会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 67. 发明授权
    • Part-conveying apparatus
    • 部件输送设备
    • US06257394B1
    • 2001-07-10
    • US09343701
    • 1999-06-30
    • Shigeki TakahashiNihei KaishitaAkira Nemoto
    • Shigeki TakahashiNihei KaishitaAkira Nemoto
    • B65G4704
    • B65G27/12B65G47/1407B65G47/1428
    • A part-conveying apparatus allows parts to align and slide down a sloped chute without stacking therein. The part-conveying apparatus has a chute sloped to align and slide down parts, and a first mobile blade for slidably supporting the parts in a bottom section of the chute in the direction of the chute 9. The lower end section of the chute is connected to a horizontal guide path, and a second conveying blade movable forward and backward is provided in a bottom section of the guide path. The second conveying blade reciprocates in a manner so as to move backward faster than to move forward, thereby conveying forward the parts placed thereon. A projection in the lower end of the first mobile blade engages with a groove of the second mobile blade so as to cause fine movements of the first conveying blade in the direction of the chute in synchronous with back and forth movements of the second conveying blade 26. This allows the parts to side down.
    • 部件输送装置允许部件在没有堆叠的情况下对准和滑动倾斜的滑槽。 部件输送装置具有倾斜的倾斜部,用于对准和滑下部分;以及第一可动叶片,用于沿滑槽9的方向可滑动地支撑滑槽的底部中的部分。滑槽的下端部分连接 并且在引导路径的底部设置有可前后移动的第二输送叶片。 第二输送叶片以向前移动的方式往复运动,从而向前运送放置在其上的部件。 第一活动叶片的下端部的突出部与第二活动叶片的槽接合,从而与第二输送叶片26的前后运动同时地使第一输送叶片在滑槽的方向上进行精细的运动 这允许零件朝向侧面。
    • 68. 发明授权
    • Apparatus for transporting parts
    • 运输零件的装置
    • US06241461B1
    • 2001-06-05
    • US09307730
    • 1999-05-10
    • Shigeki TakahashiNihei KaishitaAkira Nemoto
    • Shigeki TakahashiNihei KaishitaAkira Nemoto
    • B65G2504
    • H05K13/028B65G25/06B65G27/12B65G47/1407
    • A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a second stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts; and a movable first stopper which stops the first part at the tip of the guiding groove; wherein the first stopper is moved forwards synchronously with the transporting member immediately prior to completion of the forward movement of the transporting member, thereby separating the first part in the row from the second part. The first stopper retreats following the retreat of the transporting member. Such an arrangement provides for an apparatus for transporting parts, wherein the first part and second part can be separated in a sure manner even in the event that the parts are non-magnetic material, wherein ease of extracting of the first part is facilitated, and wherein parts can be supplied in a sure manner even in the event that an extracting failure occurs.
    • 一种部件传送装置包括:引导槽,用于排列一排中的部件并引导部件; 传送构件,其设置在引导槽的基部并通过其沿着槽向前和向后沿向前方向传送部件; 以及用于沿前后方向往复驱动传送部件的驱动装置; 其中传送构件缓慢前进并且迅速地缩回,以便将部件向前运送。 提供这样的结构是:第二止动件,其沿着导向槽的宽度方向开闭,并将第二部分从该列的前部保持; 以及可移动的第一止动件,其将所述第一部分停止在所述引导槽的末端; 其中,所述第一止动件在所述输送构件的向前移动完成之前立即与所述输送构件同步向前移动,从而将所述行中的所述第一部分与所述第二部分分离。 第一个塞子在运送构件撤退后撤退。 这种布置提供了用于运输部件的装置,其中即使在部件是非磁性材料的情况下,第一部分和第二部分也可以以可靠的方式分离,其中易于提取第一部分的方便,以及 即使在提取失败的情况下也可以以可靠的方式供给部件。
    • 70. 发明授权
    • Manufacturing method of semiconductor device
    • 半导体器件的制造方法
    • US5470770A
    • 1995-11-28
    • US413404
    • 1995-03-30
    • Shigeki TakahashiMitsuhiro KataokaTsuyoshi Yamamoto
    • Shigeki TakahashiMitsuhiro KataokaTsuyoshi Yamamoto
    • H01L21/316H01L21/336H01L29/78H01L21/8234
    • H01L21/02255H01L21/02238H01L21/31662H01L29/7813Y10S148/126
    • A manufacturing method for a semiconductor device, which can attain a low ion voltage in a manufacturing method for a semiconductor device involving a process for forming a groove by etching prior to selective oxidation, selectively oxidizing a region including the groove and thereby making a channel part of the groove, is disclosed. A groove part is thermally oxidized by using a silicon nitride film as a mask. A LOCOS oxide film is formed by this thermal oxidation, and concurrently a U-groove is formed on the surface of an n.sup.- -type epitaxial layer eroded by the LOCOS oxide film, and the shape of the U-groove is fixed. A curve part formed during a chemical dry etching process remains as a curve part on the side surface of the U-groove. Then, an n.sup.+ -type source layer is formed by means of thermal diffusion to a junction thickness of 0.5 to 1 .mu.m, and a channel is set up as well. The junction depth obtained by this thermal diffusion is set up more deeply than the curve part which is formed during the above etching and remains on the side surface of the U-groove after the above selective thermal oxidation.
    • 一种用于半导体器件的制造方法的半导体器件的制造方法,其包括在选择性氧化之前通过蚀刻形成沟槽的工艺的半导体器件的制造方法,选择性地氧化包括沟槽的区域,从而形成沟道部分 的凹槽。 通过使用氮化硅膜作为掩模将槽部热氧化。 通过该热氧化形成LOCOS氧化物膜,并且在由LOCOS氧化物膜侵蚀的n型外延层的表面上形成U形槽,并且U形槽的形状被固定。 在化学干蚀刻过程中形成的曲线部分在U形槽的侧表面上保持为曲线部分。 然后,通过热扩散形成0.5±1μm的结合厚度的n +型源极层,并且还设置沟道。 通过该热扩散获得的结深度比在上述蚀刻期间形成的曲线部分更深地设置,并且在上述选择性热氧化之后保留在U形槽的侧表面上。