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    • 55. 发明授权
    • Method for improving crystallinity of semiconductor ribbon
    • 改善半导体带状结晶度的方法
    • US4602980A
    • 1986-07-29
    • US656390
    • 1984-10-01
    • Ralph J. EllisRonald N. LeggeIsrael A. Lesk
    • Ralph J. EllisRonald N. LeggeIsrael A. Lesk
    • H01L21/18C30B13/00C30B13/22C30B13/24C30B29/64H01L31/04
    • C30B13/005C30B13/24Y10S117/904Y10S117/905Y10T117/1088
    • A method is disclosed for improving the crystallinity of semiconductor ribbon material while increasing the material throughput and decreasing energy requirements. The crystallinity of a ribbon of semiconductor material can be improved by forming a localized molten zone in the material and sweeping this molten zone along the length of the material. As the molten zone refreezes, the material is locally recrystallized with enhanced grain size. In accordance with the invention, two ribbons are positioned back-to-back with a slight spacing between the ribbons. Energy sources are focused on the outer surfaces of the two ribbons to create a molten zone in each of the ribbons. Because of the close proximity between the ribbons, much of the energy reradiated from each molten zone is absorbed by the adjacent ribbon. The molten zones are then swept along both of the ribbons to simultaneously cause crystal improvement in both ribbons. The total energy input required for recrystallizing two ribbons is only slightly greater than the energy required to recrystallize one ribbon. Further improvements in the process are achieved by positioning a thermal diffuser between the two ribbons and/or staggering the relative positions of the molten zones.
    • 公开了一种用于提高半导体带状材料的结晶度同时增加材料通过量并降低能量需求的方法。 半导体材料带的结晶度可以通过在材料中形成局部熔融区域并沿着材料的长度扫过该熔融区域来改善。 随着熔融区的重熔,材料会随着晶粒尺寸的增加而局部再结晶。 根据本发明,两条带之间以较小的间距背靠背设置。 能量源集中在两个带的外表面上以在每个带中形成熔融区。 由于带之间的紧密接近,从每个熔融区域重新辐射的大部分能量被相邻的带吸收。 然后将熔融区域沿着两条带扫过,以同时在两条带上引起晶体改善。 重结晶两个带所需的总能量输入仅略微大于重结晶一个色带所需的能量。 通过将热扩散器定位在两个带之间和/或交错熔融区的相对位置来实现该过程的进一步改进。
    • 58. 发明授权
    • Product made by method of entraining dislocations and other crystalline
defects
    • 通过夹带位错和其他结晶缺陷的方法制成的产品
    • US4562106A
    • 1985-12-31
    • US617311
    • 1984-06-04
    • Michael W. GeisHenry I. Smith
    • Michael W. GeisHenry I. Smith
    • C30B13/00C30B13/28C30B27/00B32B33/00
    • C30B27/00C30B13/00C30B13/28C30B29/60Y10S148/06Y10T428/24802
    • A substrate, such as a film of thermally grown silicon dioxide on a silicon wafer is coated with a thin film of polycrystalline or amorphous silicon in the thickness range 0.05-10.mu. deposited by chemical vapor deposition. An encapsulation layer that is a composite of 2 .mu.m thickness SiO.sub.2, 30 nm of Si.sub.3 N.sub.4 is deposited on the thin film. A pattern of stripes is created on this encapsulation layer made of materials, such as titanium, silicon, silicon dioxide and photoresist. A long and narrow molten zone is created in the film with its long axis oriented perpendicular to the lines and is moved with a movable strip-heater over in a direction parallel to the lines in the recrystallization process to establish dislocation and crystalline defects in the film entrained to follow the pattern of the stripes at locations related to the stripes.
    • 诸如硅晶片上的热生长二氧化硅的薄膜的衬底涂覆有通过化学气相沉积沉积的厚度范围为0.05-10μm的多晶或非晶硅薄膜。 作为2μm厚的SiO 2,30nm的Si 3 N 4的复合体的封装层沉积在薄膜上。 在由诸如钛,硅,二氧化硅和光致抗蚀剂的材料制成的该封装层上形成条纹图案。 在膜中产生长而窄的熔融区,其长轴垂直于线,并且在可再循环过程中与可行的带状加热器在平行于线的方向上移动,以在膜中形成位错和晶体缺陷 夹带在与条纹相关的位置跟随条纹图案。