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    • 8. 发明授权
    • Buffer material for packing wafer carrier
    • 用于包装晶片载体的缓冲材料
    • US09455168B2
    • 2016-09-27
    • US13943249
    • 2013-07-16
    • SUMCO CORPORATION
    • Tomohiro Horio
    • B65D81/02H01L21/673
    • H01L21/67369B65D81/05B65D2585/86Y10T428/1376
    • At the time of packing a wafer carrier into a container, an upper buffer body and a lower buffer body are arranged above and below the wafer carrier. The wafer carrier has: a box-like carrier main body having a frame-like step portion formed on an upper inner peripheral surface of an access opening; and a lid body that closes the access opening in an openable manner when it is accommodated in the frame-like step portion through a gasket. Further, the upper buffer body has: an upper concave portion that accommodates an upper portion of the wafer carrier therein; and a pressing rib that is brought into contact with an upper end surface of a carrier main body and pressed against the upper end surface of the carrier main body without contacting with the lid body. Furthermore, the lower buffer body has: a lower concave portion and a support portion.
    • 在将晶片载体包装到容器中时,上部缓冲体和下部缓冲体布置在晶片载体的上方和下方。 晶片载体具有:箱状载体主体,其具有形成在进入开口的上部内周面上的框状台阶部; 以及盖体,其通过垫圈容纳在框状台阶部中时以可打开的方式封闭进入口。 此外,上缓冲体具有:上凹部,其容纳晶片载体的上部; 以及与载体主体的上端面接触并且压靠承载器主体的上端面而不与盖体接触的按压肋。 此外,下缓冲体具有:下凹部和支撑部。
    • 10. 发明申请
    • REUSABLE ENCAPSULATION LAYER SUPPORT PLATE AND METHOD OF ENCAPSULATING OLED SUBSTRATE
    • 可重复使用的包层支撑板和封装OLED基板的方法
    • US20150372202A1
    • 2015-12-24
    • US14527556
    • 2014-10-29
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Wei Wang
    • H01L33/54
    • H01L51/00H01L51/524Y10T428/1376
    • The embodiments of the present invention disclose a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reused as far as possible. The embodiments of the present invention further disclose a method of encapsulating an OLED substrate using the encapsulation layer support plate.
    • 本发明的实施例公开了一种可重复使用的封装层支撑板,包括:支撑板主体,支撑板主体的顶部设置有至少一个用于容纳封装层的第一开口; 布置在所述支撑板主体内的空腔,所述空腔填充有多孔材料,并且所述空腔的顶部具有至少一个第二开口; 其中所述第一开口与所述第二开口连接并布置成与所述第二开口相对,并且所述多孔材料的顶表面平行并与所述第一开口的底表面平齐。 封装层支撑板可以避免OLED基板的碰撞,实现有效的OLED封装,并且可以尽可能重复使用。 本发明的实施例还公开了一种使用封装层支撑板封装OLED基板的方法。