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1. 发明申请

US20210313493A1 LIGHT-EMITTING DEVICE 有权
公开(公告)号：US20210313493A1
公开(公告)日：2021-10-07
申请号：US17101050
申请日：2020-11-23
申请人： Everlight Electronics Co., Ltd.
发明人： Hung-Hsiang YEH , Robert YEH , Tsung-Yuan CHEN , Bo-Yu CHEN
IPC分类号： H01L33/50 , H01L25/075 , H01L33/46 , H01L33/58 , H01L33/60 , H01L33/62
摘要： A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface. The covering member comprises a light reflective material and covers at least the first side surface of the first light transparent member and at least the second side surface of the second light transparent member.

2. 发明授权

US10352542B2 LED lamp and component, heat dissipating base and LED wireless dimming system thereof 有权
公开(公告)号：US10352542B2
公开(公告)日：2019-07-16
申请号：US15869022
申请日：2018-01-11
申请人： Everlight Electronics Co., Ltd.
发明人： Ming-Chieh Tsai , Hung-Yen Su , Chi-Ming Chen
IPC分类号： F21V23/00 , F21V29/75 , F21V3/00 , F21V29/81 , F21V23/04 , F21V29/71 , F21V29/76 , H05B37/02 , F21Y115/10 , H05B33/08 , F21Y105/10
摘要： An LED lamp and a component, a heat dissipating base and an LED wireless dimming system thereof are provided. The LED lamp component comprises a heat dissipating base, a light emitting module and a lens, the heat dissipating base has a bearing surface and a back surface opposite to the bearing surface, the bearing surface is provided with a first recessed section therein, the back surface is provided with heat dissipating structures; the heat dissipating base further comprises a first joint portion; the light emitting module is disposed in the first recessed section, and the lens covering the light emitting module.

3. 发明申请

US20180224105A1 LED LAMP AND COMPONENT, HEAT DISSIPATING BASE AND LED WIRELESS DIMMING SYSTEM THEREOF 审中-公开
公开(公告)号：US20180224105A1
公开(公告)日：2018-08-09
申请号：US15869022
申请日：2018-01-11
申请人： Everlight Electronics Co., Ltd.
发明人： MING-CHIEH TSAI , HUNG-YEN SU , CHI-MING CHEN
IPC分类号： F21V23/00 , F21V29/75 , F21V29/81 , F21V3/00
CPC分类号： F21V23/005 , F21V3/00 , F21V23/0435 , F21V29/713 , F21V29/75 , F21V29/763 , F21V29/81 , F21Y2105/10 , F21Y2115/10 , H05B33/0809 , H05B33/0845 , H05B37/0272
摘要： An LED lamp and a component, a heat dissipating base and an LED wireless dimming system thereof are provided. The LED lamp component comprises a heat dissipating base, a light emitting module and a lens, the heat dissipating base has a bearing surface and a back surface opposite to the bearing surface, the bearing surface is provided with a first recessed section therein, the back surface is provided with heat dissipating structures; the heat dissipating base further comprises a first joint portion; the light emitting module is disposed in the first recessed section, and the lens covering the light emitting module.

4. 发明授权

US09691960B1 Carrier, carrier leadframe, and light emitting device and method for manufacturing same 有权
公开(公告)号：US09691960B1
公开(公告)日：2017-06-27
申请号：US15441582
申请日：2017-02-24
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/10 , H01L33/62 , H01L33/48 , H01L33/60 , H01L33/38
CPC分类号： H01L33/62 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

