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1. 发明专利

JP2012140672A Sputtering apparatus 审中-公开
标题翻译：溅射装置
公开(公告)号：JP2012140672A
公开(公告)日：2012-07-26
申请号：JP2010293523
申请日：2010-12-28
申请人： Canon Anelva Corp , キヤノンアネルバ株式会社
发明人： ENDO TETSUYA , OKADA ERIKO , MATSUO RYOSUKE , FUJIMOTO TAKESHI , YAMANAKA MASAHIRO , IIZUKA KENTARO
IPC分类号： C23C14/34 , G11B5/39
摘要： PROBLEM TO BE SOLVED: To provide a sputtering apparatus superior in cooling performance.SOLUTION: The sputtering apparatus includes: a target electrode; a substrate holding stage 107 including a recessed part for forming a space between a placing part for placing a substrate W and the substrate placed on the placing part; a supply source for supplying a coolant gas into the recessed part; a holding member for exerting a pressing force therebetween with the substrate holding stage to fix the substrate onto the substrate holding stage; a freezing machine 108 connected to the substrate holding stage; and a rotary drive device for rotating the substrate holding stage together with the freezing machine.
摘要翻译：要解决的问题：提供优异的冷却性能的溅射装置。解决方案：溅射装置包括：目标电极; 衬底保持台107，包括用于在放置衬底W的放置部件和放置在放置部件上的衬底之间形成空间的凹部; 用于将冷却剂气体供应到所述凹部中的供应源; 用于在其间施加压力的保持构件，其具有衬底保持台以将衬底固定到衬底保持台上; 连接到基板保持台的冷冻机108; 以及用于与冷冻机一起旋转基板保持台的旋转驱动装置。版权所有（C）2012，JPO＆INPIT

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