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1. 发明授权

US10004175B1 Fertilizer application 有权
公开(公告)号：US10004175B1
公开(公告)日：2018-06-26
申请号：US15470990
申请日：2017-03-28
申请人： John A. Miller
发明人： John A. Miller
IPC分类号： A01C21/00 , A01C13/00 , A01C23/02
CPC分类号： A01C21/002 , A01C5/066 , A01C13/00 , A01C23/024
摘要： Fertilizer is applied between the rows of growing plants or to the bases of growing plants in adjacent rows. A dirt moving member then moves dirt and any applied fertilizer from between the rows onto the bases of the growing plants in the adjacent rows. The dirt acts to seal the fertilizer and to significantly reduce fertilizer losses.

2. 发明申请

US20120197279A1 UP CUTTING KNIFE WITH SUCTION 有权
标题翻译：用切割刀切割
公开(公告)号：US20120197279A1
公开(公告)日：2012-08-02
申请号：US13015257
申请日：2011-01-27
申请人： Miguelangelo J. Perez-Cruet , John R. Pepper , John A. Miller
发明人： Miguelangelo J. Perez-Cruet , John R. Pepper , John A. Miller
IPC分类号： A61B17/32
CPC分类号： A61B17/3211 , A61B17/1671 , A61B2217/005
摘要： An up-cutting knife that has particular application for minimally invasive spinal surgical procedures. The knife includes an elongated tube that is operable to be inserted through a tubular retractor used in minimally invasive surgical procedures. One end of the elongated tube includes a curved head portion having a cutting blade formed on a top surface thereof and a suction port, and an opposite end of the tube is coupled to a handle having a chamber. A suction device can be coupled to an outlet port in the handle that causes blood and other surgical material to be drawn through the tube and out of the handle.
摘要翻译：一种特殊应用于微创脊柱外科手术的切割刀。刀包括细长管，其可操作地插入通过用于微创外科手术的管状牵缩器。细长管的一端包括弯曲头部，其具有形成在其顶表面上的切割刀片和吸入口，并且该管的相对端连接到具有腔室的手柄。抽吸装置可以联接到手柄中的出口端口，其使得血液和其它手术材料通过管被拉出并从手柄中移出。

3. 发明申请

US20110142067A1 DYNAMIC LINK CREDIT SHARING IN QPI 审中-公开
标题翻译： QPI中动态链接信用共享
公开(公告)号：US20110142067A1
公开(公告)日：2011-06-16
申请号：US12639556
申请日：2009-12-16
申请人： Timothy J. JEHL , Pradeepsunder Ganesh , Aimee Wood , Robert Safranek , John A. Miller , Selim Bilgin , Osama Neiroukh
发明人： Timothy J. JEHL , Pradeepsunder Ganesh , Aimee Wood , Robert Safranek , John A. Miller , Selim Bilgin , Osama Neiroukh
IPC分类号： H04J3/02
CPC分类号： H04L47/2441 , H04L47/263 , H04L47/39
摘要： A method and system for dynamic credit sharing in a quick path interconnect link. The method including dividing incoming credit into a first credit pool and a second credit pool; and allocating the first credit pool for a first data traffic queue and allocating the second credit pool for a second data traffic queue in a manner so as to preferentially transmit the first data traffic queue or the second data traffic queue through a link.
摘要翻译：一种快速路径互联链路中动态信用共享的方法和系统。该方法包括将入款信用分为第一信用卡和第二信用卡; 以及为第一数据业务队列分配所述第一信用卡并且以使得通过链路优先地发送所述第一数据业务队列或所述第二数据业务队列的方式为所述第二数据业务队列分配所述第二信用卡。

4. 发明申请

US20110131373A1 Mirroring Data Between Redundant Storage Controllers Of A Storage System 有权
标题翻译：在存储系统的冗余存储控制器之间镜像数据
公开(公告)号：US20110131373A1
公开(公告)日：2011-06-02
申请号：US12627440
申请日：2009-11-30
申请人： Pankaj Kumar , Hang T. Nguyen , Mark Yarch , Timothy J. Jehl , John A. Miller
发明人： Pankaj Kumar , Hang T. Nguyen , Mark Yarch , Timothy J. Jehl , John A. Miller
IPC分类号： G06F12/08 , G06F12/00 , G06F12/16
CPC分类号： G06F11/2089 , G06F11/2097
摘要： In one embodiment, the present invention includes canisters to control storage of data in a storage system including a plurality of disks. Each of multiple canisters may have a processor configured for uniprocessor mode and having an internal node identifier to identify the processor and an external node identifier to identify another processor with which it is to mirror cached data. The mirroring of cached data may be performed by communication of non-coherent transactions via the PtP interconnect, wherein the PtP interconnect is according to a cache coherent protocol. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，本发明包括用于控制包括多个盘的存储系统中的数据存储的罐。多个罐中的每一个可以具有配置成用于单处理器模式并具有内部节点标识符以识别处理器和外部节点标识符的处理器，以识别用于镜像缓存数据的另一个处理器。缓存数据的镜像可以通过经由PtP互连的非相干事务的通信来执行，其中PtP互连是根据高速缓存一致性协议。描述和要求保护其他实施例。

