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    • 74. 发明授权
    • Method for monitoring thermal control
    • 监控热控制的方法
    • US08087823B2
    • 2012-01-03
    • US12193497
    • 2008-08-18
    • Francois AubeTimothy M. CurtinMatthew S. GradyThomas P. ScanlonEric N. Smith
    • Francois AubeTimothy M. CurtinMatthew S. GradyThomas P. ScanlonEric N. Smith
    • G01K1/00G01K7/00G01K3/00H01L35/00
    • G01K7/01G01K15/00G01R31/2874
    • A structure has a heat dissipating feature, an internal temperature measurement device, and a memory. The structure generates heat as power is supplied to the structure, and a threshold voltage of the internal temperature measurement device changes as the temperature of the temperature measurement device changes. The embodiments herein establish a linear relationship between temperature and threshold voltage by heating the structure to a first temperature and recording a first threshold voltage, and then heating the structure to a second temperature and recording a second threshold voltage. From this, the embodiments herein calculate a linear relationship between temperature and threshold voltage. Further, the embodiments herein can calculate the temperatures of the structure based only upon the linear relationship and threshold voltages measured from internal temperature measurement device.
    • 结构具有散热特征,内部温度测量装置和存储器。 该结构在向结构供电时产生热量,并且内部温度测量装置的阈值电压随温度测量装置的温度变化而变化。 本文的实施例通过将结构加热到第一温度并记录第一阈值电压,然后将结构加热到第二温度并记录第二阈值电压来建立温度和阈值电压之间的线性关系。 由此,这里的实施例计算温度和阈值电压之间的线性关系。 此外,这里的实施例可以仅基于从内部温度测量装置测量的线性关系和阈值电压来计算结构的温度。
    • 75. 发明申请
    • PYROELECTRIC DETECTOR, PYROELECTRIC DETECTION DEVICE, AND ELECTRONIC INSTRUMENT
    • 光电检测器,光电检测装置和电子仪器
    • US20110316113A1
    • 2011-12-29
    • US13166937
    • 2011-06-23
    • Takafumi Noda
    • Takafumi Noda
    • H01L35/00
    • G01J5/34
    • A pyroelectric detector includes a pyroelectric detection element, a support member, and a support part. The pyroelectric detection element has a capacitor including a first electrode, a second electrode, and a pyroelectric body disposed between the first and second electrodes, and a first reducing gas barrier layer that protects the capacitor from reducing gas. The support member includes first and second sides with the pyroelectric detection element being mounted on the first side and the second side facing a cavity. The support member has a mounting member on which the capacitor is mounted and an arm member linked to the mounting member. The support part supports a portion of the support member. An outer peripheral edge of the first reducing gas barrier layer is disposed between and spaced apart from an outer peripheral edge of the mounting member and an outer peripheral edge of the capacitor in plan view.
    • 热电检测器包括热电检测元件,支撑元件和支撑部件。 热电检测元件具有包括第一电极,第二电极和布置在第一和第二电极之间的热电体的电容器,以及保护电容器免于还原气体的第一还原气体阻挡层。 支撑构件包括第一和第二侧,其中热电检测元件安装在第一侧上,第二侧面向空腔。 支撑构件具有其上安装有电容器的安装构件和连接到安装构件的臂构件。 支撑部分支撑支撑构件的一部分。 第一还原性气体阻隔层的外周缘设置在安装构件的外周边缘之间并且与平面图中的电容器的外周边缘隔开。
    • 76. 发明申请
    • PYROELECTRIC DETECTOR, PYROELECTRIC DETECTION DEVICE, AND ELECTRONIC INSTRUMENT
    • 光电检测器,光电检测装置和电子仪器
    • US20110316112A1
    • 2011-12-29
    • US13166924
    • 2011-06-23
    • Takafumi NODA
    • Takafumi NODA
    • H01L35/00
    • G01J5/02G01J5/024G01J5/0285G01J5/04G01J5/046G01J5/08G01J5/0853G01J5/34H01L37/02
    • A pyroelectric detector includes a pyroelectric detection element, a support member and a support part. The pyroelectric detection element has a capacitor including a first electrode, a second electrode, and a pyroelectric body. The support member includes first and second sides with the pyroelectric detection element being mounted on the first side and the second side facing a cavity. The support part, the support member, and the pyroelectric detection element are laminated in this order in a first direction with the cavity being formed between the support part and the support member. The support member has at least a first insulation layer on the first side contacting the first electrode, with the first insulation layer having a hydrogen content rate smaller than a hydrogen content rate of a second insulation layer positioned further in a second direction than the first insulation layer, the second direction being opposite the first direction.
