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31. 发明授权

US09659691B2 Thin-film thermistor element and method of manufacturing the same 有权
公开(公告)号：US09659691B2
公开(公告)日：2017-05-23
申请号：US14111932
申请日：2013-07-09
申请人： SEMITEC Corporation
发明人： Kenji Ito , Tadashi Toyoda
IPC分类号： H01C7/10 , H01C7/04 , C22F1/14 , H01C17/075
CPC分类号： H01C7/041 , C22F1/14 , H01C7/04 , H01C17/075
摘要： Provided is a thin-film thermistor element including a Si substrate 2, a thermistor thin film 5 formed on the Si substrate 2, and an electrode 3 made of platinum, an alloy thereof or the like and formed on, under or inside the thermistor thin film 5. The electrode 3 is formed from a film deposited containing oxygen and nitrogen and then crystallized by heat treatment.

32. 发明授权

US09646746B2 Electrical device 有权
公开(公告)号：US09646746B2
公开(公告)日：2017-05-09
申请号：US14796644
申请日：2015-07-10
申请人： LITTELFUSE, INC.
发明人： Jaydip Das , Ting Gao , Nicola Pugliano , Mark F. Wartenberg , Diane G. Bigler , Mario G. Sepulveda , Kavitha Bharadwaj , Richard B. Lloyd
IPC分类号： H01C7/10 , H01C7/02 , C09J9/02 , H01C17/065 , H01B1/22 , H01C1/14 , H01C17/00
CPC分类号： H01C7/028 , C09J9/02 , H01B1/22 , H01C1/1406 , H01C7/027 , H01C17/00 , H01C17/06526 , H01C17/06586
摘要： An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.

33. 发明授权

US09583239B2 Electrode component with electrode layers formed on intermediate layers 有权
标题翻译：在中间层上形成电极层的电极组件
公开(公告)号：US09583239B2
公开(公告)日：2017-02-28
申请号：US14645905
申请日：2015-03-12
申请人： THINKING ELECTRONIC INDUSTRIAL CO., LTD.
发明人： Xun Xu , Jen-Heng Huang , Zhiwei Jia
IPC分类号： H01C1/14 , H01C7/10 , H01C1/142 , H01C7/102 , H01C17/28 , H01C1/144
CPC分类号： H01C1/14 , H01C1/142 , H01C1/144 , H01C7/10 , H01C7/102 , H01C17/281 , H01C17/285 , H01C17/288
摘要： An electrode component with electrode layers formed on intermediate layers includes a ceramic substrate, two intermediate layers formed on two opposite surfaces of the ceramic substrate, two electrode layers respectively formed on the two intermediate layers, two lead wires respectively connected to the electrode layers, and an insulating layer enclosing the ceramic substrate, the intermediate layers, the electrode layers, and portions of the two lead wires. The intermediate layer formed between the ceramic substrate and the electrode layer replaces the fabrication means for conventional silver electrode layer to provide good binding strength between the ceramic substrate and the electrode layer. Besides same electrical characteristics for original products, the electrode component can get rid of the use of precious silver in screen printed silver electrode and avoid pollution caused by evaporation and thermal dissolution of organic solvent while lowering the ohmic contact resistance between the electrode layer and the ceramic substrate.
摘要翻译：形成在中间层上的具有电极层的电极部件包括陶瓷基板，形成在陶瓷基板的两个相对表面上的两个中间层，分别形成在两个中间层上的两个电极层，分别连接到电极层的两个引线，以及封装陶瓷基板，中间层，电极层和两根引线的部分的绝缘层。形成在陶瓷基板和电极层之间的中间层取代了用于常规银电极层的制造装置，以提供陶瓷基板和电极层之间的良好的结合强度。除了原始产品的电气特性外，电极组件可以摆脱丝网印刷银电极中贵金属的使用，避免有机溶剂的蒸发和热溶解引起的污染，同时降低电极层和陶瓷之间的欧姆接触电阻基质。

