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    • 31. 发明授权
    • Normally-off gallium nitride-based semiconductor devices
    • 通常的氮化镓基半导体器件
    • US09385199B2
    • 2016-07-05
    • US14319490
    • 2014-06-30
    • National Semiconductor Corporation
    • Jamal Ramdani
    • H01L31/0336H01L29/225H01L29/66H01L29/778H01L29/20
    • H01L29/225H01L29/2003H01L29/66462H01L29/7786
    • A method includes forming a relaxed layer in a semiconductor device. The method also includes forming a tensile layer over the relaxed layer, where the tensile layer has tensile stress. The method further includes forming a compressive layer over the relaxed layer, where the compressive layer has compressive stress. The compressive layer has a piezoelectric polarization that is approximately equal to or greater than a spontaneous polarization in the relaxed, tensile, and compressive layers. The piezoelectric polarization in the compressive layer could be in an opposite direction than the spontaneous polarization in the compressive layer. The relaxed layer could include gallium nitride, the tensile layer could include aluminum gallium nitride, and the compressive layer could include aluminum indium gallium nitride.
    • 一种方法包括在半导体器件中形成松弛层。 该方法还包括在松弛层上形成拉伸层,其中拉伸层具有拉伸应力。 该方法还包括在松弛层上形成压缩层,其中压缩层具有压应力。 压缩层具有大致等于或大于松弛,拉伸和压缩层中的自发极化的压电极化。 压缩层中的压电极化可能与压缩层中的自发极化方向相反。 松弛层可以包括氮化镓,拉伸层可以包括氮化镓铝,并且压缩层可以包括铝铟镓氮。
    • 38. 发明授权
    • Infrared solid-state imaging device
    • 红外固态成像装置
    • US09209218B2
    • 2015-12-08
    • US14487196
    • 2014-09-16
    • Mitsubishi Electric Corporation
    • Takahiro Onakado
    • H01L29/06H01L31/072H01L31/109H01L31/0328H01L31/0336H01L27/146H01L31/0304H01L31/0352
    • H01L27/14649H01L27/14629H01L31/0304H01L31/035236
    • An infrared solid-state imaging device with unit detecting sections in a matrix form, wherein the unit detecting section includes: an infrared light guiding layer; a first reflecting layer on the infrared light guiding layer; an infrared light detecting section on the first reflecting layer, the infrared light detecting section including an infrared light absorbing layer and upper and lower contact layers; and first metal wiring connected to the upper contact layer, wherein a side wall of the unit detecting section is inclined at an angle smaller than 45° to a normal direction, to form a groove between the adjacent unit detecting sections, a first insulating layer is provided on the side wall of the unit detecting section and second metal wiring is provided on the first insulating layer, and a refractive index of the first reflecting layer is lower than that of the lower contact layer.
    • 一种具有矩阵形式的单元检测部分的红外固体成像装置,其中所述单元检测部分包括:红外光引导层; 红外光导层上的第一反射层; 所述第一反射层上的红外光检测部,所述红外光检测部具有红外光吸收层和上下接触层; 以及与所述上接触层连接的第一金属配线,其中,所述单元检测部的侧壁相对于法线方向倾斜成小于45°的角度,在相邻的单元检测部之间形成槽,第一绝缘层为 设置在单元检测部分的侧壁上,第二金属布线设置在第一绝缘层上,并且第一反射层的折射率低于下接触层的折射率。
    • 40. 发明授权
    • Non-volatile memory device
    • 非易失性存储器件
    • US09166032B1
    • 2015-10-20
    • US14483725
    • 2014-09-11
    • Kabushiki Kaisha Toshiba
    • Masaaki HiguchiKatsuyuki SekineFumiki AisoTakuo OhashiTatsuya Okamoto
    • H01L31/072H01L31/109H01L31/0328H01L31/0336H01L29/778H01L21/02
    • H01L27/11556H01L21/0262H01L21/02636H01L27/11519H01L27/11524H01L27/11565H01L27/1157H01L27/11582H01L29/7785
    • According to one embodiment, a non-volatile memory device includes a plurality of electrodes, at least one semiconductor layer, conductive layers, and first and second insulating films. The electrodes are arranged side by side in a first direction. The semiconductor layer extends into the electrodes in the first direction. The conductive layers are provided between each electrode and the semiconductor layer and separated from each other in the first direction. The first insulating film contacts the conductive layers, and extends in the first direction along the semiconductor layer between the conductive layers and the semiconductor layer. The second insulating film is provided between the first insulating film and the semiconductor layer. The first insulating film includes a first portion located between the conductive layers and the second insulating film, and a second portion located between the interlayer insulating film and the second insulating film.
    • 根据一个实施例,非易失性存储器件包括多个电极,至少一个半导体层,导电层以及第一和第二绝缘膜。 电极沿第一方向并排配置。 半导体层沿第一方向延伸到电极中。 导电层设置在每个电极和半导体层之间,并且在第一方向上彼此分离。 第一绝缘膜与导电层接触,沿导电层和半导体层之间的半导体层在第一方向上延伸。 第二绝缘膜设置在第一绝缘膜和半导体层之间。 第一绝缘膜包括位于导电层和第二绝缘膜之间的第一部分和位于层间绝缘膜和第二绝缘膜之间的第二部分。