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1. 发明申请

US20230025120A1 HARD WAFER GRINDING METHOD 有权
公开(公告)号：US20230025120A1
公开(公告)日：2023-01-26
申请号：US17811969
申请日：2022-07-12
申请人： DISCO CORPORATION
发明人： Daisuke AKITA , Makoto SAITO , Takashi YAMAGUCHI
IPC分类号： B24B1/00 , B24B7/04 , B24B41/00 , B24B49/02
摘要： A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.

2. 发明授权

US11524386B2 Grinding apparatus 有权
公开(公告)号：US11524386B2
公开(公告)日：2022-12-13
申请号：US16829282
申请日：2020-03-25
申请人： DISCO CORPORATION
发明人： Souichi Matsubara , Tetsuo Kubo , Shinji Yamashita
IPC分类号： B24B49/04 , B24B41/00 , B24B5/50 , B24B7/22 , H01L21/304 , B24B49/02
摘要： A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

3. 发明申请

US20220226964A1 METHOD OF MONITORING A VIBRATORY GRINDING PROCESS 有权
公开(公告)号：US20220226964A1
公开(公告)日：2022-07-21
申请号：US17571626
申请日：2022-01-10
申请人： RÕster Holding GmbH
发明人： Marco Liske , Alexander Then , Franziska Taubert , Stefan Thomann , Rudiger BÕhm , Christian HÕhn , Marcus Henkel , Conrad Schulz
IPC分类号： B24B49/08 , B24B49/00 , B24B49/14 , B24B49/02 , B24B31/06
摘要： In a method of monitoring a vibratory grinding process, parameters from different parameter groups are detected and evaluated to output a command for operating the vibratory grinding system.

4. 发明授权

US10399203B2 Polishing method and polishing apparatus 有权
公开(公告)号：US10399203B2
公开(公告)日：2019-09-03
申请号：US15304829
申请日：2015-04-10
申请人： EBARA CORPORATION
发明人： Yoichi Kobayashi , Keita Yagi , Masaki Kinoshita , Yoichi Shiokawa
IPC分类号： B24B49/05 , B24B49/02 , B24B49/04 , B24B37/013 , B24B37/10 , B24B37/32 , B24B37/34 , H01L21/66 , B24B49/03 , B24B49/12 , H01L21/67
摘要： The present invention relates to a polishing method and a polishing apparatus for polishing a substrate such as a wafer while measuring a film thickness based on optical information included in reflected light from the substrate. The polishing method includes preparing a plurality of spectrum groups each containing a plurality of reference spectra corresponding to different film thicknesses; directing light to a substrate and receiving reflected light from the substrate; producing, from the reflected light, a sampling spectrum for selecting a spectrum group; selecting a spectrum group containing a reference spectrum which is closest in shape to the sampling spectrum; producing a measurement spectrum for obtaining a film thickness while polishing the substrate; selecting, from the selected spectrum group, a reference spectrum which is closest in shape to the measurement spectrum that has been produced when the substrate is being polished; and obtaining a film thickness corresponding to the selected reference spectrum.

5. 发明授权

US09962808B2 High-precision sphere size measuring device and sphere polishing device 有权
公开(公告)号：US09962808B2
公开(公告)日：2018-05-08
申请号：US15554114
申请日：2017-02-07
申请人： AMATSUJI STEEL BALL MFG. CO., LTD.
发明人： Hiroshi Nishide , Kenta Kadotani
IPC分类号： B24B49/00 , B24B49/02 , B24B11/06
CPC分类号： B24B49/02 , B24B11/06
摘要： A sphere size measuring unit (15) measures respective diameters of an object sphere in the course of processing and a standard sphere made of the same material as that of the object sphere and furthermore having a target diameter of the object sphere. A size difference calculation unit (161) calculates a size difference between the diameter of the object sphere and the diameter of the standard sphere. A determination unit (162) compares the obtained size difference with a threshold value so as to determine whether or not the diameter of the object sphere reaches the target value.

6. 发明授权

US09962803B2 Lens edging system, edging size management device, edging size management method and method of manufacturing spectacle lens 有权
公开(公告)号：US09962803B2
公开(公告)日：2018-05-08
申请号：US14443482
申请日：2013-11-01
申请人： HOYA CORPORATION
发明人： Takahiro Suzue , Tsukasa Sato
IPC分类号： B24B9/14 , B24B49/02
CPC分类号： B24B9/148 , B24B49/02
摘要： A lens edging system includes: an edger configured to perform edging to a spectacle lens in accordance with three-dimensional edging locus data obtained from edging shape data by calculation; a three-dimensional circumferential length measurement device configured to measure a circumferential length of the spectacle lens edged by the edger; and an edging size management device configured to correct a calculation parameter used for calculating the edging locus data, based on a difference between a measured circumferential length obtained by a three-dimensional circumferential length measurement device, and a theoretical circumferential length obtained by calculation.

7. 发明授权

US09636797B2 Adjusting eddy current measurements 有权
公开(公告)号：US09636797B2
公开(公告)日：2017-05-02
申请号：US14179297
申请日：2014-02-12
申请人： Applied Materials, Inc.
发明人： Kun Xu , Ingemar Carlsson , Boguslaw A. Swedek , Doyle E. Bennett , Shih-Haur Shen , Hassan G Iravani , Wen-Chiang Tu , Tzu-Yu Liu
IPC分类号： B24B49/10 , B24B49/14 , B24B49/02 , B24B37/013
CPC分类号： B24B49/105 , B24B37/013 , B24B49/02 , B24B49/04 , B24B49/14
摘要： Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperature, T(t), associated with the conductive layer at the time t; calculating resistivity ρT of the conductive layer at the measured temperature T(t); adjusting the measurement of the thickness using the calculated resistivity ρT to generate an adjusted measured thickness; and detecting a polishing endpoint or an adjustment for a polishing parameter based on the adjusted measured thickness.