5. 发明授权

US09542868B2 Light emitting device, surface mounted device-type light emitting device, and display device 有权
标题翻译：发光器件，表面安装器件型发光器件和显示器件
公开(公告)号：US09542868B2
公开(公告)日：2017-01-10
申请号：US13664709
申请日：2012-10-31
申请人： Jung Chiuan Lin
发明人： Jung Chiuan Lin
IPC分类号： G09F13/04 , F21Y105/00 , F21Y101/02 , F21V19/00 , F21Y101/00
CPC分类号： G09F13/04 , F21V19/0015 , F21Y2101/00 , F21Y2105/00 , F21Y2115/10 , F21Y2115/15 , F21Y2115/30
摘要： Embodiments of a light emitting device, a surface mounted device-type light emitting device and a display device are provided. In one aspect, a light emitting device may include a main body and a light source. The main body may include a base and a number of terminals. The base may have a support surface. Each of the terminals may respectively have a welding portion such that the welding portions of the terminals form a connection surface with a first angle between the support surface and the connection surface. The first angle may be between 0 degree and 90 degrees. The light source may be disposed on the support surface and electrically connected to one or more of the terminals.
摘要翻译：提供了发光器件，表面安装器件型发光器件和显示器件的实施例。一方面，发光装置可以包括主体和光源。主体可以包括基座和多个端子。基座可以具有支撑表面。每个端子可以分别具有焊接部分，使得端子的焊接部分在支撑表面和连接表面之间形成具有第一角度的连接表面。第一角度可以在0度和90度之间。光源可以设置在支撑表面上并电连接到一个或多个端子。

6. 发明授权

US09391251B2 Carrier structure and lighting device 有权
标题翻译：载体结构和照明装置
公开(公告)号：US09391251B2
公开(公告)日：2016-07-12
申请号：US14273933
申请日：2014-05-09
申请人： Everlight Electronics Co., Ltd.
发明人： Yung Chieh Chen , Jung Chiuan Lin
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing defines a concavity. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concavity of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.
摘要翻译：描述了载体结构和照明装置的各种示例。构造成携带LED的载体结构包括壳体和引线框架。外壳定义一个凹面。引线框架包括具有主板通孔的主板部分，从主板部分延伸到主板通孔中的至少两个插入部分和被配置为电耦合到LED的两个电极部分。壳体设置在至少两个插入部分上，其中至少两个插入部分插入到壳体中。壳体的凹面暴露电极部分。每个电极部分具有延伸到壳体外部的相应突起子部分。此外，还提供了利用载体结构的照明装置。

7. 发明授权

US09326350B2 Light-emitting device with multi-color temperature and multi-loop configuration 有权
标题翻译：具有多色温度和多回路配置的发光装置
公开(公告)号：US09326350B2
公开(公告)日：2016-04-26
申请号：US13761550
申请日：2013-02-07
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-kai Chang , Shih-Hua Pan
IPC分类号： H01J1/62 , H01J63/04 , H05B33/14 , H01L25/075 , H01L33/50
CPC分类号： H01L25/0753 , H01L33/502 , H01L33/504 , H01L33/505 , H01L33/62 , H01L2224/48137 , H01L2933/0091 , H05B33/14
摘要： A light-emitting device with multi-color temperature and multi-loop configuration is provided. The light-emitting device comprises a substrate, multiple light sources disposed on the substrate, and a light-emitting unit covering the light sources and at least a portion of the substrate. Each of the light sources is configured to emit a respective primary radiation. The light-emitting unit comprises multiple wavelength conversion components, each of which may include a respective fluorescent material. Each wavelength conversion component emits a respective converted radiation, upon absorbing a portion of the primary radiation from one or more of the light sources, and mixes the respective converted radiation with a portion of the primary radiation from the one or more of the light sources that is not absorbed to form a respective mixed radiation. Each wavelength conversion component is adjacent to, and at least partially contacts, at least another one of the wavelength conversion components.
摘要翻译：提供具有多色温度和多环配置的发光装置。发光装置包括基板，设置在基板上的多个光源和覆盖光源和基板的至少一部分的发光单元。每个光源被配置为发射相应的一次辐射。发光单元包括多个波长转换组件，每个组件可以包括各自的荧光材料。每个波长转换组件在吸收来自一个或多个光源的主要辐射的一部分时发射相应的转换辐射，并且将相应的转换辐射与来自一个或多个光源的一次辐射的一部分混合，不被吸收以形成相应的混合辐射。每个波长转换组件与至少另一个波长转换组件相邻并且至少部分地接触。

