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1. 发明申请

US20180368275A1 CIRCUIT UNIT 审中-公开
公开(公告)号：US20180368275A1
公开(公告)日：2018-12-20
申请号：US16005979
申请日：2018-06-12
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Kosuke Sone , Takahiro Maruyama
IPC分类号： H05K5/06 , H05K5/00 , H05K5/03 , H05K5/02 , H05K7/20
CPC分类号： H05K5/065 , H05K5/0008 , H05K5/0082 , H05K5/0247 , H05K5/03 , H05K7/20436
摘要： A circuit unit (10) includes a circuit body (11) having a resin portion (12) covering a circuit, first terminals (15) projecting from one edge of the resin portion (12) and second terminals (16) projecting from another edge part of the resin portion (12). A fixing member (20) made of metal is configured to fix the circuit body (11) to a base member (BM) by being mounted on the base member (BM) while being held in contact with the resin portion (12). A cover (30) having receptacles (35, 36) is fit to mating connectors (50A, 50B) while covering the first and second terminals (15, 16). The cover (30) is configured to cover the circuit body (11) and the fixing member (20). The cover (30) is formed with an opening (33) for exposing the fixing member (20) to outside.

2. 发明申请

US20180255658A1 Electronic Control Device, and Manufacturing Method for Vehicle-Mounted Electronic Control Device 审中-公开
公开(公告)号：US20180255658A1
公开(公告)日：2018-09-06
申请号：US15759996
申请日：2016-08-05
申请人： Hitachi Automotive Systems, Ltd.
发明人： Yujiro KANEKO , Yoshio KAWAI , Toshiaki ISHII
IPC分类号： H05K5/06 , H05K1/18 , H05K5/02 , H05K7/20 , H05K5/00 , H05K9/00 , B29C65/70
CPC分类号： H05K5/065 , B29C65/70 , B29L2031/3481 , B60R16/02 , H01L23/29 , H05K1/181 , H05K3/28 , H05K5/00 , H05K5/0017 , H05K5/0034 , H05K5/0082 , H05K5/02 , H05K5/0204 , H05K7/20409 , H05K7/209 , H05K9/0049 , H05K2201/10522
摘要： Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.

3. 发明申请

US20180070450A1 PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：US20180070450A1
公开(公告)日：2018-03-08
申请号：US15797542
申请日：2017-10-30
申请人： Conti Temic microelectronic GmbH
发明人： Johannes Bock , Thomas Schmidt , Bernhard Schuch
IPC分类号： H05K1/18 , H05K3/28 , H05K3/30 , H05K3/00 , H05K1/02
CPC分类号： H05K1/181 , H05K1/0278 , H05K1/141 , H05K3/0044 , H05K3/284 , H05K3/303 , H05K3/366 , H05K5/0082 , H05K2201/09045 , H05K2201/10151 , H05K2201/10166 , H05K2203/302
摘要： The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.

4. 发明申请

US20180020558A1 Electronic Control Device 审中-公开
公开(公告)号：US20180020558A1
公开(公告)日：2018-01-18
申请号：US15538387
申请日：2016-01-08
申请人： Hitachi Automotive Systems, Ltd.
发明人： Masato SAITO , Yoshio KAWAI , Shoho ISHIKAWA
IPC分类号： H05K5/00 , H01R12/71 , H01R13/50 , H01R13/533 , B60R16/02
CPC分类号： H05K5/0082 , B60R16/02 , B60R16/0215 , F16H61/00 , H01R12/71 , H01R12/716 , H01R13/50 , H01R13/533 , H01R13/73 , H01R2201/26 , H02G3/16 , H05K5/0056 , H05K5/0069
摘要： Provided is an electronic control device that is easily assembled and with which it is possible to reduce the effects of vibration and external force applied from a connector. Electronic components are installed on a substrate. A base covers a surface of the substrate. A cover covers a surface of the substrate. A first connector, which is installed on the surface, connects to a connector fixed to an on-board transmission. A second connector, which is installed on the surface, connects to a connector of a harness. First vibration-suppressing parts, which are provided to the inside surface of the base facing the end surface of the first connector on the surface side, suppress the vibration of the first connector.

