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1. 发明专利

JP2015057504A 処理装置审中-公开
标题翻译：处理单元
公开(公告)号：JP2015057504A
公开(公告)日：2015-03-26
申请号：JP2011270974
申请日：2011-12-12
申请人：キヤノンアネルバ株式会社 , Canon Anelva Corp
发明人： MIYAUCHI TAKUMA , ISHIDA MASAAKI , FUJIMOTO TAKESHI , ITASAKA SUGURU
IPC分类号： C23C14/50 , C23C14/34 , H01L21/3065 , H01L21/683
CPC分类号： C23C14/505 , C23C14/541 , F25B9/14 , H01L21/67109 , H01L21/67288 , H01L21/68792
摘要：【課題】本発明における課題は、冷却性能に優れた処理装置を提供することにある。【解決手段】本発明においては、基板を載置することが可能な基板載置部、基板載置部との間に押し付け力を発生させて、基板を基板載置部に保持させる保持手段と、基板載置部を冷却する冷却手段と、基板載置部を冷却手段と共に回転させる回転手段と、を備えた処理装置であって、冷却手段の弾性体はその周縁部に防振部材を配置したことを特徴としている。【選択図】図1
摘要翻译：要解决的问题：提供一种冷却性能优异的处理单元。解决方案：处理单元包括能够在其上装载基板的基板装载部分，用于通过在其自身之间产生加压力将基板保持在基板装载部分上的保持装置以及基板装载部，冷却基板装载部的冷却装置，以及与冷却装置一起旋转基板装载部的旋转装置。此外，在冷却装置的弹性体的周边部设置隔振部件。

2. 发明专利

JP2012140672A Sputtering apparatus 审中-公开
标题翻译：溅射装置
公开(公告)号：JP2012140672A
公开(公告)日：2012-07-26
申请号：JP2010293523
申请日：2010-12-28
申请人： Canon Anelva Corp , キヤノンアネルバ株式会社
发明人： ENDO TETSUYA , OKADA ERIKO , MATSUO RYOSUKE , FUJIMOTO TAKESHI , YAMANAKA MASAHIRO , IIZUKA KENTARO
IPC分类号： C23C14/34 , G11B5/39
摘要： PROBLEM TO BE SOLVED: To provide a sputtering apparatus superior in cooling performance.SOLUTION: The sputtering apparatus includes: a target electrode; a substrate holding stage 107 including a recessed part for forming a space between a placing part for placing a substrate W and the substrate placed on the placing part; a supply source for supplying a coolant gas into the recessed part; a holding member for exerting a pressing force therebetween with the substrate holding stage to fix the substrate onto the substrate holding stage; a freezing machine 108 connected to the substrate holding stage; and a rotary drive device for rotating the substrate holding stage together with the freezing machine.
摘要翻译：要解决的问题：提供优异的冷却性能的溅射装置。解决方案：溅射装置包括：目标电极; 衬底保持台107，包括用于在放置衬底W的放置部件和放置在放置部件上的衬底之间形成空间的凹部; 用于将冷却剂气体供应到所述凹部中的供应源; 用于在其间施加压力的保持构件，其具有衬底保持台以将衬底固定到衬底保持台上; 连接到基板保持台的冷冻机108; 以及用于与冷冻机一起旋转基板保持台的旋转驱动装置。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012136320A Conveying device and vacuum treatment device 有权
标题翻译：输送装置和真空处理装置
公开(公告)号：JP2012136320A
公开(公告)日：2012-07-19
申请号：JP2010289266
申请日：2010-12-27
申请人： Canon Anelva Corp , キヤノンアネルバ株式会社
发明人： MIYAUCHI TAKUMA , ISHIDA MASAAKI , FUJIMOTO TAKESHI
IPC分类号： B65G54/02 , B65G49/06
摘要： PROBLEM TO BE SOLVED: To provide a conveying device capable of preventing demagnetization by cooling a helical magnet.SOLUTION: A magnetic screw driving mechanism 9 of the conveying device T for rotates a helical magnet shaft 11 having the helical magnet 11a helically magnetized on its surface and pivotally supported in a housing by a driving shaft 13 coupled with a motor. The helical magnet shaft 11 is housed in a case 23 and arranged in a state that it is isolated from an atmosphere in a chamber. By introducing a refrigerant into the case 23, the helical magnet 11a can be effectively cooled.
摘要翻译：要解决的问题：提供能够通过冷却螺旋磁体来防止退磁的输送装置。解决方案：传送装置T的磁性螺杆驱动机构9，用于使螺旋磁体轴11旋转，螺旋磁体轴11具有在其表面上螺旋磁化的螺旋磁体11a，并通过与马达结合的驱动轴13枢转地支撑在壳体中。螺旋磁体轴11容纳在壳体23中并且以与室中的气氛隔离的状态配置。通过将制冷剂引入壳体23，可以有效地冷却螺旋磁体11a。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011149086A Sputtering apparatus and method of manufacturing electronic device 有权
标题翻译：溅射装置及制造电子装置的方法
公开(公告)号：JP2011149086A
公开(公告)日：2011-08-04
申请号：JP2010127300
申请日：2010-06-02
申请人： Canon Anelva Corp , キヤノンアネルバ株式会社
发明人： OISHI TETSUYA , FUJIMOTO TAKESHI
IPC分类号： C23C14/34
CPC分类号： C23C14/02 , C23C14/34 , C23C14/564 , H01J37/34 , H01J37/3447
摘要： PROBLEM TO BE SOLVED: To provide a compact sputtering apparatus having a small space to allow a screening mechanism to retract.
SOLUTION: A sputtering apparatus comprises a substrate holder, and a screening member configured to screen a substrate mount surface to be mounted with a substrate 18 in a surface of the substrate holder. The substrate mount surface comprises a first area and a second area. The screening member includes a first screening member 14 configured to screen at least the first area, a second screening member 15 configured to screen at least the second area and a rotating mechanism 30 configured to rotate the first screening member 14 and the second screening member 15. In the first screening member 14 and the second screening member 15, the first screening member 14 at least screens the first area by the rotation by the rotating mechanism 30, and also, the second screening member 15 is configured to be rotated to move between a screening position at which the first screening member 14 screens at least the first area and the second screening member 15 screens at least the second area and a retreat position at which the first screening member 14 and the second screening member 15 retract from an area above the substrate mount surface and overlap each other.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有小的空间以允许筛选机构缩回的紧凑型溅射装置。解决方案：溅射装置包括衬底保持器和被配置为将衬底18安装在衬底保持器的表面上的衬底安装表面的屏蔽构件。衬底安装表面包括第一区域和第二区域。遮蔽构件包括构造成至少筛选第一区域的第一遮蔽构件14，被配置为至少筛选第二区域的第二遮蔽构件15和被构造成使第一遮蔽构件14和第二遮蔽构件15旋转的旋转机构30 在第一遮蔽构件14和第二遮蔽构件15中，第一遮蔽构件14至少通过旋转机构30的旋转来筛分第一区域，并且第二遮蔽构件15被构造成旋转以在第一遮蔽构件14和第二遮蔽构件15之间移动第一遮蔽构件14至少筛选第一区域并且第二遮蔽构件15筛选至少第二区域的遮蔽位置和第一遮蔽构件14和第二遮蔽构件15从该区域上方缩回的退避位置衬底安装表面并彼此重叠。版权所有（C）2011，JPO＆INPIT

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