8. 发明申请

US20170014966A1 DEVICE FOR SHARPENING BLADES 有权
标题翻译：破碎刀片装置
公开(公告)号：US20170014966A1
公开(公告)日：2017-01-19
申请号：US15038854
申请日：2014-10-17
申请人： FUTURA S.P.A.
发明人： Giovacchino GIURLANI
IPC分类号： B24B3/36 , B24B3/46 , B24B49/02
CPC分类号： B24B3/36 , B24B3/46 , B24B49/02 , B24B49/10
摘要： Device for sharpening blades of cutting-off machines, comprising two grinding wheels (1) each positioned on a corresponding side of a cutting edge (20) of a blade (2) of a cutting machine. The device comprises means adapted for controlling the symmetry of said cutting edge (20), with a sensor (3) placed at a predetermined distance from a corresponding side of the cutting edge (20. The sensor (3) is adapted to detect possible differences (d) between the lengths (n, p) of the two sides of the cutting edge (20). The sensor (3) is connected to a programmable unit (4) that processes the said difference (d) possibly detected by the sensor (3).
摘要翻译：用于磨削切割机的刀片的装置，包括两个分别位于切割机的刀片（2）的切割刃（20）的相应侧上的砂轮（1）。所述装置包括用于控制所述切削刃（20）的对称性的装置，其中传感器（3）放置在与所述切削刃（20）的相应侧相隔预定距离处。所述传感器（3）适于检测可能的差异（d）在所述切削刃（20）的两侧的长度（n，p）之间，所述传感器（3）连接到可编程单元（4），所述可编程单元处理由所述传感器可能检测到的所述差值（d）（3）。

9. 发明授权

US09358663B2 System and methods of removing a multi-layer coating from a substrate 有权
标题翻译：从基底去除多层涂层的系统和方法
公开(公告)号：US09358663B2
公开(公告)日：2016-06-07
申请号：US14254052
申请日：2014-04-16
申请人： General Electric Company
发明人： Blake Allen Fulton , Michael Anthony DePalma , Craig Lowell Sarratt , Ryan Jeffrey Cardillo
IPC分类号： B24B49/02 , B08B1/04 , B24B19/22 , B24B27/033 , B23P6/00 , B24B49/00 , B24B7/20 , B24B19/14 , B24B49/16 , F01D5/00 , F01D5/28
CPC分类号： B24B49/02 , B08B1/04 , B23P6/00 , B23P6/002 , B24B7/20 , B24B19/14 , B24B19/22 , B24B27/033 , B24B49/00 , B24B49/006 , B24B49/16 , F01D5/005 , F01D5/288
摘要： A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.
摘要翻译：提供了一种用于从基板去除多层涂层的系统。多层涂层包括施加到基底的第一涂层和施加在第一涂层上的第二涂层。第一涂层由第一材料形成，第二涂层由不同于第一材料的第二材料形成。该系统包括被配置为从衬底去除多层涂层的研磨机构，以及与磨削机构连通的控制器。所述控制器被配置成将所述研磨机构定位在所述多层涂层上，启动引导所述研磨机构穿过所述基板的第一移除模式，在所述第一移除模式期间监测所述研磨机构的可变操作参数，并评估所述可变操作参数的值相对于预定阈值来确定所述第二涂层是否已经从所述基板移除。

10. 发明申请

US20150298278A1 LENS EDGING SYSTEM, EDGING SIZE MANAGEMENT DEVICE, EDGING SIZE MANAGEMENT METHOD AND METHOD OF MANUFACTURING SPECTACLE LENS 有权
标题翻译：镜片加工系统，加工尺寸管理装置，加工尺寸管理方法和制造镜片镜片的方法
公开(公告)号：US20150298278A1
公开(公告)日：2015-10-22
申请号：US14443482
申请日：2013-11-01
申请人： HOYA CORPORATION
发明人： Takahiro SUZUE , Tsukasa SATO
IPC分类号： B24B9/14 , B24B49/02
CPC分类号： B24B9/148 , B24B49/02
摘要： A lens edging system includes: an edger configured to perform edging to a spectacle lens in accordance with three-dimensional edging locus data obtained from edging shape data by calculation; a three-dimensional circumferential length measurement device configured to measure a circumferential length of the spectacle lens edged by the edger; and an edging size management device configured to correct a calculation parameter used for calculating the edging locus data, based on a difference between a measured circumferential length obtained by a three-dimensional circumferential length measurement device, and a theoretical circumferential length obtained by calculation.
摘要翻译：镜片边缘系统包括：修剪器，被配置为根据通过计算从边缘形状数据获得的三维边缘轨迹数据对眼镜镜片进行磨边; 三维圆周长度测量装置，其被配置为测量由所述修边器边缘的所述眼镜镜片的圆周长度; 以及边缘尺寸管理装置，其被配置为基于由三维圆周长度测量装置获得的测量圆周长度与通过计算获得的理论周长之间的差异来校正用于计算边缘轨迹数据的计算参数。

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