34. 发明授权

US09536644B2 Composite resistors 有权
标题翻译：复合电阻
公开(公告)号：US09536644B2
公开(公告)日：2017-01-03
申请号：US14550811
申请日：2014-11-21
申请人： Analog Devices, Inc.
发明人： Ronald R. Gobbi
IPC分类号： H01C7/06 , H01C7/10 , H01C17/232 , H01L49/02 , H01L23/522 , H01L27/08 , H01C7/02 , H01C7/04
CPC分类号： H01C7/1013 , H01C7/02 , H01C7/04 , H01C7/06 , H01C17/232 , H01L23/5228 , H01L27/0802 , H01L28/20 , H01L2924/0002 , Y10T29/49082 , H01L2924/00
摘要： A composite resistor includes a thin film resistor element having a first temperature coefficient of resistance and a metal resistor element having a second temperature coefficient of resistance. A portion of the metal resistor element overlaps a portion of the thin film resistor element such that the portion of the metal resistor element is in thermal communication with the portion of the thin film resistor element to compensate for a resistance drift arising during operation of the composite resistor.
摘要翻译：复合电阻器包括具有第一温度系数电阻的薄膜电阻元件和具有第二温度系数电阻的金属电阻器元件。金属电阻器元件的一部分与薄膜电阻器元件的一部分重叠，使得金属电阻器元件的部分与薄膜电阻元件的部分热连通以补偿复合材料的操作期间产生的电阻漂移电阻。

35. 发明授权

US09514865B2 Multi-contact element for a varistor 有权
标题翻译：用于变阻器的多接触元件
公开(公告)号：US09514865B2
公开(公告)日：2016-12-06
申请号：US14547388
申请日：2014-11-19
申请人： PHOENIX CONTACT GMBH & CO. KG
发明人： Jan-Erik Schmutz , Friedrich-Eckhard Brand
IPC分类号： H01C7/10 , H01C7/12 , H01C1/084 , H01C1/142 , H01H85/12 , H01C1/14 , H01C7/108 , H01H85/02 , H01C7/102
CPC分类号： H01C7/126 , H01C1/084 , H01C1/14 , H01C1/142 , H01C7/102 , H01C7/108 , H01H85/0241 , H01H85/12
摘要： The object of the invention is a multi-contact element for a varistor wherein the multi-contact element has a sandwich structure, wherein the sandwich structure has two or more contact elements in a lowermost layer, and wherein the sandwich structure has at least one common connection electrode in an uppermost layer, wherein a first intermediate layer made of an electrically insulating layer of material is provided at least in segments between the lowermost layer (US) and the uppermost layer, wherein fuses are located in the first intermediate layer that are configured such that they are capable of sustaining a specified surge current, the specified surge current per fuse being less than the specified surge current of the varistor, wherein the fuses are embodied as vias within the first intermediate layer, wherein the fuses in the first intermediate layer are in direct electrical contact with the common connection electrode, wherein each of the fuses is in direct or indirect electrical contact with a subset of the contact elements (KE1, KE2), wherein the fuses provide blow-out channels in the first intermediate layer so that in the event of a thermal overloading of a fuse of the first intermediate layer, the affected fuse can vaporize through the blow-out channel.
摘要翻译：本发明的目的是用于变阻器的多接触元件，其中多接触元件具有夹层结构，其中夹层结构在最下层具有两个或更多个接触元件，并且其中夹层结构具有至少一个共同的连接电极，其中由电绝缘层材料制成的第一中间层至少在最下层（US）和最上层之间的段中提供，其中保险丝位于配置的第一中间层中使得它们能够维持指定的浪涌电流，每个保险丝的指定浪涌电流小于压敏电阻器的指定浪涌电流，其中保险丝被实施为第一中间层内的通孔，其中第一中间层中的保险丝与公共连接电极直接电接触，其中每个保险丝是直接或间接的电气与所述接触元件（KE1，KE2）的子集接触，其中所述熔断器在所述第一中间层中提供吹出通道，使得在所述第一中间层的保险丝的热过载的情况下，受影响的保险丝可以蒸发通过吹出通道。