    • 热电检测器包括热电检测元件,支撑元件和支撑部件。 热电检测元件具有包括第一电极,第二电极和热电体的电容器。 支撑构件包括第一和第二侧,其中热电检测元件安装在第一侧上,第二侧面向空腔。 支撑部件,支撑部件和热电检测元件以第一方向依次层压,其中空腔形成在支撑部件和支撑部件之间。 所述支撑构件在与所述第一电极接触的第一侧上具有至少第一绝缘层,所述第一绝缘层的氢含量比小于位于比所述第一绝缘体更靠第二绝缘层的第二绝缘层的第二绝缘层的氢含量率 第二方向与第一方向相反。
    • 79. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME
    • 半导体集成电路及其操作方法
    • US20110204957A1
    • 2011-08-25
    • US13102149
    • 2011-05-06
    • TADASHI KAMEYAMATakayasu ItoSeiichi SaitoKoji Sato
    • TADASHI KAMEYAMATakayasu ItoSeiichi SaitoKoji Sato
    • H01L35/00
    • G05F3/30G05F3/227
    • The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.
    • 提供了半导体集成电路,其中可以进行外部温度控制或温度监视,几乎不受安装半导体集成电路的系统板的噪声的影响。 半导体集成电路包括检测芯片温度的温度检测电路和流过大的工作电流的功能模块。 提供工作电压的外部端子和提供接地电压的外部端子耦合到功能模块。 温度检测电路产生温度检测信号和参考信号。 参考信号和温度检测信号分别经由第一外部输出端子和第二外部输出端子被引出到半导体集成电路的外部,并且被提供给具有电路类型的外部温度控制/监视电路 的差分放大电路。
    • 80. 发明申请
    • Temperature Compensation Via Power Supply Modification to Produce a Temperature-Independent Delay in an Integrated Circuit
    • 通过电源修改实现温度补偿,以在集成电路中产生与温度无关的延迟
    • US20110187441A1
    • 2011-08-04
    • US13087654
    • 2011-04-15
    • David Zimlich
    • David Zimlich
    • H01L35/00
    • H03L7/0812H03L1/022H03L7/0814
    • A method and circuitry for adjusting the delay of a variable delay line (VDL) in a delay locked loop (DLL) or other delay element or subcircuit on an integrated circuit is disclosed. Such delay circuitry will inherently have a delay which is a function of temperature. In accordance with embodiments of the invention, such temperature-dependent delays are compensated for by adjusting the power supply voltage of the VDL, delay element, or subcircuit. Specifically, a temperature sensing stage is used to sense the temperature of the integrated circuit, and hence the VDL, delay element, or subcircuit. Information concerning the sensed temperature is sent to a regulator which derives the local power supply voltage from the master power supply voltage, Vcc, of the integrated circuit. If the temperature sensed is relatively high, which otherwise would increase the delay though the VDL, delay element, or subcircuit, the regulator increases the local power supply voltage, thus decreasing the delay and offsetting the increase in delay due to temperature. Through this scheme, and assuming the temperature sensing stage is properly tuned, temperature-dependent delays can be reduced to approximately zero.
    • 公开了一种用于调整延迟锁定环(DLL)中的可变延迟线(VDL)或集成电路上的其他延迟元件或分支电路的延迟的方法和电路。 这种延迟电路固有地具有作为温度的函数的延迟。 根据本发明的实施例,通过调节VDL,延迟元件或子电路的电源电压来补偿这种依赖于温度的延迟。 具体地,使用温度感测级来感测集成电路的温度,并因此检测VDL,延迟元件或子电路。 关于感测温度的信息被发送到从集成电路的主电源电压Vcc导出本地电源电压的调节器。 如果感测到的温度相对较高,否则会增加VDL,延迟元件或分支电路的延迟,调节器会增加本地电源电压,从而减少延迟并抵消由于温度引起的延迟增加。 通过该方案,假设温度感测级被适当地调节,温度依赖的延迟可以减少到大约为零。