会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 81. 发明申请
    • Electric power conversion device
    • 电力转换装置
    • US20060215341A1
    • 2006-09-28
    • US11338668
    • 2006-01-25
    • Naoki SakuraiMutsuhiro Mori
    • Naoki SakuraiMutsuhiro Mori
    • H02H3/00
    • H03K17/0828H01L2924/0002H03K2017/0806H01L2924/00
    • An object of the present invention is to provide an electric power converter including means for accurately detecting a principal current of IGBT. An electric power conversion device according to the present invention includes principal current estimation means for estimating a principal current by using: an output of temperature measuring means whose diode is disposed in the same semiconductor substrate as an IGBT including an emitter having flowing therethrough the principal current and a sense emitter having flowing therethrough a sense current proportional to the principal current; the sense current; and the information, preliminarily stored in memory means, on the relationship among the semiconductor substrate temperature, the principal current and the sense currant.
    • 本发明的目的是提供一种电力转换器,其包括用于精确地检测IGBT的主电流的装置。 根据本发明的电力转换装置包括:主电流估计装置,用于通过使用以下方式估计主电流的温度测量装置的输出:其二极管设置在与包括流过其中的主电流的IGBT的IGBT相同的半导体衬底中 以及感测发射器,其通过与主电流成比例的感测电流流动; 感应电流; 以及预先存储在存储装置中的信息,关于半导体衬底温度,主电流和感应浓度范围之间的关系。
    • 85. 发明授权
    • Lateral insulated gate bipolar transistor
    • 横向绝缘栅双极晶体管
    • US5343052A
    • 1994-08-30
    • US917990
    • 1992-07-24
    • Tosifumi OohataMutsuhiro MoriNaoki Sakurai
    • Tosifumi OohataMutsuhiro MoriNaoki Sakurai
    • H01L29/78H01L29/06H01L29/40H01L29/417H01L29/739H01L21/76H01L21/425H01L27/38
    • H01L29/405H01L29/0696H01L29/41716H01L29/7393
    • A lateral insulated-gate bipolar transistor has a drift region having therein a base layer and a collector layer. An emitter layer is formed in the base layer. A gate electrode structure, comprising a control electrode and gate insulating layer, contacts the base layer, and also contacts the drift layer and the emitter layer. An emitter electrode contacts the emitter layer, and also the base layer, and a collector electrode contacts the collector layer. The emitter and collector electrodes are elongate and the ratio of their resistances per unit length is in the range of 0.5 to 2.0. This reduces the possibility of a localized high current density along the electrodes, thereby reducing the risk of latch-up due to parasitic thyristors. The collector and emitter electrodes may be of the same width and thickness, or of different widths and thicknesses, or may each have an auxiliary part (for example, in a multi-layer wiring arrangement), so that their resistances per unit length are in the desired range. A plurality of such transistors may be fabricated together in an array.
