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    • 71. 发明授权
    • Method for fabricating a magnetic write pole having an improved sidewall angle profile
    • 具有改进的侧壁角轮廓的磁性写入极的制造方法
    • US09431038B1
    • 2016-08-30
    • US14753630
    • 2015-06-29
    • Western Digital (Fremont), LLC
    • Jinqiu ZhangXiaoyu YangFeng LiuXiaojun ZhangKrishna ChetryMasahiro OsugiNing Wu
    • G11B5/11B44C1/22G11B5/31G11B5/60
    • G11B5/3163G11B5/1278G11B5/3116
    • A method provides a magnetic device having an air-bearing surface (ABS) location. A layer including first and second sublayers is provided. The first sublayer includes the ABS location. The second sublayer recessed from the ABS location such that part of the first sublayer is between the second sublayer and the ABS location. The first sublayer has a rear surface oriented at a nonzero, acute angle from a surface perpendicular to the ABS location. A trench is formed in the layer. The trench has a bottom, a top and sidewalls. The sidewalls form a first angle with a direction perpendicular to the bottom at the ABS location. The sidewalls form a second angle with the direction in part of the second sublayer. The second angle is smaller than the first angle. The sidewall angle varies along the rear surface of the first sublayer. A main pole is provided in the trench.
    • 一种方法提供具有空气轴承表面(ABS)位置的磁性装置。 提供包括第一和第二子层的层。 第一子层包括ABS位置。 第二子层从ABS位置凹陷,使得第一子层的一部分位于第二子层和ABS位置之间。 第一子层具有从垂直于ABS位置的表面定向成非零锐角的后表面。 在该层中形成沟槽。 沟槽具有底部,顶部和侧壁。 在ABS位置处,侧壁与垂直于底部的方向形成第一角度。 侧壁与第二子层的一部分中的方向形成第二角度。 第二角度小于第一角度。 侧壁角沿第一子层的后表面变化。 沟槽中设有主极。
    • 75. 发明申请
    • METHOD FOR EXPOSING PHOTORESIST IN A MICROELECTRIC DEVICE
    • 曝光微电极器件的方法
    • US20160154310A1
    • 2016-06-02
    • US15017882
    • 2016-02-08
    • Western Digital (Fremont), LLC
    • HONGPING YUANHAI SUNXIANZHONG ZENGWINNIE YU
    • G03F7/20
    • G03F7/2022G03F7/70466H01L21/0274
    • A method and system provide microelectric devices on fields on a substrate. Each field includes at least one microelectric device having a critical device feature and remaining device feature(s) distal from the critical device feature. The method and system include providing a photoresist layer for fabricating the microelectric devices and exposing the photoresist layer using a dark field mask. The dark field mask is for defining a critical mask feature corresponding to the critical device feature and exposing a first portion of the fields. The first portion includes not more than five percent of each field. The method and system further include exposing the photoresist layer using a clear field mask. The clear field mask is for defining remaining mask feature(s) corresponding to the remaining device feature(s). The clear field mask exposes a second portion of the fields that is different from the first portion.
    • 一种方法和系统在衬底上的场上提供微电子器件。 每个场包括至少一个具有关键装置特征的微电子装置和远离关键装置特征的剩余装置特征。 所述方法和系统包括提供用于制造微电子器件的光致抗蚀剂层并且使用暗场掩模曝光光致抗蚀剂层。 暗场掩模用于定义与关键设备特征对应的关键掩模特征并暴露场的第一部分。 第一部分不超过每个领域的百分之五。 该方法和系统还包括使用清晰的场屏蔽来曝光光致抗蚀剂层。 清除场掩模用于定义对应于剩余设备特征的剩余掩模特征。 清除场掩模曝光与第一部分不同的场的第二部分。
    • 80. 发明授权
    • Short yoke length coils for magnetic heads in disk drives
    • 用于磁盘驱动器磁头的短磁轭长度线圈
    • US09245545B1
    • 2016-01-26
    • US13899260
    • 2013-05-21
    • Western Digital (Fremont), LLC
    • Ut TranYunhe HuangKeith Y. SasakiCurtis V. MacchioniZhigang Bai
    • H01B13/00G11B5/33
    • G11B5/332G11B5/3123
    • A method of forming a single layer inductive coil structure includes forming a first conductive coil on a substrate, forming an insulating layer by atomic layer deposition (ALD) over the first coil and the substrate, and forming one or more additional conductive coils on each of adjacent sides of the first coil insulated from the first coil and the substrate by the insulating layer. A method of forming a stacked layer inductive coil includes forming a cavity in a substrate, forming a first coil in the cavity wherein the cavity has an atomic layer deposition (ALD) layer, forming a second coil in the cavity adjacent to the first coil and separated by the ALD layer from the first coil, forming an insulating layer over the first and second coil, and forming a third coil on the insulating layer.
    • 形成单层感应线圈结构的方法包括在衬底上形成第一导电线圈,通过在第一线圈和衬底上的原子层沉积(ALD)形成绝缘层,并且在每一个上形成一个或多个附加的导电线圈 通过绝缘层与第一线圈和衬底绝缘的第一线圈的相邻侧。 形成叠层感应线圈的方法包括在衬底中形成空腔,在空腔中形成第一线圈,其中空腔具有原子层沉积(ALD)层,在邻近第一线圈的空腔中形成第二线圈,以及 通过ALD层与第一线圈隔开,在第一和第二线圈上形成绝缘层,并在绝缘层上形成第三线圈。