36. 发明申请

US20160254081A1 ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREFOR 有权
标题翻译：电子元件及其生产方法
公开(公告)号：US20160254081A1
公开(公告)日：2016-09-01
申请号：US15150903
申请日：2016-05-10
申请人： NIPPON CHEMI-CON CORPORATION
发明人： Shogo Aizawa
IPC分类号： H01C17/02 , C09D7/12 , H01C1/034 , H01C7/10
CPC分类号： H01C17/02 , C08K3/22 , C08K2003/2224 , C08K2003/2227 , C09D7/61 , H01C1/034 , H01C7/10 , H01C7/1006 , H01C7/102
摘要： A production method for an electronic component using an exterior packaging material containing a silicone resin comprises a step of dipping an element into an exterior packaging material containing a silicone resin to which aluminum hydroxide or magnesium hydroxide and a nonpolar solvent are added, an additive amount of the aluminum hydroxide or the magnesium hydroxide being controlled to a range of 60 [wt. %] or more to less than 70 [wt. %], a step of drying the exterior packaging material formed on a surface of the element to evaporate the nonpolar solvent and cause a silicone resin component to appear on a surface of the exterior packaging material, and a curing step of curing the exterior packaging material.
摘要翻译：使用含有硅酮树脂的外部包装材料的电子部件的制造方法包括将元件浸渍到含有添加了氢氧化铝或氢氧化镁和非极性溶剂的有机硅树脂的外部包装材料的添加量将氢氧化铝或氢氧化镁控制在60 [wt。％]以上至小于70 [wt。％），干燥形成在元件表面上的外包装材料的步骤，蒸发非极性溶剂，并使有机硅树脂成分出现在外包装材料的表面上;固化步骤，使外包装材料固化。

37. 发明申请

US20160111215A1 CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
标题翻译：芯片电子元件和板子
公开(公告)号：US20160111215A1
公开(公告)日：2016-04-21
申请号：US14671714
申请日：2015-03-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sang Soo PARK , Soon Ju LEE , Young Ghyu AHN , Heung Kil PARK
IPC分类号： H01G4/30 , H01G4/012 , H01G4/224 , H01C7/10 , H05K1/02 , H01L41/083 , H01C7/00 , H01G4/12 , H05K1/18
CPC分类号： H01G4/30 , H01C1/14 , H01C1/148 , H01C7/008 , H01C7/10 , H01C7/18 , H01G2/065 , H01G4/12 , H01G4/232 , H05K1/141 , H05K3/3442 , H05K2201/049 , H05K2201/10015 , H05K2201/10378 , H05K2201/2045 , Y02P70/613
摘要： There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.
摘要翻译：提供一种芯片电子部件可以包括：陶瓷体; 形成在陶瓷体的两侧部的外部电极; 以及支撑陶瓷体并与外部电极电连接的插入件，其中插入件包括形成在其两侧部分上的第一和第二端子电极以及在第一和第二端子电极内部形成的凹部。

38. 发明申请

US20160035466A1 ELECTRODE COMPONENT WITH PRETREATED LAYERS 有权
标题翻译：具有预制层的电极组件
公开(公告)号：US20160035466A1
公开(公告)日：2016-02-04
申请号：US14645905
申请日：2015-03-12
申请人： THINKING ELECTRONIC INDUSTRIAL CO., LTD.
发明人： Xun XU , Jen-Heng HUANG , Zhiwei JIA
IPC分类号： H01C1/14 , H01C17/00 , H01C7/10
CPC分类号： H01C1/14 , H01C1/142 , H01C1/144 , H01C7/10 , H01C7/102 , H01C17/281 , H01C17/285 , H01C17/288
摘要： An electrode component with pretreated layers includes a ceramic substrate, two pretreated layers formed on two opposite surfaces of the ceramic substrate, two electrode layers respectively formed on the two pretreated layers, two pins respectively connected to the electrode layers, and an insulating layer enclosing the ceramic substrate, the pretreated layers, the electrode layers, and portions of the two pins. The pretreated layer formed between the ceramic substrate and the electrode layer replaces the fabrication means for conventional silver electrode layer to provide good binding strength between the ceramic substrate and the electrode layer. Besides same electrical characteristics for original products, the electrode component can get rid of the use of precious silver in screen printed silver electrode and avoid pollution caused by evaporation and thermal dissolution of organic solvent while lowering the ohmic contact resistance between the electrode layer and the ceramic substrate.
摘要翻译：具有预处理层的电极组件包括陶瓷衬底，形成在陶瓷衬底的两个相对表面上的两个预处理层，分别形成在两个预处理层上的两个电极层，分别连接到电极层的两个引脚和包围陶瓷基板，预处理层，电极层和两个销的部分。形成在陶瓷基板和电极层之间的预处理层取代了用于常规银电极层的制造装置，以在陶瓷基板和电极层之间提供良好的结合强度。除了原始产品的电气特性外，电极组件可以摆脱丝网印刷银电极中贵金属的使用，避免有机溶剂的蒸发和热溶解引起的污染，同时降低电极层和陶瓷之间的欧姆接触电阻基质。

