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    • 3. 发明授权
    • Multilevel imprint lithography
    • 多层压印光刻
    • US07256435B1
    • 2007-08-14
    • US10453329
    • 2003-06-02
    • Pavel KornilovichYong ChenDuncan StewartR. Stanley WilliamsPhilip J. KuekesMehmet Fatih Yanik
    • Pavel KornilovichYong ChenDuncan StewartR. Stanley WilliamsPhilip J. KuekesMehmet Fatih Yanik
    • H01L27/10
    • H01L21/76838B81C99/009B81C2201/0153B82Y10/00B82Y40/00G03F7/0002
    • A mold with a protruding pattern is provided that is pressed into a thin polymer film via an imprinting process. Controlled connections between nanowires and microwires and other lithographically-made elements of electronic circuitry are provided. An imprint stamp is configured to form arrays of approximately parallel nanowires which have (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in the Y direction, and three or more distinct heights in the Z direction. The stamp thus formed can be used to connect specific individual nanowires to specific microscopic regions of microscopic wires or pads. The protruding pattern in the mold creates recesses in the thin polymer film, so the polymer layer acquires the reverse of the pattern on the mold. After the mold is removed, the film is processed such that the polymer pattern can be transferred on a metal/semiconductor pattern on the substrate.
    • 提供具有突出图案的模具,其通过压印过程被压入薄聚合物膜。 提供了纳米线和微丝之间的控制连接以及电子电路的其它光刻元件。 打印印记被配置成形成大致平行的纳米线的阵列,其具有(1)X方向上的微尺寸,(2)在Y方向上的纳米尺寸和纳米间距,以及Z方向上的三个或更多个不同的高度。 如此形成的印章可以用于将特定的单个纳米线连接到微细线或垫的特定微观区域。 模具中的突出图案在薄聚合物膜中产生凹陷,因此聚合物层获得模具上图案的相反。 在除去模具之后,处理膜,使得聚合物图案可以在基底上的金属/半导体图案上转印。
    • 10. 发明授权
    • Scalable, component-accessible, and highly interconnected three-dimensional component arrangement within a system
    • 系统内可扩展的,可组件访问的和高度互连的三维组件布置
    • US08214786B2
    • 2012-07-03
    • US10935845
    • 2004-09-08
    • Philip J. KuekesR. Stanley WilliamsRaymond G. Beausoleil, Jr.
    • Philip J. KuekesR. Stanley WilliamsRaymond G. Beausoleil, Jr.
    • G06F17/50
    • G06F1/18G06F17/509H05K7/1444
    • Embodiments of the present invention include dense, but accessible and well-interconnected component arrangements within multi-component systems, such as high-end multi-processor computer systems, and methods for constructing such arrangements. In a described embodiment, integrated-circuit-containing processing components, referred to as a “flat components,” are arranged into local blocks of intercommunicating flat components. The local flat-component blocks are arranged into interconnected, primitive multi-local-block repeating units, and the primitive local-block repeating units are layered together in a three-dimensional, regularly repeating structure that can be assembled to approximately fill any specified three-dimensional volume. The arrangement provides for relatively short, direct pathways from the surface of the specified volume to any particular local block and flat component within the three-dimensional arrangement.
    • 本发明的实施例包括在诸如高端多处理器计算机系统的多组件系统内的密集但可访问和良好互连的组件布置,以及用于构造这种布置的方法。 在所描述的实施例中,被称为“平面部件”的集成电路的处理部件被布置在相互连通的平面部件的局部块中。 本地平面组件块被布置成互连的原始多局部块重复单元,并且原始局部块重复单元以三维的规则重复的结构分层在一起,其可以被组装以大致填充任何指定的三 维数。 该装置提供从指定体积的表面到三维布置中的任何特定局部块和平坦部件的相对短的直接通路。