056 , H05K3/0085 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1572 , Y10S205/92 , Y10T428/12361
摘要： PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein.MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

5. 发明申请

US20160330833A1 ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING THE SAME 审中-公开
公开(公告)号：US20160330833A1
公开(公告)日：2016-11-10
申请号：US15187707
申请日：2016-06-20
申请人： CONTINENTAL CIRCUITS, LLC
发明人： Brian J. McDermott , Daniel McGowan , Ralph Leo Spotts, JR. , Sid Tryzbiak
IPC分类号： H05K1/03 , H05K3/10 , H05K1/02 , H05K3/00
CPC分类号： H05K1/032 , H05K1/0296 , H05K3/0017 , H05K3/0023 , H05K3/0055 , H05K3/10 , H05K3/381 , H05K3/4661 , H05K2203/0796 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/12361 , Y10T428/24331
摘要： A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry in a circuit board having multiple layers of circuitry.

6. 发明授权

US09382627B2 Methods and materials for anchoring gapfill metals 有权
标题翻译：锚定缝隙金属的方法和材料
公开(公告)号：US09382627B2
公开(公告)日：2016-07-05
申请号：US14515816
申请日：2014-10-16
申请人： Lam Research Corporation
发明人： Artur Kolics
IPC分类号： C23C18/18 , B32B15/04 , B32B3/30 , H01L21/768 , C23C18/52
CPC分类号： C23C18/1882 , B32B3/30 , B32B15/04 , C23C18/52 , H01L21/76831 , H01L21/76879 , Y10T428/12361 , Y10T428/12389 , Y10T428/24917
摘要： One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.
摘要翻译：本发明的一个方面包括制造电子设备的方法。根据一个实施例，所述方法包括提供具有与导电表面区域相邻的电介质氧化物表面区域的基板，将锚固化合物与电介质氧化物表面区域化学结合，以形成锚定层，从而使用导电表面积并使金属生长，使得锚定层也与金属结合。锚化合物具有至少一个能够与氧化物表面形成化学键的官能团，并且具有至少一个能够与金属形成化学键的官能团。本发明的另一方面是电子设备。本发明的第三方面是包含锚化合物的溶液。

7. 发明授权

US09331339B2 Perforated aluminium foil and manufacturing method thereof 有权
标题翻译：穿孔铝箔及其制造方法
公开(公告)号：US09331339B2
公开(公告)日：2016-05-03
申请号：US13499130
申请日：2010-09-22
申请人： Atsushi Konishi , Masashi Mehata
发明人： Atsushi Konishi , Masashi Mehata
IPC分类号： C22C21/00 , C22F1/00 , H01M4/66 , C22F1/04 , H01G11/68 , H01G11/70
CPC分类号： H01M4/661 , C22C21/00 , C22F1/00 , C22F1/04 , H01G11/68 , H01G11/70 , Y02E60/13 , Y10T29/301 , Y10T428/12361
摘要： An object of the present invention is to provide an aluminum foil having a plurality of through holes and a desired foil strength, and a manufacturing method thereof. The high-strength perforated aluminum foil of the present invention includes a plurality of through holes extending from a front surface to a back surface of the foil, and has: (1) a foil thickness of 50 μm or less; and (2) a tensile strength of [0.2×foil thickness (μm)] N/10 mm or more. The method of manufacturing a high-strength perforated aluminum foil of the present invention is characterized in that a perforated aluminum foil having a plurality of through holes is either embossed, or simultaneously stretched and bent.
摘要翻译：本发明的目的是提供一种具有多个通孔和所需箔强度的铝箔及其制造方法。本发明的高强度穿孔铝箔包括从箔的前表面延伸到后表面的多个通孔，并且具有：（1）50μm以下的箔厚度; 和（2）拉伸强度[0.2×箔厚（μm）] N / 10mm以上。本发明的高强度穿孔铝箔的制造方法的特征在于，具有多个通孔的多孔铝箔被压花或同时拉伸弯曲。

8. 发明授权

US09324966B2 Thin-film transparent conductive structure and devices made therewith 有权
标题翻译：薄膜透明导电结构和由其制成的器件
公开(公告)号：US09324966B2
公开(公告)日：2016-04-26
申请号：US13833161
申请日：2013-03-15
申请人： E I DU PONT DE NEMOURS AND COMPANY
发明人： Wei Wu
IPC分类号： H01L31/0224 , H01L51/52 , H01L31/18
CPC分类号： H01L51/5225 , H01L31/1884 , H01L51/5209 , H01L51/5234 , Y02E10/50 , Y10T428/12361 , Y10T428/24331
摘要： A transparent conductive structure useful in the fabrication of electrical, electronic, and optoelectronic devices is provided by a mesh-like metallic structure in the form of a thin film having a plurality of apertures, e.g. one having an average size of 250 nm to 425 nm as measured in the largest dimension and an average nearest-neighbor spacing of 300 nm to 450 nm. In another aspect, the metallic thin film has plural sublayers of different metals, and may have apertures up to 2 μm in size and an average nearest-neighbor spacing of up to 2.5 μm. The metallic thin film may be 20 to 200 nm thick, and may be formed on a flexible or rigid substrate or on a device itself. The structure exhibits a transparency enhanced over a value determined simply by the fraction of the area of the metallic film occupied by the apertures.
摘要翻译：用于制造电气，电子和光电器件的透明导电结构由具有多个孔的薄膜形式的网状金属结构提供，例如，一个具有250nm至425nm的平均尺寸，其最大尺寸和300nm至450nm的平均最近邻间距测量。另一方面，金属薄膜具有不同金属的多个子层，并且可以具有高达2μm的孔径和高达2.5μm的平均最近相邻间隔。金属薄膜可以是20至200nm厚，并且可以形成在柔性或刚性基底上或器件本身上。该结构显示出比由孔所占据的金属膜的面积的分数简单确定的值提高的透明度。