5. 发明授权

US09769945B2 Covering device for a contacting portion of a printed circuit board, control system for a mechatronic module and method for assembling a control system 有权
公开(公告)号：US09769945B2
公开(公告)日：2017-09-19
申请号：US14385093
申请日：2013-02-01
申请人： ZF Friedrichshafen AG
发明人： Josef Loibl , Herbert Wallner , Roland Friedl
IPC分类号： H05K1/11 , H05K5/03 , H01R13/52 , H05K5/00 , H01R43/20 , H05K7/14 , H01R29/00 , H01R12/00 , H01R13/62 , H01R13/648 , H01R12/50 , H01R12/72 , H01R13/6587 , H01R12/58
CPC分类号： H05K5/03 , H01R12/58 , H01R12/72 , H01R13/5202 , H01R13/521 , H01R13/6587 , H01R23/6886 , H01R23/6893 , H01R23/70 , H01R23/701 , H01R23/7015 , H01R23/7073 , H01R43/205 , H05K5/0082 , H05K7/14 , Y10T29/49147
摘要： A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.

6. 发明申请

US20170164490A1 AUTOMOTIVE ELECTRONIC DEVICE HAVING A COVER WITH FINS TO REDUCE GEL VIBRATION 审中-公开
公开(公告)号：US20170164490A1
公开(公告)日：2017-06-08
申请号：US14959345
申请日：2015-12-04
申请人： Continental Automotive Systems, Inc.
发明人： Jen-Huang Albert Chiou , David Manfredi , Daniel J. Bratek
IPC分类号： H05K5/00 , H05K7/14
CPC分类号： H05K5/0056 , B81B2201/0264 , H01L23/04 , H01L23/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05553 , H01L2224/05554 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48472 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/10158 , H01L2924/15151 , H01L2924/15153 , H01L2924/16195 , H01L2924/19105 , H01L2924/19107 , H05K5/0082 , H05K7/14 , H01L2224/45099 , H01L2924/0665
摘要： An automotive electronic device includes a pocket, which houses electronic components, bond wires connecting the electronic components, and a protective gel to encapsulate the electronic components and bond wires. A pocket cover has fins that protrude into the gel to reduce vibration of the gel and reduce vibration fatigue failure of the bond wires. The fins may: divide the gel into a plurality of cells; reduce the width of cells perpendicular to the bond wires; protrude deeper into the gel than the bond wires; and/or have differing shapes and/or depths.

7. 发明授权

US09642266B2 Electronic module for operation in a transmission 有权
公开(公告)号：US09642266B2
公开(公告)日：2017-05-02
申请号：US14352392
申请日：2012-09-04
申请人： Martin Gerhaeusser , Martin Kowatsch
发明人： Martin Gerhaeusser , Martin Kowatsch
IPC分类号： H05K5/06 , H05K5/04 , H05K5/00 , F16H61/00 , H05K5/02
CPC分类号： H05K5/0082 , F16H61/0006 , H05K5/0204 , H05K5/064
摘要： An electronic module for a vehicle includes a can housing and a circuit carrier having at least one connecting element. The circuit carrier is positioned in the can housing, and is cast with a cast material. The at least one connecting element protrudes from the cast material and is configured to connect at least one conductive element. The electronic module is positioned in the transmission and is configured to be operated.

8. 发明授权

US09596773B2 Electronic device with connector arrangement 有权
标题翻译：带连接器装置的电子设备
公开(公告)号：US09596773B2
公开(公告)日：2017-03-14
申请号：US15046616
申请日：2016-02-18
申请人： ZF Friedrichshafen AG
发明人： Josef Loibl
IPC分类号： H01R12/00 , H05K5/00 , H05K1/14 , H05K1/02
CPC分类号： H05K5/0082 , H05K1/0278 , H05K1/147 , H05K5/0034 , H05K2201/10363 , H05K2203/1327
摘要： An electronic unit including a plug assembly having at least one plug element comprising a plug base body having numerous plug pins, an assembly carrier printed circuit board, on which at least one electronic component is disposed, and is in electrical contact with at least one conductor path of the assembly carrier printed circuit board, a plug printed circuit board, onto which the plug assembly is attached, and is in electrical contact with at least one conductor path of the plug printed circuit board, and a cohesive cladding element, which seals the plug printed circuit board and at least one section of the assembly carrier printed circuit board against an external environment.
摘要翻译：一种电子单元，包括具有至少一个插塞元件的插头组件，所述插头元件包括具有许多插头销的插头基体，组装载体印刷电路板，至少一个电子元件设置在该组件载体印刷电路板上，并且与至少一个导体组装载体印刷电路板的路径，插头印刷电路板，插头组件附接到其上并与插头印刷电路板的至少一个导体路径电接触，以及粘合包层元件，其密封插头印刷电路板和组装架印刷电路板的至少一个部分抵抗外部环境。