5. 发明申请

US20110046743A1 Minimally Invasive Interbody Device 审中-公开
标题翻译：微创体内器件
公开(公告)号：US20110046743A1
公开(公告)日：2011-02-24
申请号：US12917089
申请日：2010-11-01
申请人： Miquelangelo J. Perez-Cruet , John R. Pepper , John A. Miller
发明人： Miquelangelo J. Perez-Cruet , John R. Pepper , John A. Miller
IPC分类号： A61F2/44
CPC分类号： A61F2/4455 , A61B2017/0256 , A61F2/447 , A61F2/4601 , A61F2/4611 , A61F2002/3008 , A61F2002/30166 , A61F2002/30235 , A61F2002/30367 , A61F2002/30426 , A61F2002/3082 , A61F2002/4627 , A61F2002/4629 , A61F2220/0025 , A61F2220/0033 , A61F2230/0028 , A61F2230/0069 , A61F2250/0098 , A61F2310/00023
摘要： An interbody device that restores the disc space height between two vertebrae during spinal fusion surgery. The device includes a center plate surrounded by a perimeter portion that combine to have a relatively flat configuration in one dimension and relatively wide configuration in a perpendicular dimension. After the disc space has been cleared, the device is inserted into the disc space in a direction so that the wide dimension of the device is substantially parallel to the body of the vertebrae. The device is then rotated so that the wide dimension of the device becomes perpendicular to the vertebral body so as to cause the disc space height to be restored. Bone graft material is then introduced through a fill tube coupled to the device so that the bone graft material is distributed on both sides of the center plate and into the disc space.
摘要翻译：一种椎体内装置，可恢复脊柱融合手术期间椎间盘高度。该装置包括由周边部分围绕的中心板，该中心板在一个维度上组合成具有相对平坦的构造，在垂直方向上具有相对宽的构造。在盘空间已经被清除之后，装置沿着一个方向插入到盘片空间中，使得装置的宽尺寸基本上平行于椎骨的主体。然后使装置旋转，使得装置的宽尺寸变得垂直于椎体，以便使椎间盘空间高度恢复。骨移植材料然后通过连接到该装置的填充管引入，使得骨移植材料分布在中心板的两侧并进入椎间盘空间。

6. 发明申请

US20080233751A1 IC CHIP UNIFORM DELAYERING METHODS 失效
标题翻译： IC芯片均匀延迟方法
公开(公告)号：US20080233751A1
公开(公告)日：2008-09-25
申请号：US11690432
申请日：2007-03-23
申请人： Keith E. Barton , Thomas A. Bauer , Stanley J. Klepeis , John A. Miller , Yun-Yu Wang
发明人： Keith E. Barton , Thomas A. Bauer , Stanley J. Klepeis , John A. Miller , Yun-Yu Wang
IPC分类号： H01L21/461
CPC分类号： G01N1/32 , H01L22/24
摘要： Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the wafer using a slurry including an approximately 30 μm polishing particles; removing the aluminum layer and at least one metal layer by polishing using a slurry including approximately 9 μm diamond polishing particles and a non-abrasive backside of a polishing sheet; removing any remaining metal layers to a first metal layer by polishing using a slurry including approximately 3 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; removing any scratches by polishing using a slurry including approximately 1 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; and removing the first metal layer to a polyconductor layer by polishing using a colloidal slurry including approximately 0.25 μm diamond polishing particles.
摘要翻译：公开了均匀地延迟IC芯片的方法。一个实施例包括：在包括其Al层的晶片上执行灰分并蚀刻Al层; 使用包含约30μm的抛光颗粒的浆料抛光晶片的边缘; 通过使用包含大约9μm的金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光来去除铝层和至少一个金属层; 通过使用包含大约3μm的金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光，将任何剩余的金属层除去到第一金属层; 通过使用包括大约1毫米金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光来除去任何划痕; 并且通过使用包含大约0.25μm金刚石抛光颗粒的胶体浆料进行抛光将第一金属层去除到多导体层。

7. 发明授权

US06539625B2 Chromium adhesion layer for copper vias in low-k technology 失效
公开(公告)号：US06539625B2
公开(公告)日：2003-04-01
申请号：US09759017
申请日：2001-01-11
申请人： Brett H. Engel , Mark Hoinkis , John A. Miller , Soon-Cheon Seo , Yun-Yu Wang , Kwong Hon Wong
发明人： Brett H. Engel , Mark Hoinkis , John A. Miller , Soon-Cheon Seo , Yun-Yu Wang , Kwong Hon Wong
IPC分类号： H05K302
CPC分类号： H01L21/76843 , H01L21/76846 , H01L23/53238 , H01L2924/0002 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00
摘要： In integrated circuits having copper interconnect and low-k interlayer dielectrics, a problem of open circuits after heat treatment was discovered and solved by the use of a first liner layer of Cr, followed by a conformal liner layer of CVD TiN, followed in turn by a final liner layer of Ta or TaN, thus improving adhesion between the via and the underlying copper layer while maintaining low resistance.

