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    • 11. 发明授权
    • Resistance change type memory
    • 电阻变化型存储器
    • US08324606B2
    • 2012-12-04
    • US12563470
    • 2009-09-21
    • Takayuki TsukamotoReika IchiharaHiroshi KannoKenichi Murooka
    • Takayuki TsukamotoReika IchiharaHiroshi KannoKenichi Murooka
    • H01L47/00
    • G11C11/5678G11C11/5685G11C13/0004G11C13/0007G11C13/0069G11C2213/72H01L27/101H01L27/2409H01L27/2481
    • A resistance change type memory of an aspect of the present invention including a first wiring configured to extend in a first direction, a second wiring configured to extend in a second direction crossing the first direction, a series circuit configured to connect to the first and second wirings, the series circuit including a non-ohmic element being more conductive in the first to second wiring direction than in the second to first direction and a resistance change type storage element in which data is stored according to a change of a resistance state, an energy supplying circuit configured to connect to the first wiring to supply energy to the first wiring, the energy being used to store the data in the resistance change type storage element, and a capacitance circuit configured to include a capacitive element and being connected to the second wiring.
    • 本发明的一个方面的电阻变化型存储器包括:构造成沿第一方向延伸的第一布线,沿与第一方向交叉的第二方向延伸的第二布线;串联电路,被配置为连接到第一和第二端 布线,包括在第一至第二布线方向上比在第二至第一方向上更加导电的非欧姆元件的串联电路和根据电阻状态的变化存储数据的电阻变化型存储元件, 能量供给电路,被配置为连接到所述第一布线以向所述第一布线供应能量,所述能量用于将所述数据存储在所述电阻变化型存储元件中;以及电容电路,被配置为包括电容元件并连接到所述第二布线 接线。
    • 12. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08320158B2
    • 2012-11-27
    • US12882685
    • 2010-09-15
    • Hiroshi KannoReika IchiharaTakayuki TsukamotoKenichi MurookaHirofumi Inoue
    • Hiroshi KannoReika IchiharaTakayuki TsukamotoKenichi MurookaHirofumi Inoue
    • G11C11/00
    • G11C7/02G11C13/0004G11C13/0007G11C13/0011G11C13/0064G11C13/0097G11C2213/31G11C2213/71G11C2213/72
    • Nonvolatile semiconductor memory device of an embodiment includes: a memory cell array including a plurality of first and second lines intersecting each other and plural memory cells provided at intersections of the first and second lines and having data written and erased upon application of voltages of the same polarity; and a writing circuit configured to select first and second lines and supply a set or reset pulse to the memory cell through the selected first and second lines. In an erase operation, the writing circuit repeatedly supplies the reset pulse to a selected memory cell until data is erased, by increasing or decreasing voltage level and voltage application time of the reset pulse within a reset region. The reset region, or an aggregate of combinations of voltage level and voltage application time of the reset pulse, is a region where voltage level and voltage application time are negatively correlated.
    • 一个实施例的非易失性半导体存储器件包括:存储单元阵列,包括彼此相交的多个第一和第二线,以及设置在第一和第二线的交点处的多个存储单元,并且在施加相同的电压时写入和擦除数据 极性; 以及写入电路,被配置为选择第一和第二行,并且通过所选择的第一和第二行向存储器单元提供置位或复位脉冲。 在擦除操作中,写入电路通过增加或减小复位区域内的复位脉冲的电压电平和电压施加时间,将复位脉冲重复地提供给所选择的存储单元,直到数据被擦除。 复位区域或复位脉冲的电压电平和电压施加时间的组合的总和是电压电平和电压施加时间呈负相关的区域。
    • 19. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08848418B2
    • 2014-09-30
    • US13327065
    • 2011-12-15
    • Kenichi Murooka
    • Kenichi Murooka
    • G11C11/00
    • H01L45/1233G11C8/10G11C13/0002G11C13/0023G11C2213/71G11C2213/72H01L27/2463H01L27/249H01L45/04H01L45/1226H01L45/146H01L45/147H01L45/149H01L45/1608
    • A semiconductor memory device according to an embodiment comprises a memory cell array configured from a plurality of row lines and column lines that intersect one another, and from a plurality of memory cells disposed at each of intersections of the row lines and column lines and each including a variable resistance element. Where a number of the row lines is assumed to be N, a number of the column lines is assumed to be M, and a ratio of a cell current flowing in the one of the memory cells when a voltage that is half of the select voltage is applied to the one of the memory cells to a cell current flowing in the one of the memory cells when the select voltage is applied to the one of the memory cells is assumed to be k, a relationship M2
    • 根据一个实施例的半导体存储器件包括由多个行线和列线构成的存储单元阵列,所述多个行线和列线彼此相交,并且从布置在行线和列线的每个交点处的多个存储单元组成,并且每个包括 可变电阻元件。 在假设行数为N的情况下,假设列数为M,当存储单元中存在的一个存储单元中的电池电流为选择电压的一半时的电流比 当将选择电压施加到一个存储器单元时,将存储单元中的一个施加到流过该存储单元中的一个存储单元的单元电流,则关系M2 <2×N×k 满意。
    • 20. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08320156B2
    • 2012-11-27
    • US12695512
    • 2010-01-28
    • Kenichi Murooka
    • Kenichi Murooka
    • G11C11/00G11C5/14
    • G11C13/0007G11C8/08G11C8/12G11C13/0004G11C13/0023G11C2213/71
    • A semiconductor memory device includes a plurality of first wirings; a plurality of second wirings; a plurality of memory cells positioned at respective intersections of the first wirings and the second wirings, each of the memory cells having a variable resistance element and a selective element connected to the variable resistance element in series; a first selection portion selecting the first wiring; a second selection portion selecting the second wiring; and a power source portion applying predetermined selected-wiring-voltages to a selected first wiring being selected by the first selection portion and a selected second wiring being selected by the second selection portion, respectively, and applying predetermined unselected-wiring-voltages to unselected first wirings other than the selected first wiring and unselected second wirings other than the selected second wiring, respectively. A resistance element having a predetermined resistance value is provided between the power source portion and the unselected first and second wirings.
    • 半导体存储器件包括多个第一配线; 多个第二布线; 多个存储单元,位于第一布线和第二布线的相应交点处,每个存储单元具有可变电阻元件和与可变电阻元件串联连接的选择元件; 选择第一布线的第一选择部分; 选择第二布线的第二选择部分; 以及电源部,分别对由所述第一选择部选择的所选择的第一布线和由所述第二选择部选择的所选择的第二布线分别施加预定的选择布线电压,并将预定的未选择布线电压施加到未选择的第一布线电压 除了所选择的第一布线以外的布线和除所选择的第二布线以外的未选择的第二布线。 在电源部分和未选择的第一和第二布线之间设置具有预定电阻值的电阻元件。