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1. 发明授权

US06539959B1 Cleaning apparatus for plate-like part and method thereof 失效
标题翻译：板状零件清洗装置及其方法
公开(公告)号：US06539959B1
公开(公告)日：2003-04-01
申请号：US09498355
申请日：2000-02-04
申请人： Noriyuki Ohroku , Yuichirou Tanaka , Yoichi Takahara , Tomonori Saeki , Susumu Aiuchi , Hitoshi Oka , Fumio Morita , Masataka Fujiki , Akinobu Yamaoka
发明人： Noriyuki Ohroku , Yuichirou Tanaka , Yoichi Takahara , Tomonori Saeki , Susumu Aiuchi , Hitoshi Oka , Fumio Morita , Masataka Fujiki , Akinobu Yamaoka
IPC分类号： B08B310
CPC分类号： H01L21/67051 , B08B3/04 , B08B3/10 , G11B23/505 , Y10S134/902
摘要： At a time of cleaning a plate-like part such as a wafer or the like while rotating, for the purpose of reducing a contamination, a damage and an unevenness of process of the plate-like part which are caused by an amount of charged electricity of the plate-like part, chuck pins (chuck members) 201 which chuck the plate-like part 1 such as the wafer or the like and upper and lower cleaning plates 101 and 121 which oppose to the plate-like part 1 are constituted by a resin material containing carbon powders, and a desired potential difference is applied to a portion between the plate-like part and the cleaning plates by a voltage control unit 601 which is provided in an outer portion.
摘要翻译：在旋转时清洁诸如晶片等的板状部件的时候，为了减少由电荷量引起的污染，板状部件的过程的损坏和不均匀性板状部分夹住板状部分等板状部分1的卡盘销（卡盘部件）201和与板状部分1相对的上下清扫板101和121构成为：含有碳粉末的树脂材料，并且通过设置在外部的电压控制单元601将期望的电位差施加到板状部分和清洁板之间的部分。

2. 发明授权

US06443168B1 Plate-like specimen fluid-treating apparatus and plate-like specimen fluid-treating method 失效
标题翻译：板状样品流体处理装置和板状样品流体处理方法
公开(公告)号：US06443168B1
公开(公告)日：2002-09-03
申请号：US09579142
申请日：2000-05-30
申请人： Fumio Morita , Masataka Fujiki , Hitoshi Oka , Noriyuki Oroku , Yuichirou Tanaka
发明人： Fumio Morita , Masataka Fujiki , Hitoshi Oka , Noriyuki Oroku , Yuichirou Tanaka
IPC分类号： B08B302
CPC分类号： H01L21/67051 , B08B3/04 , Y10S134/902
摘要： The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates 12 and 14, each of which includes a metal plate 25 provided on overall outer surface thereof. On each of the metal plates 25, there is arranged a spiral-shaped circulating pipe 24 through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer 16 by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer 16 and the upper Bernoulli-plate and a clearance between the wafer 16 and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.
摘要翻译：所公开的流体处理装置包括上部和下部伯努利板12和14，每个都包括设置在其整个外表面上的金属板25。在每个金属板25上，布置有螺旋形循环管24，通过该螺旋形循环管24循环加热介质或冷却介质，以便快速加热或冷却上部和下部伯努利板。在由设备处理晶片16期间，上部和下部伯努利板彼此平行地设置，以在其间形成窄间隙，同时晶片16和上部伯努利板之间的间隙以及晶片之间的间隙 16和下部伯努利板保持彼此相等。因此，本发明可以实现各种目的，例如清洁的时间节省，清洁液的消耗减少和清洁不均匀性的抑制。

3. 发明授权

US06401734B1 Substrate treating apparatus 失效
标题翻译：底物处理装置
公开(公告)号：US06401734B1
公开(公告)日：2002-06-11
申请号：US09524744
申请日：2000-03-13
申请人： Fumio Morita , Masataka Fujiki , Hitoshi Oka , Noriyuki Oroku , Yuichirou Tanaka
发明人： Fumio Morita , Masataka Fujiki , Hitoshi Oka , Noriyuki Oroku , Yuichirou Tanaka
IPC分类号： B08B302
CPC分类号： H01L21/67051 , B08B3/10 , Y10S134/902
摘要： A substrate treating apparatus and method can recover a substrate treating liquid such as a cleaning liquid in an efficient manner and positively avoid occurrences of treatment defects such as formation of cleaning spots, water marks and the like. A fixed upper plate and a fixed lower plate are disposed in opposition to each other so as to define a space therebetween. A substrate such as a semiconductor wafer is inserted into the space between the fixed upper and lower plates, supported there by a support and adapted to be rotated through rotation of the support. A substrate treating medium such as a cleaning liquid is introduced into the space to treat the substrate while the substrate is rotating. The treating medium after having treated the substrate is discharged from the space through a discharge passage which is defined between an outer peripheral surface of the support and an inner surface of a housing which covers the outer peripheral surface of the support. Rotary blades are disposed in the discharge passage and adapted to rotate in accordance with the rotation of the substrate, thereby enhancing discharging of the substrate treating medium from the space through the discharge passage.
摘要翻译：基板处理装置和方法可以有效地回收诸如清洗液体的基板处理液体，并且可以有效地避免诸如形成清洁点，水痕等的处理缺陷的发生。固定的上板和固定的下板彼此相对设置，以便在它们之间限定一个空间。诸如半导体晶片的基板被插入到固定的上板和下板之间的空间中，由支撑件支撑在其上并适于通过支撑件的旋转而旋转。将衬底处理介质如清洗液体引入到空间中以在衬底旋转的同时处理衬底。经过处理的基板之后的处理介质经由排出通道排出，该排出通道限定在支撑体的外周面和覆盖支撑体的外周面的壳体的内表面之间。旋转叶片设置在排出通道中并且适于根据基板的旋转而旋转，从而增强基板处理介质从通过排出通道的空间的排放。

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