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    • 6. 发明授权
    • Surface mounted LED structure and packaging method of integrating functional circuits on a silicon
    • 表面安装的LED结构和在硅上集成功能电路的封装方法
    • US08138515B2
    • 2012-03-20
    • US13024083
    • 2011-02-09
    • Zhaoming ZengGuowei David XiaoHaiying ChenYugang ZhouYu Hou
    • Zhaoming ZengGuowei David XiaoHaiying ChenYugang ZhouYu Hou
    • H01L33/00
    • H01L33/62H01L24/73H01L33/486H01L33/54H01L33/64H01L2224/32225H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/48464H01L2224/73265H01L2924/09701H01L2924/10253H01L2924/14H01L2924/00014H01L2924/00H01L2924/00012
    • The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip. Peripheral functional circuits required by LED are integrated on the upper surface of said silicon substrate. The structure of the present invention has advantages of good heat dissipation effect and small volume, and direct integration of functional circuits such as protection and drive circuits etc. in the silicon substrate achieves large-scale production package of wafer level, reducing the cost of packaging and lighting fixture.
    • 本发明涉及一种在硅衬底上集成功能电路的表面安装LED结构,包括硅衬底和LED芯片。 所述硅衬底具有没有凹槽的平面结构的上表面。 氧化物层覆盖硅衬底的上表面,金属电极层设置在氧化物层的上表面。 所述金属电极层的上表面配置有金属凸块,将LED芯片倒装安装在硅基板上。 在所述硅衬底的下表面上布置两个导电金属焊盘,所述导电金属焊盘通过布置在硅衬底的侧壁上的金属引线电连接到硅衬底的上表面上的金属电极层。 在LED芯片正下方的硅衬底的相对的下表面上布置有导热金属焊盘。 LED所需的外围功能电路集成在所述硅衬底的上表面上。 本发明的结构具有散热效果好,体积小的优点,硅衬底等保护和驱动电路等功能电路的直接集成实现了晶片级的大规模生产封装,降低了封装成本 和照明灯具。