8. 发明授权

US09210767B2 Lighting apparatus and light emitting diode device thereof 有权
标题翻译：照明装置及其发光二极管装置
公开(公告)号：US09210767B2
公开(公告)日：2015-12-08
申请号：US13720821
申请日：2012-12-19
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-kai Chang , Shun-Chang Li , Cheng Hsi Hung
IPC分类号： H05B37/00 , H05B37/02 , H05B33/08
CPC分类号： H05B37/02 , H05B33/083 , H05B33/0872
摘要： A lighting emitting diode (LED) device includes a first adjust module and a second adjust module. The first adjust module includes at least one first LED and has a first internal impedance having a first characteristic curve. A range covered by the first characteristic curve includes a first incomplete conduction region and a first conduction region. As the current increases from zero value and up, the first internal impedance decreases exponentially in the first incomplete conduction region, is approximately linear in the first conduction region. The second adjust module includes an impedance-providing component and an electronic component coupled in series. The second adjust module is coupled in parallel with the first adjust module. The second adjust module has a second internal impedance having a second characteristic curve. The first characteristic curve and the second characteristic curve match one another.
摘要翻译：发光二极管（LED）装置包括第一调节模块和第二调节模块。第一调节模块包括至少一个第一LED并且具有第一内部阻抗，该第一内部阻抗具有第一特性曲线。由第一特性曲线覆盖的范围包括第一不完全传导区域和第一导电区域。随着电流从零值和上升增加，第一内部阻抗在第一不完全导通区域中呈指数下降，在第一导电区域中几乎是线性的。第二调整模块包括串联耦合的阻抗提供部件和电子部件。第二调节模块与第一调节模块并联连接。第二调节模块具有第二内部阻抗，具有第二特性曲线。第一特征曲线和第二特征曲线彼此匹配。

9. 发明授权

US08987770B2 Structure of light emitting diode and method to assemble thereof 有权
标题翻译：发光二极管的结构及其组装方法
公开(公告)号：US08987770B2
公开(公告)日：2015-03-24
申请号：US13095059
申请日：2011-04-27
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/36 , H05K3/32 , H01L33/62 , H05K3/20
CPC分类号： H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
摘要： A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.
摘要翻译：提供发光二极管的结构。在一个方面，发光二极管结构包括发光二极管，导电框架和基板。导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。基板具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

10. 发明授权

US08860300B2 Color-temperature-tunable device 有权
标题翻译：色温可调装置
公开(公告)号：US08860300B2
公开(公告)日：2014-10-14
申请号：US13928481
申请日：2013-06-27
申请人： Everlight Electronics Co., Ltd.
发明人： Yen Wen Chen , Shih Chen Shi , Hsi-Chuan Hsu
IPC分类号： H05B33/00 , H05B33/08 , G09G3/34 , H01L25/075 , H01L33/50
CPC分类号： H05B33/0857 , G09G3/3406 , G09G2320/06 , H01L25/0753 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： A method of operating a color-temperature-tunable device is described. The method drives a first light emitting diode (LED) chip with a first driving current from a first power source. The first LED chip is configured to emit a first light having a first peak wavelength. The method also drives a second LED chip with a second driving current from a second power source. The second LED chip is configured to emit a second light having a second peak wavelength. The method further maintains a total driving current, which includes the first driving current and the second driving current, approximately constant. The second peak wavelength is different from the first peak wavelength.
摘要翻译：描述了操作色温可调器件的方法。该方法利用来自第一电源的第一驱动电流驱动第一发光二极管（LED）芯片。第一LED芯片被配置为发射具有第一峰值波长的第一光。该方法还驱动具有来自第二电源的第二驱动电流的第二LED芯片。第二LED芯片被配置为发射具有第二峰值波长的第二光。该方法还保持包括第一驱动电流和第二驱动电流的总驱动电流近似恒定。第二峰值波长与第一峰值波长不同。

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