8. 发明授权

US06417567B1 Flat interface for a metal-silicon contract barrier film 失效
标题翻译：金属硅合金阻挡膜的平面接口
公开(公告)号：US06417567B1
公开(公告)日：2002-07-09
申请号：US09482547
申请日：2000-01-13
申请人： Anthony G. Domenicucci , Lynne M. Gignac , Yun-Yu Wang , Horatio S. Wildman , Kwong Hon Wong , Roy A. Carruthers , Christian Lavoie , John A. Miller
发明人： Anthony G. Domenicucci , Lynne M. Gignac , Yun-Yu Wang , Horatio S. Wildman , Kwong Hon Wong , Roy A. Carruthers , Christian Lavoie , John A. Miller
IPC分类号： H01L2348
CPC分类号： H01L21/76855 , H01L21/28518 , H01L21/28568 , H01L21/3212 , H01L21/76856 , H01L2221/1078
摘要： A conductive contact having an atomically flat interface. The contact includes, in order, a silicon substrate, a highly disordered silicide layer, and a titanium oxynitride layer. The silicide layer is formed of titanium, silicon, and one of the elements tungsten, tantalum, and molybdenum. The interface between the silicon substrate and the silicide layer is atomically flat. The flat interface prevents diffusion of conductive materials into the underlying silicon substrate. The contact is useful especially for very small devices and shallow junctions, such as are required for ULSI shallow junctions.
摘要翻译：具有原子平坦界面的导电接触。接触依次包括硅衬底，高度无序的硅化物层和氮氧化钛层。硅化物层由钛，硅和元素钨，钽和钼之一形成。硅衬底和硅化物层之间的界面是原子平坦的。平面界面防止导电材料扩散到下面的硅衬底中。该接触对于非常小的器件和浅接头是有用的，例如ULSI浅结点所需的。

9. 发明授权

US06339007B1 Capacitor stack structure and method of fabricating description 失效
标题翻译：电容器堆叠结构及其制造方法
公开(公告)号：US06339007B1
公开(公告)日：2002-01-15
申请号：US09562556
申请日：2000-05-02
申请人： Yun-Yu Wang , Rajarao Jammy , Lee J. Kimball , David E. Kotecki , Jenny Lian , Chenting Lin , John A. Miller , Nicholas Nagel , Hua Shen , Horatio S. Wildman
发明人： Yun-Yu Wang , Rajarao Jammy , Lee J. Kimball , David E. Kotecki , Jenny Lian , Chenting Lin , John A. Miller , Nicholas Nagel , Hua Shen , Horatio S. Wildman
IPC分类号： H01L2120
CPC分类号： H01L28/75 , H01L28/55 , H01L28/60
摘要： A capacitor structure that comprises a top platinum electrode and a bottom electrode having insulator on the sidewalls of the electrodes, and wherein the bottom electrode is from depositing a first electrode portion being recessed with respect to the insulator on the sidewalls thereof and depositing a second insulator portion is provided.
摘要翻译：一种电容器结构，其包括顶部铂电极和在电极的侧壁上具有绝缘体的底部电极，并且其中底部电极从沉积相对于绝缘体在其侧壁上凹进的第一电极部分并且沉积第二绝缘体提供部分。

10. 发明授权

US5350413A Transcutaneous energy transfer device 失效
标题翻译：经皮能量转移装置
公开(公告)号：US5350413A
公开(公告)日：1994-09-27
申请号：US734084
申请日：1991-07-22
申请人： John A. Miller
发明人： John A. Miller
IPC分类号： A61N1/372 , A61N1/378 , A61N1/02
CPC分类号： A61N1/3787 , A61N1/37223
摘要： An improved transcutaneous energy transfer (TET) device comprises a primary winding for placement on or near a skin surface, and a secondary winding for implantation under said skin surface. A field effect transistor (FET) is arranged to switch said primary coil across an external DC power supply. A tuning capacitor is linked to said primary coil whereby said primary coil, when said FET is turned off, will resonate at its natural frequency thereby compensating for drift in component values and reducing power transfer sensitivity to component drift. In an alternative aspect of the invention, a bidirectional communications link is provided for the transfer of data across a boundary layer by infrared signals. A plurality of transmitters are arranged in a circular pattern on one side of the boundary layer, whereas a receiver is positioned within the circular pattern along the opposite side of the boundary layer.
摘要翻译：改进的经皮能量转移（TET）装置包括用于放置在皮肤表面上或附近的初级绕组和用于在所述皮肤表面下植入的次级绕组。场效应晶体管（FET）被布置成通过外部DC电源来切换所述初级线圈。调谐电容器连接到所述初级线圈，由此当所述FET截止时，所述初级线圈将以其固有频率谐振，从而补偿元件值中的漂移并降低对元件漂移的功率传递灵敏度。在本发明的另一方面，提供双向通信链路，用于通过红外信号跨越边界层的数据传输。多个发射器在边界层的一侧以圆形图案布置，而接收器沿着边界层的相对侧定位在圆形图案内。

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