9. 发明申请

US20160104685A1 Improving the Strength of Micro-Bump Joints 审中-公开
标题翻译：提高微型接头的强度
公开(公告)号：US20160104685A1
公开(公告)日：2016-04-14
申请号：US14976927
申请日：2015-12-21
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Wen-Wei Shen , Chen-Shien Chen , Chen-Cheng Kuo , Ming-Fa Chen , Rung-De Wang
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L24/16 , H01L23/3157 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/03614 , H01L2224/0401 , H01L2224/05017 , H01L2224/05023 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/1146 , H01L2224/11823 , H01L2224/11831 , H01L2224/1191 , H01L2224/13005 , H01L2224/13018 , H01L2224/13019 , H01L2224/13076 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/1369 , H01L2224/16145 , H01L2224/16148 , H01L2224/16238 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2224/81815 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/35 , Y10T428/12361 , Y10T428/12396 , H01L2924/00 , H01L2924/00012 , H01L2924/01047 , H01L2924/206 , H01L2224/05552
摘要： A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.
摘要翻译：一种装置包括：包括金属凸块的工件; 以及具有直接在金属凸块上的部分的介电层。金属凸块和电介质层部分的表面形成界面。在金属凸块上方形成金属涂层并与金属凸块接触。金属表面从介电层上延伸到界面的下方。

10. 发明授权

US09303356B2 Film structures for self locking nonwoven industrial textile 有权
标题翻译：自锁无纺布工业纺织品的薄膜结构
公开(公告)号：US09303356B2
公开(公告)日：2016-04-05
申请号：US14432953
申请日：2013-10-01
申请人： AstenJohnson, Inc.
发明人： Allan R. Manninen
IPC分类号： D21F1/00 , B32B38/06 , B32B3/06 , B32B3/30 , F16B5/07 , B32B38/00 , B32B5/02 , B32B5/24 , B32B15/04 , B32B15/18 , B32B15/20 , B32B27/06 , B32B3/26 , B01D39/08 , B32B3/28 , B32B15/01 , B32B27/08 , B32B27/28 , B32B27/36 , D21F7/08 , D21F7/12
CPC分类号： D21F1/0036 , B01D39/083 , B32B3/06 , B32B3/266 , B32B3/28 , B32B3/30 , B32B5/022 , B32B5/24 , B32B15/011 , B32B15/016 , B32B15/04 , B32B15/18 , B32B15/20 , B32B27/06 , B32B27/08 , B32B27/281 , B32B27/36 , B32B38/0004 , B32B38/06 , B32B2250/02 , B32B2250/24 , B32B2309/10 , B32B2311/00 , B32B2437/00 , D21F7/083 , D21F7/12 , F16B5/07 , Y10T428/12361 , Y10T428/24322
摘要： A profiled film structure, textiles comprising at least two layers of the structure, and methods of making the structure and textiles. Each film layer is profiled with regularly arranged protrusions, separated by planar land areas. Portions of at least one side wall of the protrusions are slit to create apertures extending through the film and top members forming coplanar latching means extending over the apertures. When the upper surface of a first layer of the film is brought into contiguous relationship with the upper surface of a second layer of the film, and the protrusions of each of the respective layers are aligned between adjacent protrusions of the other layer, the latching means of each layer are received and retained within the apertures of the opposing layer, resulting in an efficiently assembled self-locking structure having selectable permeability for fluid flow through the structure.
摘要翻译：成型膜结构，包括至少两层结构的纺织品，以及制造结构和纺织品的方法。每个薄膜层被形成为具有规则排列的突出物，由平坦的陆地区域分开。突起的至少一个侧壁的部分被切割以产生延伸穿过膜的孔，并且顶部构件形成在孔上延伸的共面锁定装置。当膜的第一层的上表面与膜的第二层的上表面成为连续的关系，并且各层的突起在另一层的相邻突起之间排列时，锁定装置每个层被接收并保持在相对层的孔内，导致有效组装的自锁结构具有可选的渗透性，用于流过该结构的流体。

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