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    • 12. 发明授权
    • Method of manufacturing semiconductor memory
    • 制造半导体存储器的方法
    • US06420192B2
    • 2002-07-16
    • US09968921
    • 2001-10-03
    • Hiroshi MikiKeiko AbdelghafarYoshihisa Fujisaki
    • Hiroshi MikiKeiko AbdelghafarYoshihisa Fujisaki
    • H01G706
    • H01L28/56H01L21/02197H01L21/02323H01L21/0234H01L28/75
    • A semiconductor memory which is improved in reliability by preventing the lowering of capacitance and defective insulation, especially, electrode delamination. The semiconductor memory has an integrated capacitor composed of a capacitor structure constituted of an upper electrode, a lower electrode, and a capacitor insulating film (of a high-dielectric-constant or ferroelectric thin film) which is held between electrodes and serves as a capacitor insulating film, and a protective insulating film which covers the capacitor structure and is formed by plasma treatment after electrode formation. An oxygen introducing layer is formed on the surface of the capacitor insulating film. The oxygen introducing layer can be formed on the surface of the high-dielectric-constant or ferroelectric material by introducing oxygen to the boundary between the electrode and the material by conducting heat treatment in an oxygen atmosphere before the protective insulating film (SiO2 passivation film) is formed.
    • 一种半导体存储器,其通过防止电容降低和绝缘不良,特别是电极分层而提高了可靠性。 半导体存储器具有由电容器结构构成的集成电容器,该电容器结构由保持在电极之间的上电极,下电极和电容器绝缘膜(高介电常数或铁电薄膜)构成,并用作电容器 绝缘膜和覆盖电容器结构的保护绝缘膜,并且在电极形成之后通过等离子体处理形成。 在电容器绝缘膜的表面上形成氧气引入层。 通过在保护绝缘膜(SiO 2钝化膜)之前通过在氧气氛中进行热处理将氧引入电极和材料之间的边界,可以在高介电常数或铁电材料的表面上形成氧气引入层, 形成了。