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    • 8. 发明授权
    • Semiconductor doping with reduced gate edge diode leakage
    • 半导体掺杂减少了栅极边缘二极管泄漏
    • US07897496B2
    • 2011-03-01
    • US11941129
    • 2007-11-16
    • Puneet KohliNandakumar MahalingamManoj MehrotraSong Zhao
    • Puneet KohliNandakumar MahalingamManoj MehrotraSong Zhao
    • H01L21/425
    • H01L21/26513H01L21/26506H01L29/165H01L29/6659H01L29/7833
    • Semiconductor doping techniques, along with related methods and structures, are disclosed that produce components having a more tightly controlled source and drain extension region dopant profiles without significantly inducing gate edge diode leakage. The technique follows the discovery that carbon, which may be used as a diffusion suppressant for dopants such as boron, may produce a gate edge diode leakage if present in significant quantities in the source and drain extension regions. As an alternative to placing carbon in the source and drain extension regions, carbon may be placed in the source and drain regions, and the thermal anneal used to activate the dopant may be relied upon to diffuse a small concentration of the carbon into the source and drain extension regions, thereby suppressing dopant diffusion in these regions without significantly inducing gate edge diode leakage. The increased concentration of carbon in the source and drain regions may permit heavier doping of the source/drain region, leading to improved gate capacitance.
    • 公开了半导体掺杂技术以及相关方法和结构,其产生具有更紧密控制的源极和漏极延伸区掺杂物分布而不显着引起栅极边缘二极管泄漏的元件。 该技术遵循发现,可以用作掺杂剂如硼的扩散抑制剂的碳可能在源极和漏极延伸区域中以大量存在而产生栅极边缘二极管泄漏。 作为在源极和漏极延伸区域中放置碳的替代方案,可以将碳放置在源极和漏极区域中,并且可以依靠用于激活掺杂剂的热退火将碳的少量浓度扩散到源中, 漏极延伸区域,从而抑制这些区域中的掺杂剂扩散,而不会显着引起栅极边缘二极管泄漏。 源极和漏极区域中增加的碳浓度可能允许源极/漏极区域的较重掺杂,导致改善的栅极电容。