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    • 52. 发明授权
    • Perpendicular magnetic recording (PMR) writer with minimized internal flux shunting
    • 垂直磁记录(PMR)写入器,最小化内部通量分流
    • US09299367B1
    • 2016-03-29
    • US14813887
    • 2015-07-30
    • Headway Technologies, Inc.
    • YuHui TangYaguang WeiYue LiuJiun-Ting LeeMoris Dovek
    • G11B5/127
    • G11B5/127G11B5/1278G11B5/23G11B5/3116G11B5/315
    • A perpendicular magnetic recording (PMR) writer is disclosed wherein a 19-24 kG hot seed layer is formed between a gap layer and a 10-19 kG magnetic layer in a partially wrapped around shield structure involving side shields and trailing shield to reduce internal flux shunting, improve writability, and enable side gap and write gap dimensions 5-10 nm smaller than typical writers for conventional and shingled magnetic recording. Side shields have a bottom surface formed along a plane that is parallel to the main pole leading edge, and at a down-track distance from 50 nm above to 100 nm below the leading edge. Cross-track and down-track field gradients are improved by fully coupling the trailing shield and side shield hot seed layers. Also, side shield hot seed layers have a height
    • 公开了一种垂直磁记录(PMR)写入器,其中在间隙层和10-19kG磁性层之间形成一个19-24kG的热种子层,该部分缠绕的屏蔽结构包括侧屏蔽和后屏蔽以减少内部通量 分流,改善可写性,并使边缘间隙和写入间隙尺寸比常规和带状磁记录的典型作者小5-10纳米。 侧面屏蔽具有沿平行于主极前缘的平面形成的底表面,并且在前缘下方50nm至100nm之间的下轨道距离处。 通过完全耦合后盾和侧屏热种子层,提高了跨轨道和下轨道场梯度。 此外,侧屏热种子层的高度<0.15微米并且小于10-19kG侧屏蔽层高度以减少内部通量分流。
    • 55. 发明授权
    • Method and apparatus for scrubbing accumulated data errors from a memory system
    • 用于从存储器系统中擦除累积的数据错误的方法和装置
    • US09170879B2
    • 2015-10-27
    • US12456923
    • 2009-06-24
    • Hsu Kai Yang
    • Hsu Kai Yang
    • G06F11/10G11C16/34G11C29/46
    • G06F11/106G06F11/1096G11C16/3418G11C16/349G11C29/46
    • A data scrubbing apparatus corrects disturb data errors occurring in an array of memory cells such as SMT MRAM cells. The data scrubbing apparatus receives an error indication that an error has occurred during a read operation of a grouping of memory cells within the array of memory cells. The data scrubbing apparatus may generate an address describing the location of the memory cells to be scrubbed. The data scrubbing apparatus then commands the array of memory cells to write back the corrected data. Based on a scrub threshold value, the data scrubbing apparatus writes the corrected data back after a specific number of errors. The data scrubbing apparatus may further suspend writing back during a writing of data. The data scrubbing apparatus provides a busy indicator externally during a write back of corrected data.
    • 数据擦除装置校正在诸如SMT MRAM单元的存储单元阵列中发生的干扰数据错误。 数据擦除装置接收在存储器单元阵列内的一组存储器单元的读取操作期间发生错误的错误指示。 数据擦除装置可以生成描述要擦除的存储器单元的位置的地址。 然后,数据擦除装置命令存储器单元阵列回写校正的数据。 基于擦除阈值,数据擦除装置在经过特定数量的错误之后写入校正后的数据。 数据擦除装置可以在写入数据期间进一步中止写回。 在校正数据的回写期间,数据擦除装置在外部提供忙指示符。
    • 56. 发明授权
    • Copper plating method
    • 镀铜方法
    • US09103012B2
    • 2015-08-11
    • US12931854
    • 2011-02-11
    • Chao-Peng ChenJas ChudasamaChien-Li LinDavid Wagner
    • Chao-Peng ChenJas ChudasamaChien-Li LinDavid Wagner
    • C25D5/34C23C2/02C23C14/58C25D5/02G11B5/17C23F1/12
    • C23F1/12C23C2/02C23C14/5873C25D5/022C25D5/34G11B5/17
    • A method of activating a copper seed layer during a plating process is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.
    • 公开了一种在镀覆工艺期间激活铜籽晶层的方法,其包括施加由超声波雾化器产生的蒸气。 通电的蒸气滴包括水和弱的有机酸如乙酸,乳酸,柠檬酸,尿酸,草酸或甲酸,其蒸气压接近于水。 弱有机酸优选具有足够高的pKa以避免Cu蚀刻,但是足够的酸性以与高通量制造相容的速率除去氧化铜。 在一个实施方案中,将弱酸/水蒸汽施加到旋转碗中的基底上,然后在同一旋转碗中进行去离子水漂洗步骤。 改进的润湿性导致随后镀覆的铜膜的均匀性提高。 由于化学品消耗减少和产品产量提高,实现了大量的成本节约。