    • 横向绝缘栅双极晶体管具有其中具有基极层和集电极层的漂移区域。 在基层中形成发射极层。 包括控制电极和栅极绝缘层的栅电极结构接触基极层,并且还接触漂移层和发射极层。 发射极电极与发射极层接触,并且基极层也接触集电极电极。 发射极和集电极是细长的,其单位长度的电阻比在0.5至2.0的范围内。 这降低沿着电极的局部高电流密度的可能性,从而降低由寄生晶闸管引起的闩锁的风险。 集电极和发射极可以具有相同的宽度和厚度,或者具有不同的宽度和厚度,或者可以各自具有辅助部分(例如,在多层布线布置中),使得其每单位长度的电阻为 所需范围。 多个这样的晶体管可以一起制成阵列。
    • 88. 发明授权
    • Semiconductor device and power converter
    • 半导体器件和电源转换器
    • US09349847B2
    • 2016-05-24
    • US14364959
    • 2011-12-15
    • Takayuki HashimotoMutsuhiro Mori
    • Takayuki HashimotoMutsuhiro Mori
    • H01L29/66H01L21/332H01L29/739H01L29/861H01L29/08H01L29/10H01L27/07H01L29/88H02M7/537
    • H01L29/7397H01L27/0727H01L29/0834H01L29/1095H01L29/7395H01L29/861H01L29/88H02M7/537
    • A semiconductor device of this invention (an IGBT with a built-in diode) includes: an n−-type drift layer 1; a p-type channel region 2 that is arranged in contact with the surface side of this n−-type drift layer 1; a gate electrode 5 that is provided in a trench T provided so as to penetrate this p-type channel region 2 and reach to the n−-type drift layer 1 through a gate insulating film 3; an n-type source region 4 that is provided so as to contact the trench T on the surface side of the p-type channel region 2; a high-concentration n-type region 6 that is arranged in contact with the back side of the n−-type drift layer 1; and a high-concentration p-type region 7 that is arranged in contact with the back side of this high-concentration n-type region 6; in which a junction of the high-concentration n-type region 6 and the high-concentration p-type region 7 is a tunnel junction. According to this semiconductor device, it is possible to form the IGBT and the diode on a single chip. Moreover, it is possible to avoid problems of “snap back” and “current concentration.”
    • 本发明的半导体器件(具有内置二极管的IGBT)包括:n型漂移层1; 与该n型漂移层1的表面侧接触的p型沟道区域2; 设置在沟槽T中以设置成穿过该p型沟道区域2并通过栅极绝缘膜3到达n型漂移层1的栅电极5; n型源极区域4,其设置成与p型沟道区域2的表面侧的沟槽T接触; 配置成与n型漂移层1的背面接触的高浓度n型区域6; 以及与该高浓度n型区域6的背面接触的高浓度p型区域7; 其中高浓度n型区域6和高浓度p型区域7的结是隧道结。 根据该半导体器件,可以在单个芯片上形成IGBT和二极管。 此外,可以避免“回弹”和“当前集中”的问题。
    • 90. 发明申请
    • Semiconductor Device and Electric Power Conversion System Using The Same
    • 半导体器件及其使用的电力转换系统
    • US20130020634A1
    • 2013-01-24
    • US13553431
    • 2012-07-19
    • So WATANABEMasaki ShiraishiHiroshi SuzukiMutsuhiro Mori
    • So WATANABEMasaki ShiraishiHiroshi SuzukiMutsuhiro Mori
    • H01L29/78
    • H01L29/7397H01L29/0696H01L29/407H01L29/66348
    • A semiconductor device includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type on the first semiconductor layer; trenches in the first semiconductor layer; a semiconductor protruding part on the first semiconductor layer; a third semiconductor layer on the semiconductor protruding part; a fourth semiconductor layer on the third semiconductor layer; a gate insulating layer disposed along the trench; a first interlayer insulating layer disposed along the trench; a first conductive layer facing to the fourth semiconductor layer; a second conductive layer on the first interlayer insulating layer; a second interlayer insulating layer covering the second conductive layer; a third conductive layer on the third semiconductor layer and fourth semiconductor layer; a contacting part connecting the third conductive layer and third semiconductor layer; and a fourth conductive layer formed on the second semiconductor layer.
    • 半导体器件包括:第一导电类型的第一半导体层; 在第一半导体层上的第二导电类型的第二半导体层; 第一半导体层中的沟槽; 在所述第一半导体层上的半导体突出部; 半导体突出部分上的第三半导体层; 第三半导体层上的第四半导体层; 栅极绝缘层,沿着沟槽设置; 沿沟槽设置的第一层间绝缘层; 面向第四半导体层的第一导电层; 在第一层间绝缘层上的第二导电层; 覆盖所述第二导电层的第二层间绝缘层; 在第三半导体层和第四半导体层上的第三导电层; 连接第三导电层和第三半导体层的接触部分; 以及形成在所述第二半导体层上的第四导电层。