9. 发明申请

US20160381817A1 Method for Producing an Electronic Module having an Interlockingly Connected Housing Part Element 审中-公开
标题翻译：一种具有连接壳体部件元件的电子模块的制造方法
公开(公告)号：US20160381817A1
公开(公告)日：2016-12-29
申请号：US15105997
申请日：2014-11-04
申请人： ROBERT BOSCH GMBH
发明人： Harald Ott , Gerhard Wetzel , Gerald Kammer
IPC分类号： H05K5/00 , B29C65/00 , B29C65/14 , B29C65/16 , H05K3/30 , H05K3/00
CPC分类号： H05K5/0082 , B29C65/1432 , B29C65/1632 , B29C65/1635 , B29C65/168 , B29C65/606 , B29C65/72 , B29C66/112 , B29C66/131 , B29C66/30322 , B29C66/322 , B29C66/53461 , B29C66/71 , B29C66/712 , B29C66/7212 , B29C66/73161 , B29C66/7392 , B29C66/7394 , B29C66/919 , B29K2309/08 , B29K2663/00 , B29K2677/00 , B29L2031/3481 , F16H61/0006 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2924/00014 , H01L2924/16151 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H05K3/0026 , H05K3/0032 , H05K3/284 , H05K3/303 , H05K2201/2018 , H05K2201/2072 , H01L2224/45099 , B29K2077/00 , B29K2063/00 , H01L2924/00
摘要： A method for producing an electronic module includes arranging a housing part element on a circuit board element after separately producing and preparing the housing part element. The housing part element is formed with a material that can be reversibly plasticized, such as a thermoplastic like polyamide. At least a portion of a surface of the housing part element is reversibly plasticized, for example via local heating or light irradiation. Arranging the housing part element on the circuit board element includes joining the plasticized portion of the surface of the housing part element to a microstructured portion of the circuit board element and then hardening the plasticized portion to form an interlocking and hermetically sealed connection therebetween.
摘要翻译：一种电子模块的制造方法，其特征在于，在分别制造和准备所述壳体部件之后，将壳体部件配置在电路基板元件上。壳体部件由可以可逆地增塑的材料形成，例如热塑性聚酰胺。壳体部件元件的表面的至少一部分可逆地增塑，例如通过局部加热或光照射。将壳体部件元件布置在电路板元件上包括将壳体部件元件的表面的塑化部分连接到电路板元件的微结构部分，然后硬化该塑化部分以在其间形成互锁和气密密封的连接。

10. 发明申请

US20160128215A1 ELECTRONIC CONTROL DEVICE 有权
标题翻译：电子控制装置
公开(公告)号：US20160128215A1
公开(公告)日：2016-05-05
申请号：US14682163
申请日：2015-04-09
申请人： Mitsubishi Electric Corporation
发明人： Shozo KANZAKI , Fumiaki ARIMAI , Hiroyoshi NISHIZAKI , Masato NAKANISHI
IPC分类号： H05K7/02
CPC分类号： H05K5/0082 , H05K5/0069
摘要： A control unit is stored in an airtight housing constituted by a base, an annular peripheral wall member, a cover, and first and second interior packings, second wiring conductors connected to input/output equipment and first wiring conductors connected to a host controller through a control signal connector are brought into press-contact with input/output control terminals of the control unit by first and second pressing elastic mats, the relative positions of associated components are regulated by positioning pins passing through from the cover to the base, and the cover is opened by loosening blockade screws without causing an assembly dimension error or sliding wear of conductive contact portions due to thermal deformation, whereby the control unit is detached.
摘要翻译：控制单元存储在由基座，环形周壁构件，盖子和第一和第二内部填充件构成的气密壳体中，连接到输入/输出设备的第二布线导体和通过主体控制器连接到主机控制器的第一布线导体控制信号连接器通过第一和第二按压弹性垫与控制单元的输入/输出控制端子进行压接，相关联的部件的相对位置由定位销通过从盖延伸到基座来限制，并且盖通过松开封锁螺钉打开，而不会由于热变形而导致导电接触部分的组装尺寸误差或滑动磨损，从而使控制单元脱离。

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