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    • 51. 发明授权
    • Method for reducing stress in epitaxial growth
    • 减少外延生长中的应力的方法
    • US08552465B2
    • 2013-10-08
    • US13293031
    • 2011-11-09
    • Steven D. Lester
    • Steven D. Lester
    • H01L33/12
    • H01L33/12H01L33/007H01L33/32H01L33/46
    • A device and method for making the same are disclosed. The device includes a substrate having a first TEC, a stress relief layer overlying the substrate, and crystalline cap layer. The crystalline cap layer overlies the stress relief layer. The cap layer has a second TEC different from the first TEC. The stress relief layer includes an amorphous material that relieves stress between the crystalline substrate and the cap layer arising from differences in the first and second TECs at a growth temperature at which layers are grown epitaxially on the cap layer. The device can be used to construct various semiconductor devices including GaN LEDs that are fabricated on silicon or SiC wafers. The stress relief layer is generated by converting a layer of precursor material on the substrate after the cap layer has been grown to a stress-relief layer.
    • 公开了一种制造该装置及其制造方法。 该器件包括具有第一TEC,覆盖衬底的应力消除层和晶体覆盖层的衬底。 结晶覆盖层覆盖应力消除层。 盖层具有与第一TEC不同的第二TEC。 所述应力消除层包括无定形材料,其在由所述盖层外延生长所述层的生长温度时,减轻由所述第一和第二TEC的差异引起的所述晶体衬底和所述覆盖层之间的应力。 该器件可用于构建在硅或SiC晶片上制造的包括GaN LED的各种半导体器件。 应力消除层是通过在覆盖层已经生长到应力消除层之后将衬底上的前体材料层转化而产生的。
    • 52. 发明申请
    • Method for Reducing Stress in Epitaxial Growth
    • 减少外延生长中的应力的方法
    • US20120319160A1
    • 2012-12-20
    • US13293031
    • 2011-11-09
    • Steven D. Lester
    • Steven D. Lester
    • H01L33/12H01L33/32
    • H01L33/12H01L33/007H01L33/32H01L33/46
    • A device and method for making the same are disclosed. The device includes a substrate having a first TEC, a stress relief layer overlying the substrate, and crystalline cap layer. The crystalline cap layer overlies the stress relief layer. The cap layer has a second TEC different from the first TEC. The stress relief layer includes an amorphous material that relieves stress between the crystalline substrate and the cap layer arising from differences in the first and second TECs at a growth temperature at which layers are grown epitaxially on the cap layer. The device can be used to construct various semiconductor devices including GaN LEDs that are fabricated on silicon or SiC wafers. The stress relief layer is generated by converting a layer of precursor material on the substrate after the cap layer has been grown to a stress-relief layer.
    • 公开了一种制造该装置及其制造方法。 该器件包括具有第一TEC,覆盖衬底的应力消除层和晶体覆盖层的衬底。 结晶覆盖层覆盖应力消除层。 盖层具有与第一TEC不同的第二TEC。 所述应力消除层包括无定形材料,其在由所述盖层外延生长所述层的生长温度时,减轻由所述第一和第二TEC的差异引起的所述晶体衬底和所述覆盖层之间的应力。 该器件可用于构建在硅或SiC晶片上制造的包括GaN LED的各种半导体器件。 应力消除层是通过在覆盖层已经生长到应力消除层之后将衬底上的前体材料层转化而产生的。
    • 53. 发明申请
    • AC LED Light Source with Reduced Flicker
    • 交流LED光源,减少闪烁
    • US20120133289A1
    • 2012-05-31
    • US13084331
    • 2011-04-11
    • David HumSteven D. Lester
    • David HumSteven D. Lester
    • H05B37/02
    • H05B33/083H05B33/0824
    • A lighting apparatus and method for operating LED-based lighting devices are disclosed. The apparatus includes a receiver that receives a potential from a power source whose output varies as a function of time, an energy storage device, and an LED array. The energy storage device stores energy from the power source when the driving potential is greater than a predetermined value. The LED array has variable forward bias potential, the LED array generating light when a potential across the array is greater than the selected forward bias potential. A source selector connects the energy storage device to the array when the potential from the power source is less than a predetermined value. A controller that varies the forward bias potential such that the difference between the forward bias potential and potential across the array is maintained at a value less than a predetermined value.
    • 公开了一种用于操作基于LED的照明装置的照明装置和方法。 该装置包括从输出随时间变化的电源接收电位的接收器,能量存储装置和LED阵列。 当驱动电位大于预定值时,能量存储装置存储来自电源的能量。 LED阵列具有可变的正向偏置电位,当阵列上的电位大于所选择的正向偏置电位时,LED阵列产生光。 当来自电源的电位小于预定值时,源选择器将能量存储装置连接到阵列。 控制器,其改变正向偏置电位,使得正向偏置电位和阵列之间的电位之间的差保持在小于预定值的值。
    • 58. 发明授权
    • GaN based LED with improved light extraction efficiency and method for making the same
    • 具有提高光提取效率的GaN基LED和制造其的方法
    • US07993943B2
    • 2011-08-09
    • US12688918
    • 2010-01-18
    • Steven D. Lester
    • Steven D. Lester
    • H01L21/00
    • H01L33/22H01L33/32H01L33/42
    • A light-emitting device and the method for making the same are disclosed. The device includes a substrate, a light-emitting structure and a light scattering layer. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The light scattering layer includes a GaN crystalline layer characterized by an N-face surface. The N-face surface includes features that scatter light of the predetermined wavelength. The light-emitting structure is between the N-face surface and the substrate.
    • 公开了一种发光器件及其制造方法。 该装置包括基板,发光结构和光散射层。 发光结构包括夹在p型GaN层和n型GaN层之间的有源层,当从n型GaN层和p型GaN层的电子和空穴发射预定波长的光时,有源层 GaN层分别结合在一起。 光散射层包括以N面表面为特征的GaN结晶层。 N面表面包括散射预定波长的光的特征。 发光结构在N面和衬底之间。