39. 发明授权

US09236844B2 Ceramic multilayer component 有权
标题翻译：陶瓷多层成分
公开(公告)号：US09236844B2
公开(公告)日：2016-01-12
申请号：US13576941
申请日：2011-02-09
申请人： Thomas Feichtinger , Pascal Dotta , Hannes Schiechl
发明人： Thomas Feichtinger , Pascal Dotta , Hannes Schiechl
IPC分类号： H03H7/01 , H01C7/10 , H01C7/12 , H01G4/40 , H03H1/00
CPC分类号： H03H7/0107 , H01C7/10 , H01C7/12 , H01G4/40 , H03H2001/0085
摘要： A ceramic multilayer component has a base body with connecting contacts, fitted to it, with a ferrite ceramic, which is provided for an inductive area and in which an inductance is arranged which is formed by electrical conductors, and with a varistor ceramic, wherein the varistor ceramic comprises at most 40% of the volume of the base body.
摘要翻译：一种陶瓷多层组件具有与其配合的具有连接触点的基体，其具有铁氧体陶瓷，其被设置用于感应区域，并且其中由电导体形成电感并且具有变阻器陶瓷，其中，压敏电阻陶瓷占基体体积的至多40％。

40. 发明授权

US09236170B2 ZnO multilayer chip varistor with base metal inner electrodes and preparation method thereof 有权
标题翻译：具有贱金属内电极的ZnO多层芯片变阻器及其制备方法
公开(公告)号：US09236170B2
公开(公告)日：2016-01-12
申请号：US14320301
申请日：2014-06-30
申请人： Huazhong University of Science and Technology
发明人： Qiuyun Fu , Dongxiang Zhou , Yunxiang Hu , Zhiping Zheng , Wei Luo , Tao Chen
IPC分类号： H01C7/10 , H01C7/112 , H01C7/18 , H01C17/065
CPC分类号： H01C7/1006 , H01C7/112 , H01C7/18 , H01C17/06546 , Y10T29/49082
摘要： Provided are a multilayer chip ZnO varistor with base metal inner electrodes and a preparation method thereof. The varistor is formed by ceramic sheets and inner electrodes which were alternately laminated. Wherein the main material of inner electrodes is the base metal nickel(Ni), both ends of the varistor are coated with silver electrodes. The present invention has the following beneficial effects: (1) the material formula of ZnO varistor is suitable for the preparation process of reduction and reoxidation; (2) the base metal Ni is used as inner electrodes which can sharply reduce the preparation cost of a multilayer chip ZnO varistor; (3) using a conventional solid-phase sintering method, it can complete the burning of silver and the oxidation of the ceramic simultaneously which is suitable for mass production; (4) the nonlinear coefficient of the ZnO multilayer chip varistor produced by the method of this invention can reach 30 or more, the varistor breakdown voltage is less than 20V and the size can be standard chip package size 0805,0603,0402 and 0201.
摘要翻译：提供一种具有贱金属内电极的多层片ZnO变阻器及其制备方法。变阻器由交替层叠的陶瓷片和内部电极形成。其中内电极的主要材料为贱金属镍（Ni），变阻器的两端涂有银电极。本发明具有以下有益效果：（1）ZnO变阻器的材料配方适用于还原和再氧化的制备过程; （2）使用贱金属Ni作为内部电极，可以大大降低多层片状ZnO压敏电阻的制备成本; （3）采用常规的固相烧结方法，可以同时完成银的燃烧和同时氧化，适合批量生产; （4）通过本发明方法制备的ZnO多层片式变阻器的非线性系数可以达到30以上，压敏电阻击穿电压小于20V，尺寸可以是标准芯片封装尺寸0805,0603,0402和0201。

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